JP2536991Y2 - Chip coil - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application field] In the present invention, a winding lead terminal of a coil element mounted on a base is wound around and connected to a terminal provided on the base. In addition, the present invention relates to a surface mount type chip coil which is electrically connected to the terminal when the terminal comes into contact with a PC board land.

[Conventional technology]

Conventionally, such a chip coil is configured, for example, as shown in FIG.

That is, in FIG. 8, a chip coil 1 is placed on a substantially rectangular parallelepiped base 2 formed of resin, for example, a drum core,
It is configured by mounting a coil element 3 including a cap core, a shield case, a variable capacity screw member, and the like.

Three terminals 4 are provided on one side of the base 2, and two terminals 4 are provided on the other side.
The terminals 5 are juxtaposed so as to protrude sideways. A winding lead terminal of the coil element 3 is wound near the base of an end protruding from the side surface of the base of each of the terminals 4 and 5, and connected by soldering or the like.

Of the terminals 4 and 5, the terminals 4a and 4c on both sides of the terminal 4 and the terminals 5a and 5
b (not shown) has an inner end exposed to a recess (not shown) for receiving a chip capacitor provided on the upper surface of the base 2, and when the chip capacitor is mounted in the recess. Further, a contact portion that contacts the terminal portion of the chip capacitor is formed.

Further, among the terminals 4, an intermediate terminal 4 b located at the center when a tap is provided in the chip coil extends horizontally in the base 2 and is fixed.

[Problems to be solved by the invention]

In the chip coil 1 having such a configuration, each terminal
4 and 5 are inserted into a molding die of the base 2 while being integrally held by one support member, and are integrally formed with the base 2 by so-called insert molding. The terminals 4a and 4c and the terminals 5a and 5b on both sides of the terminal 4 of the terminals 4 and 5 are the contact portions exposed in the recessed portions of the base 2 and the mold pressing from the bottom (not shown). As a result, the position in the mold at the time of molding can be maintained to some extent because the upper and lower sides of the mold are in contact with each other.
Does not come into contact with the wall of the mold inside the base and therefore cannot be held by the mold, so that when the resin is injected into the mold, its position in the mold is May move, and in this case, there is a problem that the base 2 is molded in a state where the intermediate terminal 4b is displaced from a correct position.

In particular, when the entire chip coil 1 is configured to be small, the distance between the terminals is very small. If the position is shifted, the chip coil 1 may come into contact with other adjacent terminals. Will be reduced.

In view of the above, the present invention provides a chip coil in which each terminal can be held from above and below in a mold during molding, so that the terminal does not move in the mold by molding. It is an object.

[Means for solving the problem]

According to the present invention, the above object has a base on which a coil element is mounted, and a terminal formed integrally with the base, and a tip of the terminal in the base is provided on the base. This is achieved by a chip coil characterized in that the holding portion is bent upward and downward to form a holding portion, and the holding portion is brought into contact with the wall surface of the mold in the above-mentioned molding.

[Action]

According to the present invention, when each terminal is integrally formed on the base by insert molding, the terminals on both sides on one side and the terminals on the other side of the terminals are located inside the recessed portion of the base. Because the inner contact portion exposed to the upper and lower portions of the mold makes contact with the upper and lower portions, the position in the mold at the time of molding can be securely held from above and below, and the intermediate terminal on one side is bent. Then, since the base is exposed to the upper and lower directions of the base, it contacts the upper and lower sides of the mold. The part exposed to the bottom surface of the base abuts on the mold, and a part thereof abuts on the upper side of the mold, whereby the intermediate terminal is brought into contact with the mold during molding. Since the position in the mold can be held from above and below, it is suitable for injection of resin into the mold during molding, etc. I, each terminal, without such deviates from a desired position, so that it may be integrally molded to the base in the correct position.

〔Example〕

Hereinafter, the present invention will be described in more detail with reference to an embodiment shown in the drawings.

FIG. 1 shows a main part of an embodiment of a chip coil according to the present invention.

The chip coil 10 is formed on a resin-molded substantially rectangular parallelepiped base 11 on a coil element 12 (fourth element) including, for example, a drum core 12a, a cap core 12b, a shield case 12c, a variable capacity screw member 12d, and a winding 12e. (See the figure).

On one side of the base 11, three terminals 13 are arranged side by side, and on the other side, two terminals 14 are juxtaposed respectively. As shown in the figure, a winding lead end of the coil winding 12e is wound near the base of the end protruding from the side surface of the base of each of the terminals 13 and 14, and connected by soldering or the like.

Of the terminals 13 and 14, the terminals 13a and 13c and the terminals 14a and 14b on both sides of the terminal 13 are, as shown in FIG.
Chip capacitor 15 provided on the upper surface of the device (see Fig. 4)
The inner contact portion 16 is exposed at the bottom surface of the two recesses 11a for receiving the chip capacitor 15 and is in contact with the terminal portion of the chip capacitor 15 when the chip capacitor 15 is mounted in the recess 11a. And a central area thereof is exposed on the bottom surface of the base 11, and when placed on the surface of a PC board that has been subjected to wiring processing in advance, it comes into contact with the wiring pattern of the PC board and is electrically connected. (See the dotted line in FIG. 4).

In the terminal 13, the middle terminal 13b located at the center serving as a tap has its inner end exposed at the bottom surface of the terminal holding hole 11b provided on the upper surface of the base 11, as shown by the solid line in FIG. Thus, the inner pressing portion 16a is formed, and the inner pressing portion 16a comes into contact with the tip of a mold or a rod integrated with the mold inserted into the terminal holding hole 11b at the time of molding, and has a central portion. Area is exposed on the bottom surface of the base 11, and when placed on the surface of a PC board that has been subjected to a wiring process,
The outer contact portion 17 is in contact with and electrically connected to the wiring pattern of the PC board.

The shape of the intermediate terminal 13b is not limited to the shape shown in FIGS. 1 and 2, for example, as shown in FIG. 3 (A) or (B), with respect to the upper and lower sides of the mold. Any shape may be used as long as it has a portion that can be brought into contact with it.

Here, since the intermediate terminal 13b does not enter the region between the concave portions 11a, the concave portions 11a can be arranged close to each other, and the entire width of the present chip coil 10 is relatively small. It can be formed narrow.

The terminals 13 (13a, 13c) and 14 (14a, 14b) are preferably connected at their inner contact portions 16 as shown in FIG.
By contacting the tip of the mold inserted through the terminal holding hole 11c (illustrated by a dashed line) or the rod integrated with the mold, it comes into contact with the lower side of the mold, so that it can be surely formed from above and below during molding. It can be retained.

The chip coil 10 according to the present invention is configured as described above, and when each of the terminals 13 and 14 is integrally formed with the base 11 by insert molding, one of the terminals 13 and 14 is provided on one side. The terminals 13a, 13c on both sides and the terminals 14a, 14b on the other side are
The inner contact portion 16 exposed in the concave portion 11a of the base 11 contacts the upper side of a mold (not shown), and the outer contact portion 17 exposed on the bottom surface of the base 11 Since it contacts the lower surface of the mold, the position in the mold during molding can be reliably held from above and below.

Further, when the terminal holding hole 11c is provided, the inner contact portion 16 contacts the tip of a mold or a rod integrated with the mold inserted through the terminal holding hole 11c. , Can be securely held from above and below.

Also, the one side intermediate terminal 13b is such that the inner pressing portion 16a exposed in the terminal pressing hole 11b contacts the upper side of the mold with respect to the upper surface of the base 11, By contacting the lower surface of the mold by the outer contact portion 17 exposed on the bottom surface of the mold, the position in the mold at the time of molding can also be reliably held.

Thus, the terminals 13 and 14 can maintain their positions in the mold by being in contact with the mold up and down during molding.

Therefore, by injection of resin into the mold at the time of molding,
Each terminal does not deviate from a desired position, and can be integrally formed with the base at a correct position, and does not come into contact with another adjacent terminal.

The distances a and b between the terminals 13 and 14 preferably have a relation of 2b ≧ a ≧ b as shown in FIG. This gives 2b
= A, the terminals 13a located at both ends of the terminal 13,
The interval of 13c is equal to the interval of terminals 14a and 14b.
13a, 14a and terminals 13c, 14b can be produced in the same shape, respectively, and when b = a, as shown in FIG. 6, the two chip coils 10 are connected in opposite directions, Or, as shown in FIG.
Are alternately connected in the opposite direction and mounted on the printed circuit board 18, so that the terminal intervals are substantially the same.If the chip coil 10 itself is made compact, the terminal intervals should be as large as possible. However, the whole can be configured to be small, and the required length becomes short.

[Effect of the invention]

As described above, according to the present invention, since each terminal can be held in the mold during molding, the terminal coil does not move in the mold due to molding, and an extremely excellent chip coil is provided. Will be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main part of one embodiment of a chip coil according to the present invention, FIG. 2 is a perspective view showing a positional relationship of only each terminal in the embodiment of FIG. 1, and FIG. FIG. 4 is a perspective view showing a modification of the intermediate terminal in the embodiment of FIG. 1, FIG. 4 is a sectional view of the entire embodiment of FIG. 1, FIG. 5 is a bottom view of FIG. FIG. 7 and FIG. 7 show other embodiments of FIG. 1, respectively, wherein (a) is a front view,
8B is a bottom view, and FIG. 8 is a perspective view showing an example of a conventional chip coil. 10: Chip coil, 11: Base, 11a: Recess, 11
b, 11c ... Terminal holding hole, 12 ... Coil element, 13,14 ...
Terminal, 13a …… Intermediate terminal, 15 …… Chip capacitor, 16
...... Inner contact part, 16a ... Inner holding part, 17 ... Outer contact part, 18 ... Printed circuit board.

Claims (1)

(57) [Scope of request for utility model registration] 1. A base on which a coil element is mounted, and a terminal integrally formed with the base, wherein a tip portion of the terminal in the base is above and below the base. A chip coil which is bent to form a holding portion, and the holding portion is brought into contact with a wall surface of a mold in the molding.