JPH03201595A - Hybrid integrated circuit board containing case - Google Patents

Abstract

PURPOSE:To prevent bubbles, to eliminate use of a defoaming unit and to delete a working step by forming resin pouring hole at the opposed surface of a containing case opening or near the opposed surface. CONSTITUTION:A hybrid integrated circuit board is inserted from the opening 24 of a containing case 20 into the inside 20a of the case 20 with the end 26a of the board disposed at a lower side. Liquid resin 21 is poured inside the case 20 from the bottom 20b in the direction of an arrow A on the drawing via a pouring through-hole 22 formed at the center of the bottom 20b of the case 20. The resin 21 is continuously poured to disperse the air inside 20 of the case through the opening 24 of the case 20, a hybrid integrated circuit board 26 is impregnated with the resin 21, and filled to the vicinity of the opening 24 of the case 20. Then, a sealing film 23 made of polyamide or the like is brought into contact with the bottom 20b of the case 20 to close the hole 22 to be adhesively secured with adhesive 32.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) This invention provides a method for storing a hybrid integrated circuit board on which electronic components are mounted in a storage case, and then injecting resin into the storage case to remove the board. Regarding storage cases for hybrid integrated circuit boards that are configured to be fixed, more specifically, storage cases that store boards (prior art), and circuit functions of hybrid integrated circuit boards on which electronic components are mounted are protected against humidity and physical In order to protect it from external forces, it is common practice to coat it with resin or the like.

Methods of coating with resin include a resin dipping method in which the substrate is impregnated with liquid resin and then pulled up, and a coating is formed by heating the substrate and then passing it through the residual fine powder resin. Powder resin coating methods and the like are known.

In addition, many hybrid integrated circuit boards that are incorporated into industrial equipment require a sufficiently thick resin coating and require products with certain external dimensions, so it is necessary to use The substrate is housed in a case.

Moreover, it is configured to harden by injecting liquid resin into the inside of the storage case.

A conventional structure for protecting a hybrid integrated circuit board using a resin case constructed as described above is shown in FIG.

A conductor pattern, passive elements, a protective glass (not shown), and an electrode land 6 are formed on at least one surface of a ceramic substrate 9 made of a material such as alumina by a thick film screen printing method.

Further, on the ceramic substrate 9, electronic components 4,4'...
is mounted, and the tips 5a of the frame leads 5 are soldered to the electrode lands 6 provided at the same pitch on the upper end with solder 7, and the 7 frame leads 5 are led out from the hybrid integrated circuit board 3. is formed.

The hybrid integrated circuit board 3 is molded into a predetermined shape using resin or the like, and is further housed in the storage case 1 inside 1a through the opening 10 of the storage case 1 having an opening IO at the top.

Inside la of the storage case I in which the board 3 is stored,
A liquid thermosetting resin 2 is injected from above the opening 10 of the storage case 1, and then heated for a predetermined period of time in a heating furnace (not shown), so that the board 3 on which the hybrid integrated circuit is mounted is placed in the storage case 1. It is configured to be fixed inside.

(Problems to be Solved by the Invention) However, in the hybrid integrated circuit component 11 configured in this way, the resin 2 is placed in the opening IO of the storage case l.
When injecting into the inside 1a of the storage case l from above, it is necessary to
When the resin 2 is injected, air is drawn in between the electronic components 4, 4', etc., and between the electronic components 4, 4', and the four lower corners of the inside 1a of the storage case 1. .8'... There was a problem in that it would be stuck and remain.

In particular, as the resin 2 thermally hardens, internal stress is generated between the bubbles 8,8'... and the resin 2, which poses a problem in that the circuit function of the hybrid integrated circuit component 11 may be impaired. .

In addition, in order to defoam the air bubbles 8,8',... Device(
By installing the hybrid integrated circuit component 11 in the vacuum container, the air inside the vacuum container is suctioned by a suction pump, and the pressure inside the vacuum container is reduced, thereby defoaming. However, this method requires a large-scale device and the work process is complicated.

The present invention has been made in view of the above-mentioned circumstances, and by preventing air bubbles from being generated when a hybrid integrated circuit board is stored in a storage case and resin is injected and filled into the inside of the storage case, The present invention provides a storage case for a hybrid integrated circuit board that is configured to eliminate the need for a large-scale defoaming device and reduce work steps.

(Means for Solving the Problems) In order to achieve the above object, the hybrid integrated circuit board storage case of the present invention has an opening formed on at least one side, and a board on which a hybrid integrated circuit is mounted. In a hybrid integrated circuit board storage case configured to be fixed by resin injection, a resin injection hole is formed on a surface opposite to the storage case opening or a surface in the vicinity of the opposite surface.

(Function) This invention provides a resin injection hole on the surface opposite or near the opposite surface of the opening of the storage case in which the hybrid integrated circuit board is stored, and further installs the storage case so that the opening faces upward. Since the resin is injected through the injection hole, the air inside the storage case is dissipated from the upper opening, and air bubbles are trapped inside the storage case at the four lower corners, between electronic components mounted on the board, and inside the storage case. It is possible to eliminate the risk of the remaining information between the 7th frame lead and the 7th frame lead.

Further, since no air bubbles remain, defoaming is not required, and it becomes unnecessary to use a large-scale defoaming device.

Further, since it is possible to prevent internal stress from occurring between the bubbles and the resin when the resin is thermally cured, it is possible to eliminate the possibility that the circuit function of the hybrid integrated circuit component will be impaired.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective sectional view showing an embodiment of the hybrid integrated circuit board storage case of the present invention, FIGS. 2(a) to (C) are perspective views for explaining the assembly work of the same embodiment, and FIG. 3 1 is a perspective view showing another embodiment of the present invention.

The storage case 20 made of resin or the like has an upper opening 24.
and a bottom surface 2 on the lower side facing the opening 24.
0b, and a through injection hole 22 in the center of the bottom surface 20b.
is molded.

On the hybrid integrated circuit board 26 made of alumina or the like, conductor patterns 28, 28', printed resistors (not shown), etc. are formed by thick film screen printing. is an electronic component 27.27゛・
・is mounted and fixed by solder.

Electrode lands 29 are formed at a constant pitch near the upper side of the hybrid integrated circuit board 26, and further, the electrode lands 29 and 7 frame leads 31 are soldered with solder 30, and frame leads 31 are led out. .

The hybrid integrated circuit board is inserted from the opening 24 of the storage case 20 into the inside 2 of the storage case 20 with the board tip 26a facing downward.
It is inserted in 0a.

Liquid resin 21 is injected from the bottom 20b into the inner side 20a of the storage case 20 in the direction of arrow A in the figure through a through injection hole 22 formed in the center of the bottom 20b of the storage case 20.

By continuously injecting the resin 21, the air inside the storage case 20a is gradually dissipated from the opening 24 of the storage case 20, and the hybrid integrated circuit board 26 is impregnated with the resin 21. is filled up to the vicinity of the opening 24 of the storage case 20.

Next, a sealing film 23 made of polyamide or the like is brought into contact with the bottom surface 20b of the storage case 20 and fixed by adhesive 32 so as to close the injection hole 22.

Manufacturing of the hybrid integrated circuit component 25 is completed by thermally curing the resin configured as described above in a heating furnace or the like.

As described above, the liquid resin 21 flows into the storage case 20 through the injection hole 22 formed on the bottom surface 20b of the storage case 20.
By injecting the liquid into the inner side 20a, there is no possibility that air bubbles will form between the four lower corners of the inner side 20a of the storage case 20, the electronic components 27, 27', etc.

In addition, there is no need to use a defoaming device to defoam the air bubbles, and since no internal stress is generated between the air bubbles and the resin when the resin is thermally cured, mounting on the hybrid integrated circuit board 26 is eliminated. It was possible to eliminate the risk of damage to the soldered parts between the electronic component 27 and the conductor pattern 28 formed on the surface of the board 26.

Next, a second embodiment of the present invention will be described with reference to FIG.

The storage case 35 has an opening 24, and an injection hole 36 is molded near the lower right end of the entire surface 35b of the storage case 35.

A hybrid integrated circuit board 26 is installed inside 35a of the storage case 35.
is stored.

Next, the liquid resin 21 is injected from the injection hole 36 into the inner side 3 of the storage case 35 from the front direction in the direction of arrow B in the figure.
5a.

By injecting the resin 21 up to the vicinity of the opening 24 of the storage case 35, the hybrid integrated circuit board 26 is filled without entraining air bubbles.

A sealing film 37 made of polyamide or the like is adhered to the front surface 35b of the storage case using an adhesive 32 to close the injection hole 36.

Thereafter, the resin 21 is thermally cured to complete the production of the hybrid integrated circuit component 25a.

Note that the number of injection holes molded into the storage case is not limited to one, and may be plural, as long as they are formed at least near the lower end of the bottom surface or the surface near the bottom surface of the storage case.

Further, the storage case is not limited to one made of resin, and may be made of extrusion molded aluminum, for example. In this case, the hybrid integrated circuit to be stored is protected from noise caused by electromagnetic interference. can be protected.

Further, the present invention is not limited to the single line type in which the frame leads are led out from one side end of the hybrid integrated circuit board, and a dual line type in which the frame leads are led out from both opposite ends may be stored in the storage case.

Further, the board stored in the storage case is not limited to a hybrid integrated circuit board made of alumina or the like, but may also be a copper-clad board made of glass epoxy or the like.

In addition, for example, on the opposite side of the adhesive surface of the above sealing film,
By printing the company name, product name, model number, etc. in advance, it is possible to omit the work of stamping these on the main body of the storage case for the hybrid integrated circuit component.

(Effects of the Invention) Since the hybrid integrated circuit board storage case of the present invention is configured as described above, it has the following effects.

■Injection holes for liquid resin are formed near the lower end of the bottom surface or the surface near the bottom of the storage case that houses the hybrid integrated circuit board, and in order to inject the resin from the injection holes, There is no risk of air bubbles remaining between the electronic components mounted on the hybrid integrated circuit board, between the board and the 7-lem leads, etc., and internal stress that occurs between the air bubbles and the resin when the resin is thermoset is eliminated. First, it has an excellent effect in that the electronic components and the soldered parts of the conductor pattern of the board are not damaged, and the reliability of the hybrid integrated circuit component can be maintained and improved.

■When injecting the resin, there is no risk of air bubbles remaining, so there is no need for a large-scale defoaming device to remove the air bubbles.
This has excellent effects in that complicated work can be eliminated and production costs can be reduced.

Part 1 figure

[Brief explanation of drawings]

Fig. 1 is a perspective sectional view showing an embodiment of the hybrid integrated circuit board storage case of the present invention, and Fig. 2 (a) to (c) are perspective views for explaining the assembly work of the hybrid integrated circuit board storage case. 3 is a perspective view showing another embodiment of the hybrid integrated circuit board storage case, and FIG. 4 is a sectional view showing a conventional hybrid integrated circuit board storage case. 20...Storage case, 20a...Inside, 20b...Bottom surface, 21...Resin, 22...Injection hole, 23...Seal film, 24...
...Opening, 25...Hybrid integrated circuit component, 24 (opening)

Claims (1)

[Claims] (1) In a hybrid integrated circuit board storage case that has an opening formed on at least one side and is configured to fix a board on which a hybrid integrated circuit is mounted by resin injection, the surface opposite to the storage case opening or the A hybrid integrated circuit board storage case characterized by having a resin injection hole formed on a surface near the opposing surface.