JPH0320097A - Manufacture of circuit substrate - Google Patents
Manufacture of circuit substrateInfo
- Publication number
- JPH0320097A JPH0320097A JP15543689A JP15543689A JPH0320097A JP H0320097 A JPH0320097 A JP H0320097A JP 15543689 A JP15543689 A JP 15543689A JP 15543689 A JP15543689 A JP 15543689A JP H0320097 A JPH0320097 A JP H0320097A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- guide hole
- mounting
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 9
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、回路基板の製作方法に関係し、特に面実装用
電子部品をプリント基板に装着する方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a circuit board, and more particularly to a method of mounting electronic components for surface mounting on a printed circuit board.
従来の技術
昨今、高密度実装の要請の下、表面実装方式による回路
基板の製作方法が注目されるとともにそれに適した表面
実装用電子部品が開発されている。BACKGROUND OF THE INVENTION Recently, due to the demand for high-density packaging, surface-mounting circuit board manufacturing methods are attracting attention, and surface-mounting electronic components suitable for this method have been developed.
ＩＣにおいても第４図に示す様な表面実装用のフラット
パッケージ型ＩＣが提案されている。Regarding ICs, a flat package type IC for surface mounting as shown in FIG. 4 has been proposed.
この様な表面実装用ＩＣを、プリント基板に装着して回
路基板を製作する方法としては、映像認識による自動搭
載法が一般に使われている。An automatic mounting method using image recognition is generally used to manufacture a circuit board by mounting such a surface-mounted IC on a printed circuit board.
すなわち、画像認識による自動搭載法は、プリント基板
側にあらかじめ認識マークを２ケ所設け、ビデオカメラ
によりこの認識マークとＩＣのリードを認識することに
より、ＩＣを位置補正しプリント基板に装着して所定の
回路基板を製作する方法である。In other words, the automatic mounting method using image recognition places recognition marks in two places on the printed circuit board in advance, and uses a video camera to recognize the recognition marks and IC leads to correct the position of the IC, mount it on the printed circuit board, and place it in the specified position. This is a method for manufacturing circuit boards.
発明が解決しようとする課題
以上の様な回路基板の製作方法では、装着位置の精度は
高く出るものの、画像認識装置や自動搭載装置等の装唐
費が高価で、そのため多品種少量生産での製造コストが
非常に高くつくという欠点がある。Problems to be Solved by the Invention Although the method for manufacturing circuit boards described above achieves high accuracy in mounting position, the cost of installing equipment such as image recognition equipment and automatic mounting equipment is high, and as a result, it is difficult to produce high-mix, low-volume production. The disadvantage is that manufacturing costs are very high.
課題を解決するための手段
本発明は、この様な問題を解決するためになされたもの
であって、その要旨とするところは、表面実装用部品の
裏面に少なくとも３つの突起を設けるとともに、前記表
面実装用部品を載置するプリント基板に前記突起と対応
するガイド穴を讃けて、前記表面実装用部品の突起を前
記プリント基板のガイド穴に嵌込んで装着するものであ
る。Means for Solving the Problems The present invention has been made to solve such problems, and its gist is that at least three protrusions are provided on the back surface of a surface mount component, and A guide hole corresponding to the protrusion is formed on a printed circuit board on which a surface mount component is placed, and the surface mount component is mounted by fitting the protrusion into the guide hole of the printed circuit board.
作用
本発明によれば、フラットパッケージの裏面の突起によ
りフラットパッケージがプリント基板に装着されるまで
は、フラットパッケージのリードが半田ペーストに触れ
ることがなく、又プリント基板に設けた穴がガイド穴と
なって極めてスムーズに装着できるものであるノ。According to the present invention, the leads of the flat package do not touch the solder paste until the flat package is attached to the printed circuit board due to the protrusion on the back surface of the flat package, and the holes provided in the printed circuit board do not function as guide holes. This makes it extremely easy to install.
実施例
以下に、本発明を実施例でもって図面とともに詳しく説
明する。EXAMPLES The present invention will be explained in detail below using examples and drawings.
第１図は、表面実装用ＩＣを示した図で、（ａ）は裏面
図、（ｂ）は側面図であって、表面実装用ＩＣの樹脂部
１の裏面に突起２が４個形成されている。FIG. 1 shows a surface-mount IC, in which (a) is a back view and (b) is a side view, in which four protrusions 2 are formed on the back surface of a resin part 1 of the surface-mount IC. ing.
ｔｌ．台）
第２図は、プリント基板４の断面図であって、第１図の
表面実装用ＩＣを搭載する位置で、その突起２に対応す
る位置にガイド穴５が形威されている。tl. 2 is a cross-sectional view of the printed circuit board 4, in which guide holes 5 are formed at positions corresponding to the protrusions 2 at the positions where the surface mount IC shown in FIG. 1 is mounted.
第３図は、表面実装用ＩＣをプリント基板に装着した場
合を示す断面図であって、突起２がガイド穴５に嵌込ま
れて位置決めされて固定し、図示しないがプリント回路
上に設けたランド上の半田ペーストに外部リード３が当
接して半田付けされている。FIG. 3 is a cross-sectional view showing a case where a surface mount IC is mounted on a printed circuit board, in which the protrusion 2 is fitted into the guide hole 5, positioned and fixed, and is mounted on the printed circuit (not shown). The external leads 3 are soldered in contact with the solder paste on the land.
以上の様な回路基板の製作方法によって、手作業で精度
よく表面実装用ＩＣをプリント基板に装着することがで
きる。By the method of manufacturing a circuit board as described above, it is possible to manually mount a surface mount IC on a printed circuit board with high accuracy.
この製作方法により、実装原価を従来に比べて数％程度
下げることができた。This manufacturing method made it possible to reduce mounting costs by several percent compared to conventional methods.
また、従来手付けによる実装方法で発生していたランド
の半田ペーストをひっかけてしまうミスやＩＣの逆搭載
等の問題が解消できた。In addition, the problems that occurred with the conventional manual mounting method, such as mistakes such as catching the solder paste on the land and mounting the IC upside down, were eliminated.
発明の効果
以上、説明した様に本発明の回路基板の製作方法は表面
実装用ＩＣに設けた突起とプリント基板に設けたガイド
穴を嵌合わせて装着するので、位置合わせが容易であり
従って映像認識による自動搭載方式の様に設備投資を必
要とせずに手付け作業で十分に精度のよい装着ができる
。また手付け方式でよく発生していたプリント基板に予
め用意したランド上の半田をひっかけるミスや、突起の
位置を非対象に配置することにより部品の逆搭載などの
問題も解決できるという極めて有利な発明である。Effects of the Invention As explained above, in the method of manufacturing a circuit board of the present invention, the protrusions provided on the surface mount IC are fitted with the guide holes provided on the printed circuit board. Unlike automatic mounting methods using recognition, it does not require capital investment and can be mounted with sufficient accuracy by hand. It is also an extremely advantageous invention that can solve the problems that often occur with manual mounting methods, such as the mistake of catching solder on a land prepared in advance on a printed circuit board, and the reverse mounting of parts by arranging the protrusions asymmetrically. It is.
第１図，第２図，第３図は本発明による回路基板の製作
方法を説明するための図であって、第１図（ａ）は表面
実装用ＩＣの裏面図、同図（ｂ）が側面る。
１・・・・・・表面実装用ＩＣ．２・・・・・・突起、
３・・・・・・外部リード、４・・・・・・プリント基
板、５・・・・・・ガイド穴。1, 2, and 3 are diagrams for explaining the method of manufacturing a circuit board according to the present invention, in which FIG. 1(a) is a back view of a surface mount IC, and FIG. 1(b) is on the side. 1...Surface mount IC. 2...protrusion,
3... External lead, 4... Printed circuit board, 5... Guide hole.
Claims (1)
るとともに、前記表面実装用部品を載置するプリント基
板に前記突起と対応するガイド穴を設けて、前記表面実
装用部品の突起を前記プリント基板のガイド穴に嵌込ん
で装着することを特徴とする回路基板の製作方法。At least three protrusions are provided on the back surface of the surface mount component, and guide holes corresponding to the protrusions are provided in the printed circuit board on which the surface mount component is placed, so that the protrusions of the surface mount component are aligned with the printed circuit board. A method of manufacturing a circuit board, which is characterized in that the circuit board is fitted by fitting into a guide hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15543689A JPH0320097A (en) | 1989-06-16 | 1989-06-16 | Manufacture of circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15543689A JPH0320097A (en) | 1989-06-16 | 1989-06-16 | Manufacture of circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320097A true JPH0320097A (en) | 1991-01-29 |
Family
ID=15605990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15543689A Pending JPH0320097A (en) | 1989-06-16 | 1989-06-16 | Manufacture of circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320097A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086364A (en) * | 2004-09-16 | 2006-03-30 | Tyco Electronics Amp Kk | Surface-mounting component |
-
1989
- 1989-06-16 JP JP15543689A patent/JPH0320097A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086364A (en) * | 2004-09-16 | 2006-03-30 | Tyco Electronics Amp Kk | Surface-mounting component |
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