JPH0319698B2 - - Google Patents

Info

Publication number
JPH0319698B2
JPH0319698B2 JP61294205A JP29420586A JPH0319698B2 JP H0319698 B2 JPH0319698 B2 JP H0319698B2 JP 61294205 A JP61294205 A JP 61294205A JP 29420586 A JP29420586 A JP 29420586A JP H0319698 B2 JPH0319698 B2 JP H0319698B2
Authority
JP
Japan
Prior art keywords
value
detecting
time
light
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61294205A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63147327A (ja
Inventor
Kentaro Nishioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP61294205A priority Critical patent/JPS63147327A/ja
Priority to KR1019870013426A priority patent/KR920000676B1/ko
Priority to US07/130,472 priority patent/US4767495A/en
Publication of JPS63147327A publication Critical patent/JPS63147327A/ja
Publication of JPH0319698B2 publication Critical patent/JPH0319698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P50/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Weting (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP61294205A 1986-12-10 1986-12-10 表面処理における処理終点検知方法 Granted JPS63147327A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP61294205A JPS63147327A (ja) 1986-12-10 1986-12-10 表面処理における処理終点検知方法
KR1019870013426A KR920000676B1 (ko) 1986-12-10 1987-11-27 표면층 제거처리에 있어서의 처리종점 검지방법
US07/130,472 US4767495A (en) 1986-12-10 1987-12-09 Method for detecting time for termination of surface layer removal processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61294205A JPS63147327A (ja) 1986-12-10 1986-12-10 表面処理における処理終点検知方法

Publications (2)

Publication Number Publication Date
JPS63147327A JPS63147327A (ja) 1988-06-20
JPH0319698B2 true JPH0319698B2 (cg-RX-API-DMAC10.html) 1991-03-15

Family

ID=17804681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61294205A Granted JPS63147327A (ja) 1986-12-10 1986-12-10 表面処理における処理終点検知方法

Country Status (3)

Country Link
US (1) US4767495A (cg-RX-API-DMAC10.html)
JP (1) JPS63147327A (cg-RX-API-DMAC10.html)
KR (1) KR920000676B1 (cg-RX-API-DMAC10.html)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4960495A (en) * 1987-06-26 1990-10-02 Mikakto Precision Engineering Research Institute Co., Ltd. Process for precise processing of workpiece using free radicals
JPH06103687B2 (ja) * 1988-08-12 1994-12-14 大日本スクリーン製造株式会社 回転式表面処理方法および回転式表面処理における処理終点検出方法、ならびに回転式表面処理装置
EP0396010A3 (en) * 1989-05-05 1991-03-27 Applied Materials, Inc. Method and apparatus for monitoring growth and etch rates of materials
FR2656465B1 (fr) * 1989-12-21 1992-05-07 France Etat Procede de mesure des dimensions d'un espaceur.
DE4016211A1 (de) * 1990-05-19 1991-11-21 Convac Gmbh Verfahren zur ueberwachung und steuerung eines aetzvorgangs und vorrichtung hierfuer
US5166525A (en) * 1991-02-11 1992-11-24 Xinix, Inc. Through the wafer optical transmission sensor
US5290383A (en) * 1991-03-24 1994-03-01 Tokyo Electron Limited Plasma-process system with improved end-point detecting scheme
GB2257507B (en) * 1991-06-26 1995-03-01 Digital Equipment Corp Semiconductor wafer processing with across-wafer critical dimension monitoring using optical endpoint detection
US5245794A (en) * 1992-04-09 1993-09-21 Advanced Micro Devices, Inc. Audio end point detector for chemical-mechanical polishing and method therefor
US5499733A (en) * 1992-09-17 1996-03-19 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US5891352A (en) 1993-09-16 1999-04-06 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US5392124A (en) * 1993-12-17 1995-02-21 International Business Machines Corporation Method and apparatus for real-time, in-situ endpoint detection and closed loop etch process control
US5458731A (en) * 1994-02-04 1995-10-17 Fujitsu Limited Method for fast and non-destructive examination of etched features
US5690784A (en) * 1994-06-20 1997-11-25 International Business Machines Corporation Ion milling end point detection method and apparatus
EP0735565B1 (en) * 1995-03-31 1999-06-02 International Business Machines Corporation Method and apparatus for monitoring the dry etching of a dielectric film to a given thickness
US6406641B1 (en) * 1997-06-17 2002-06-18 Luxtron Corporation Liquid etch endpoint detection and process metrology
TW492106B (en) * 2000-06-20 2002-06-21 Hitachi Ltd Inspection method for thickness of film to be processed using luminous beam-splitter and method of film processing
US6716362B1 (en) * 2000-10-24 2004-04-06 International Business Machines Corporation Method for thin film laser reflectance correlation for substrate etch endpoint
US6623331B2 (en) 2001-02-16 2003-09-23 Cabot Microelectronics Corporation Polishing disk with end-point detection port
US6903826B2 (en) * 2001-09-06 2005-06-07 Hitachi, Ltd. Method and apparatus for determining endpoint of semiconductor element fabricating process
JP2003100708A (ja) * 2001-09-27 2003-04-04 Mitsubishi Electric Corp 終点判別方法、半導体処理装置および半導体装置の製造方法
TW591202B (en) * 2001-10-26 2004-06-11 Hermosa Thin Film Co Ltd Dynamic film thickness control device/method and ITS coating method
US6716300B2 (en) * 2001-11-29 2004-04-06 Hitachi, Ltd. Emission spectroscopic processing apparatus
US6687014B2 (en) * 2002-01-16 2004-02-03 Infineon Technologies Ag Method for monitoring the rate of etching of a semiconductor
US20040040658A1 (en) * 2002-08-29 2004-03-04 Tatehito Usui Semiconductor fabricating apparatus and method and apparatus for determining state of semiconductor fabricating process
US6972848B2 (en) * 2003-03-04 2005-12-06 Hitach High-Technologies Corporation Semiconductor fabricating apparatus with function of determining etching processing state
US20050194095A1 (en) * 2004-03-02 2005-09-08 Tatehito Usui Semiconductor production apparatus
US20070209684A1 (en) * 2006-03-07 2007-09-13 Applied Materials, Inc. Copper deposition chamber having integrated bevel clean with edge bevel removal detection
JP5538255B2 (ja) * 2011-01-28 2014-07-02 株式会社ジャパンディスプレイ エッチング装置及びエッチング方法
JP5888111B2 (ja) * 2012-05-18 2016-03-16 株式会社島津製作所 エッチングモニタ装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4454001A (en) * 1982-08-27 1984-06-12 At&T Bell Laboratories Interferometric method and apparatus for measuring etch rate and fabricating devices
US4569717A (en) * 1983-05-24 1986-02-11 Dainippon Screen Mfg. Co., Ltd. Method of surface treatment
US4496425A (en) * 1984-01-30 1985-01-29 At&T Technologies, Inc. Technique for determining the end point of an etching process
JPS60192338A (ja) * 1984-03-13 1985-09-30 Dainichi Nippon Cables Ltd 終点検出方法
US4660979A (en) * 1984-08-17 1987-04-28 At&T Technologies, Inc. Method and apparatus for automatically measuring semiconductor etching process parameters

Also Published As

Publication number Publication date
JPS63147327A (ja) 1988-06-20
KR920000676B1 (ko) 1992-01-20
US4767495A (en) 1988-08-30
KR880008424A (ko) 1988-08-31

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