JP2526209Y2 - Multiple coils - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a plurality of coils which are wound horizontally around a winding frame integrally formed so as to stand upright on a substrate base. The present invention relates to a multiple coil configured by disposing.

[0002]

2. Description of the Related Art Conventionally, such a multiple coil is constructed, for example, as shown in FIG. That is, in FIG. 6, the multiple coil 1 is configured by arranging a plurality of, in the illustrated case, three coils 2 side by side in the horizontal direction.

[0003] The coil 2 has a winding frame 4 integrally formed on a resin-molded substrate base portion 3 so as to rise vertically from the upper surface of the substrate base portion 3, and a coil frame 4 of the substrate base portion 3. It comprises a plurality of terminals 5 protruding downward from the lower surface, and a cover 6 attached so as to surround the substrate base 3 from above the winding frame 4.

In the multiple coil 1 configured as described above, a winding (not shown) is wound around the winding frame 4, and a lead terminal of the winding is connected to the terminal 5, thereby obtaining When the multiple coil 1 is mounted on a substrate or the like that constitutes various devices or the like, the terminal 5 is brought into contact with a conductive pattern or the like formed on the surface of the substrate or the like and is electrically connected by soldering or the like. ing.

[0005]

However, in the multiple coil 1 having such a configuration, since each coil 2 is individually formed, when the multiple coil 1 is assembled, the substrate of each coil 2 is not provided. The bottom surface of the base portion 3 does not form a single plane as a whole, and irregularities and steps are generated due to variations, so that when mounting various devices on a board or the like, the terminals 5 of the coils 2 Cannot be inserted smoothly into the holes provided in the terminal, etc., and the terminal 5 is bent or broken in some cases, so that soldering cannot be reliably performed. Rattling will occur.

For this reason, before mounting, the coils 2 are fixed to each other with an adhesive or the positions of the terminals are corrected, so that mounting can be easily performed.
Due to these operations, the lead terminals of the windings connected to the terminals are apt to be broken, and thus the reliability at the time of mounting is reduced.

Further, as shown in FIG. 7, in the case of a so-called surface-mounted multiple coil 1 in which the terminals 5 project outward from the side surfaces of the substrate base 3, the substrate as described above is used. Each terminal may not be able to come into contact with the surface of the substrate or the like due to irregularities or steps on the bottom surface of the base, and in that case, the terminal may be lifted off the surface of the substrate or the like, resulting in poor soldering. In the same manner, there is a problem that the reliability at the time of mounting is reduced.

In view of the above, the present invention forms the substrate bases constituting the individual coils integrally with each other so that the bottom surfaces of the substrate bases of the respective coils are aligned in one plane. In order to provide a multiple coil, the terminals of each coil abut against predetermined positions on the surface of a substrate or the like of various devices to be mounted at the time of mounting, and can be reliably electrically connected by soldering. It is intended to be.

[0009]

According to the present invention, at least two windings are wound on winding frames integrally formed so as to stand upright on a substrate base. In a multiple coil, a predetermined number of coils are arranged side by side in a horizontal direction. In a multiple coil, a large number of substrate base portions to form the coil are integrally formed continuously in one direction. And a winding frame in which each substrate base portion rises upward from a substantially central upper surface,
In addition, a long board base row member having a plurality of terminals protruding downward or sideward from near the open side edge of each board base portion is formed in advance, and a desired number of the board base row members are formed. This is achieved by a multiple coil, wherein the substrate base portion of the predetermined number of coils can be continuously formed by cutting the substrate base portion.

[0010]

According to the above construction, since the substrate base of each coil constituting the present multiple coil is formed integrally, when the multiple coil is assembled, the bottom surface of each substrate base becomes one. Therefore, when mounted on a board or the like of various devices, the entire board base portion of the multiple coil comes into close contact with the surface of the board or the like without floating. .

As a result, the terminals protruding from the lower surface or side surface of each substrate base portion are arranged at predetermined positions, so that the terminals can be smoothly inserted into holes of the substrate or the like during mounting. Or each terminal is brought into close contact with a conductive pattern provided on the surface of the substrate or the like, so that soldering can be easily performed, and after mounting, the terminals are in close contact with the surface of the substrate or the like. Therefore, there is no backlash, so that the lead terminal of the winding does not come off from the terminal or is disconnected, and a highly reliable multiple coil can be obtained.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings. FIG. 1 shows one embodiment of a substrate base row member for a coil according to the present invention.

The substrate base row member 10 is composed of a large number of substrate base portions 11 which are continuously and integrally formed in one direction by resin molding or the like. The boundaries between the substrate base portions 11 are indicated by dotted lines in the figure. It is formed so that it can be easily cut by notches, grooves, holes and the like as shown. Each substrate base 11
Are respectively formed integrally with the winding frame 12 so as to rise vertically from the center of the upper surface thereof, and the substrate base portion 1.
A plurality of terminals 13 projecting laterally from the open side surface
It is composed of

[0014] The substrate base row member 1 configured as described above.
0 is used to form a desired multiple coil, for example, every three substrate bases 11 as shown in FIG. 2 or every four substrate bases 11 as shown in FIG. It is divided by cutting along the boundary.

At this time, before or after the cutting of the substrate base row member 10, a winding (not shown) is wound around the winding frame 12 of each substrate base portion 11, and a lead terminal of the winding is wound. Are wound around predetermined terminals 13 and fixed by soldering or the like, so that they are electrically connected, and thus individual coils 14 are configured.

For example, as shown in FIG. 4, the connection is made for each block constituting each multiple coil, and as shown in FIG.
Connections are also possible. In this case, the substrate base 1
Since the wires 1 are formed integrally with each other, disconnection and disconnection of these connections can be effectively avoided.

As shown in FIG. 4, a chip capacitor formed on the surface of the substrate base portion 11 is connected to the four terminals 13 among the terminals 13, and an appropriate coil circuit is formed. That can be done.

FIG. 2 shows a modification in which the terminal 13 protrudes downward from the lower surface of the substrate base portion 11.

In this way, by winding the winding around the winding frame 12 and connecting the lead terminals of the winding to the terminals 13, the multiple coils 1 in which the assembly of the coils 14 is completed are completed.
5 and 16 (see FIGS. 2 and 3) are completed by attaching a cover (not shown) so as to surround the substrate base 11 of each coil 14 from above the winding frame 12.

The multiple coil according to the present invention is configured as described above, and the bottom surface is formed by integrally forming the substrate base 11 of each coil 14 constituting the multiple coils 15 and 16. When mounted on a board or the like of various devices, a terminal 13 that is brought into close contact with the surface of the board or the like and protrudes from the board base portion 11 is provided. Since it can be accurately positioned at a predetermined value on the surface of the substrate or the like, it can be smoothly inserted into the mounting hole or can be reliably brought into contact with the conductive pattern.

[0021]

As described above, according to the present invention, each terminal can be held from above and below in the mold at the time of molding, so that the terminal does not move in the mold by molding, and In this case, an extremely excellent coil that can be securely connected to the PC board land can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of a substrate base row member formed according to the present invention.

FIG. 2 is a perspective view showing one embodiment of a multiple coil constituted by the substrate base row members of FIG. 1;

FIG. 3 is a perspective view showing another embodiment of the multiple coil constituted by the substrate base row member of FIG. 1;

FIG. 4 is an equivalent circuit diagram showing a connection example of the substrate base row member of FIG. 1;

FIG. 5 is an equivalent circuit diagram showing a connection example of the substrate base row member of FIG. 3;

FIG. 6 is an exploded perspective view showing an example of a conventional multiple coil.

FIG. 7 is an exploded perspective view showing many examples of a conventional multiple coil.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate base row member 11 Substrate base part 12 Winding frame 13 Terminal 14 Coil 15 Multiple coil 16 Multiple coil

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-208910 (JP, A) JP-A-63-41003 (JP, A) JP-A-2-264405 (JP, A) JP-A-3-3 286516 (JP, A) JP-A-62-85508 (JP, A) JP-A-59-98610 (JP, U) JP-A-61-83324 (JP, U) JP-A-61-92041 (JP, U) Jiko 48-32494 (JP, Y2)

Claims (1)

(57) [Scope of request for utility model registration] At least two predetermined number of coils, each of which is wound around a winding frame integrally formed so as to stand vertically on a substrate base portion, are arranged side by side with each other. In the multiple coil, a large number of substrate bases to form the coil are formed continuously and integrally in one direction, and each substrate base is substantially upward from a central upper surface. A long board base row member having a standing winding frame and a plurality of terminals protruding downward or sideward from near the open side edge of each board base portion is formed in advance, A multiple coil, wherein the substrate members of the predetermined number of coils can be continuously formed by cutting the row member into a desired number of substrate base portions.