JPH03198934A - Manufacturing device of metallic lead having bump - Google Patents
Manufacturing device of metallic lead having bumpInfo
- Publication number
- JPH03198934A JPH03198934A JP1337280A JP33728089A JPH03198934A JP H03198934 A JPH03198934 A JP H03198934A JP 1337280 A JP1337280 A JP 1337280A JP 33728089 A JP33728089 A JP 33728089A JP H03198934 A JPH03198934 A JP H03198934A
- Authority
- JP
- Japan
- Prior art keywords
- metallic lead
- bump
- metal lead
- width
- recessed part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 11
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 35
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、バンプを有する金属リードの製造装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an apparatus for manufacturing metal leads having bumps.
（従来の技ｊネ′Ｔ）
従来、金属リード１２の所定の位置にプレス加工により
バンプを有する金属リード１２を形成する製造装置は、
第３図、第４図に示すように、金属リード１２の所定の
位置に対応した凹部１４を有する型１１と、プレス面が
平面である型１３からなり、凹部１４の寸法は半導体Ｉ
Ｃチップの接続端子部の大きさに対応して設定され、凹
部１４の幅、すなわち金属リード１２の長手方向に対し
て直行する方向の幅は、金属リードの幅よりも狭（設定
されていた。(Conventional Technique) Conventionally, a manufacturing apparatus for forming a metal lead 12 having a bump at a predetermined position of the metal lead 12 by press working is as follows.
As shown in FIGS. 3 and 4, it consists of a mold 11 having a recess 14 corresponding to a predetermined position of the metal lead 12, and a mold 13 whose pressing surface is flat.
The width of the recess 14, that is, the width in the direction perpendicular to the longitudinal direction of the metal lead 12, is set in accordance with the size of the connection terminal part of the C chip. .
（発明が解決しようとする課題）
しかし、このようなバンプを有する金属リードの製造装
置においては、バンプを形成する際、凹部内の空気が抜
けず凹部内の空気の圧力が高まり。(Problems to be Solved by the Invention) However, in the manufacturing apparatus for metal leads having such bumps, when forming the bumps, the air in the recesses does not escape and the pressure of the air in the recesses increases.
バンプの高さ方向の形成が十分になされなかった。The bumps were not formed sufficiently in the height direction.
又、第５図、第６図のような空気抜孔を設けるにしても
、微細な加工を必要とし困難であった。Further, even if air vent holes as shown in FIGS. 5 and 6 were to be provided, fine machining was required and it was difficult.
そこで２本発明では、このような問題点を解決し、容易
に空気抜きができ、そのため、バンプの高さ方向の形成
が十分におこなえるバンプを有する金属リードの製造装
置を提供することを目的としている。Therefore, the object of the present invention is to solve these problems and provide an apparatus for manufacturing a metal lead having bumps that allows air to be removed easily and that allows for sufficient formation of bumps in the height direction. .
（課題が解決しようとする手段）
上記課題を解決するために１本発明のバンプを有する金
属リードの製造装置は、プレス面が平面である型と、金
属リードの所定の位置に対応した凹部を有する型からな
り、金属リードの長手方向に対して直行する方向の凹部
の幅を、金属リードの幅よりも広くシ、凹部によってで
きた型と金属リードの隙間を空気抜孔と成るようにした
。(Means for Solving the Problems) In order to solve the above problems, an apparatus for manufacturing metal leads having bumps according to the present invention includes a mold having a flat pressing surface and a recess corresponding to a predetermined position of the metal lead. The width of the recess in the direction perpendicular to the longitudinal direction of the metal lead is wider than the width of the metal lead, and the gap between the mold and the metal lead formed by the recess serves as an air vent hole.
（作用）
このようなハンプを有する金属リードの製造装置は、プ
レス加工によりハンプを形成する際に、凹部が金属リー
ドと型の間に隙間をつくり、この隙間から空気が抜けて
い（ため１バンブの形成が十分に行え２発明の目的を達
成できる。(Function) In a metal lead manufacturing apparatus having such a hump, when forming a hump by press working, the recess creates a gap between the metal lead and the mold, and air escapes from this gap (therefore, one bump can be sufficiently formed, and the second object of the invention can be achieved.
（実施例）
以下に本発明の実施例を図面に基づいて説明する金属リ
ードの製造装置の下型に金属リードをセットした状態を
示す平面図である。(Example) FIG. 1 is a plan view showing a state in which a metal lead is set in a lower die of a metal lead manufacturing apparatus, in which an example of the present invention will be described below based on the drawings.
バンプを有する金属リードの製造装置は、上型と下型と
からなり、上型はプレス面が平面であり。An apparatus for manufacturing a metal lead having bumps consists of an upper mold and a lower mold, and the upper mold has a flat pressing surface.
下型１は金属リード２の所定の位置に対応した凹部３を
有する。下型１の凹部３の形状は２円状をしている。The lower mold 1 has a recess 3 corresponding to a predetermined position of the metal lead 2. The shape of the recess 3 of the lower mold 1 is bicircular.
金属リード２の長手方向に対して直行する方向の凹部３
の幅は、凹部３に重なっている部分の金属リード２０幅
よりも広く設定しである。A recess 3 in a direction perpendicular to the longitudinal direction of the metal lead 2
The width of the metal lead 20 is set to be wider than the width of the metal lead 20 in the portion overlapping the recess 3.
このようなバンプを有する金属リードの製造装置を用い
てプレス成形する際、まず、金属リード２を所定の位置
にセットし、その後プレス加工を行い、バンプを形成す
る。When performing press molding using such a metal lead manufacturing apparatus having bumps, first, the metal lead 2 is set at a predetermined position, and then press working is performed to form bumps.
バンプが形成されるとき、凹部３内の空気は凹部３によ
ってできた金属リード２と下型１との隙間から抜出し、
ハンプの高さ方向の形成が容易になる。そのため、バン
プの形成が簡単なプレス工程を実現できるバンプを有す
る金属リードの製造装置を得ることができる。When a bump is formed, the air in the recess 3 is extracted from the gap between the metal lead 2 and the lower die 1 created by the recess 3.
It becomes easier to form the hump in the height direction. Therefore, it is possible to obtain an apparatus for manufacturing a metal lead having bumps that can realize a pressing process that allows easy formation of bumps.
ここで説明した上型、下型を逆に使用してもよい。The upper mold and lower mold described here may be used in reverse.
さらに、他の実施例としては、凹部の形状を第２図に示
すように、楕円、矩形等何でも良い。Furthermore, as another embodiment, the shape of the recess may be any shape such as an ellipse or a rectangle as shown in FIG.
（発明の効果）
本発明は以上説明したように、複数の凹部を設けた上型
または下型に、プレス加工前の金属リードをセットした
際に、金属リードの長手方向に対して直交する方向の凹
部の幅が、凹部に重なっている部分の金属リードの幅よ
りも広く設定したので、ハンプ形成時に空気抜きができ
るようになりバンプが容易に形成できるようになった。(Effects of the Invention) As explained above, the present invention provides that when a metal lead before press processing is set in an upper mold or a lower mold provided with a plurality of recesses, a direction perpendicular to the longitudinal direction of the metal lead is Since the width of the recessed portion is set wider than the width of the metal lead in the portion overlapping the recessed portion, air can be vented when forming the hump, making it easier to form the bump.
又、金型に特別な空気穴を設ける加工が不要となり、金
型の製作も簡単である。Furthermore, there is no need to create special air holes in the mold, and the mold can be manufactured easily.
第１図は本発明の一実施例を示す型に金属リードをセッ
トした平面図。
第２図は他の実施例を示す要部拡大図。
第３図、第４図は従来技術を示すそれぞれ側面図と、平
面図
第５図、第６図は従来の空気抜孔を示す型の断面図
■・・・下型
２・・・金属リード
３．３１，３２．３３・・・凹部
１１・・・下型
１２・・・金属リード
１３・・・上型
１４・・・凹部
１５．１６・・・空気抜孔FIG. 1 is a plan view showing a metal lead set in a mold showing an embodiment of the present invention. FIG. 2 is an enlarged view of main parts showing another embodiment. Figures 3 and 4 are side views showing the prior art, and plan views Figures 5 and 6 are cross-sectional views of the mold showing conventional air vent holes. .31, 32.33...Recess 11...Lower die 12...Metal lead 13...Upper die 14...Recess 15.16...Air vent hole
Claims (1)
装置において、プレス面が平面である型と、金属リード
の所定の位置に対応した凹部を有する型からなり、金属
リードの長手方向に対して直交する方向の前記凹部の幅
が、金属リードの幅よりも広いことを特徴とするバンプ
を有する金属リードの製造装置。(1) A device for forming bumps on metal leads by press processing, consisting of a mold with a flat pressing surface and a mold with a recess corresponding to a predetermined position of the metal lead, which is perpendicular to the longitudinal direction of the metal lead. A manufacturing apparatus for a metal lead having bumps, wherein the width of the recess in the direction of the bump is wider than the width of the metal lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1337280A JP2740314B2 (en) | 1989-12-26 | 1989-12-26 | Manufacturing apparatus for metal leads having bumps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1337280A JP2740314B2 (en) | 1989-12-26 | 1989-12-26 | Manufacturing apparatus for metal leads having bumps |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03198934A true JPH03198934A (en) | 1991-08-30 |
| JP2740314B2 JP2740314B2 (en) | 1998-04-15 |
Family
ID=18307126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1337280A Expired - Lifetime JP2740314B2 (en) | 1989-12-26 | 1989-12-26 | Manufacturing apparatus for metal leads having bumps |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2740314B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0730047A (en) * | 1993-07-13 | 1995-01-31 | Nec Corp | Lead frame of semiconductor device, and equipment and method for manufacturing same |
-
1989
- 1989-12-26 JP JP1337280A patent/JP2740314B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0730047A (en) * | 1993-07-13 | 1995-01-31 | Nec Corp | Lead frame of semiconductor device, and equipment and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2740314B2 (en) | 1998-04-15 |
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