JPH03196605A - Chip coil - Google Patents

Abstract

PURPOSE:To increase the mounting density on a printed-circuit board by providing a vertical chip coil in which a vertical coil element is molded in insulating resin with its ends connected with the respective electrodes. CONSTITUTION:A vertical coil 1 is molded in insulating resin 2, and the ends of the coil are connected to the respective electrodes 3. The mold 4 and the upper ends of the electrodes 3 are covered with an insulating layer 4. The chip coil thus made has a small width, and the spacing between the electrodes is hard to shrink. Therefore, the mounting density on a printed-circuit board can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a chip coil that can be used in electrical circuits of electronic communication equipment such as television receivers, video and audio equipment.

BACKGROUND OF THE INVENTION As electronic components continue to become smaller, various types of components are being made into chips. Coils are no exception, but in conventional chip coils installed on printed circuit boards, as shown in Figure 3, the coil/L/11 is oblong in shape, and electrodes 1 are placed on both ends of the coil.
3 is molded with resin 12. This oblong chip coil is mounted using a mounting machine.

Problems to be Solved by the Invention However, with conventional horizontally elongated chip coils, there is a limit to the high-density mounting area.

The present invention has been made in consideration of the above-mentioned problems, and an object of the present invention is to provide a vertical chip coil that can increase the packaging density and allow a wide range of circuits to be incorporated into a printed circuit board.

Means for Solving the Problems In order to solve the above-mentioned problems, the chip coil of the present invention is provided by arranging the coils vertically, molding them with insulating resin, and pulling out one end of the coils laterally, respectively. It is connected to vertically arranged electrodes. Furthermore, it is natural that one end of the coil drawn out laterally is located above and the other end of the coil is located below, but the electrodes are set at a position where it is easy to work and are connected to one end of the coil and the other end of the coil. is shaped over the entire length in the vertical direction. Furthermore, in order to prevent short circuits due to contact between external parts between the electrodes, an insulating layer is formed on the upper end surface of the resin molded body so as to cover the molded portion and each electrode.

Function The chip coil of the present invention having the above configuration can reduce the distance between the electrodes on the printed circuit board to %~%, and the area occupied on the printed circuit board can be significantly reduced. can be made compact.

Furthermore, since the electrodes have a shape that allows them to be handled in the same way as conventional electrodes and have an insulated top surface, it is possible to prevent accidental short circuits between the electrodes.

EXAMPLE Hereinafter, a chip coil according to an example of the present invention will be described with reference to the drawings.

A coil 1 arranged vertically as shown in FIG. The molded part and each electric f! An insulating layer 4 is formed to cover the upper surface of the ji3 to constitute a chip coil. This chip coil has a narrow width, which increases the packaging density and makes it difficult to shorten the distance between the electrodes 3.3.

FIG. 1B shows a second embodiment, in which a vertically arranged coil 1 is molded with an insulating resin 2, one end of the coil 1 is located upward, and the other end of the coil 1 is molded with an insulating resin 2. The ends are located below, and electrodes 3 connected to one end and the other end of this coil are formed over the entire length in the vertical direction, and a mold part and each electrode 3 are formed on the upper end surface of the molded body of the resin 2.
An insulating layer 4 is formed so as to cover the upper surface part. With this configuration, the electrode 3 can be constructed with a large area, so that reliable soldering is possible.

In the third embodiment shown in FIG. 2, a vertically arranged coil 1 is molded with an insulating resin 2, and one end and the other end of the coil 1 are both positioned below. ,
An electrode 3 is connected to the other end, and an insulating layer 4 is formed on the upper end surface of the molded body of the resin 2 so as to cover the mold part and the upper surface of each electrode 3.

In this way, the present invention can be practiced without particularly specifying the direction in which the terminals of the coil 1 are drawn out. In addition, Figures 1 and 2
Regarding the shape in the figure, it is a cylinder.

It may also be a prism etc.

Effects of the Invention As is clear from the above description of the embodiments, according to the present invention, coils are arranged vertically and molded with insulating resin, and electrodes are connected to one end and the other end of the coil. By using a double-sided chip coil, it is possible to increase the mounting density on a sibling board with a small width in the p1 lateral direction, and therefore the density of the circuit configuration can be increased.

Further, according to the present invention, when the electrodes are formed on the upper and lower sides and over the entire length, by forming an insulating layer on the upper end surface of the resin molded body so as to cover the molded part and each electrode, the gap between the electrodes can be improved. Careless short circuits can be prevented.

[Brief explanation of drawings]

FIGS. 1a and 1b respectively show the first embodiment of the present invention. FIG. 2 is a sectional view of a chip coil according to a second embodiment, FIG. 2 is a sectional view of a third embodiment, and FIG. 3 is a sectional view of a conventional chip coil. 1... Coil, 2... Insulating resin, 3.
...Electrode, 4...Insulating resin on the upper end surface of the electrode.

Claims (1)

[Claims] A chip coil in which the coils are arranged vertically so that both ends of the coil are in the vertical direction, molded with insulating resin, and both terminals of the front coil are pulled out laterally separately to form respective electrodes on the left and right sides. .