JPH0319292U - - Google Patents
Info
- Publication number
- JPH0319292U JPH0319292U JP8035889U JP8035889U JPH0319292U JP H0319292 U JPH0319292 U JP H0319292U JP 8035889 U JP8035889 U JP 8035889U JP 8035889 U JP8035889 U JP 8035889U JP H0319292 U JPH0319292 U JP H0319292U
- Authority
- JP
- Japan
- Prior art keywords
- induction plasma
- substrate
- cut
- tip
- panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000006698 induction Effects 0.000 claims 2
- 239000003708 ampul Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
Landscapes
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Description
第1図はこの考案の一実施例の平面図、第2図
は他の実施例の平面図、第3図は更に別の実施例
の平面図、第4図は切込溝の各種の態様を示す断
面図、第5図は従来のパネルヒータの平面図及び
断面図、第6図は従来の別のパネルヒータの平面
図及び断面図、第7図は第6図示のパネルヒータ
の電流分布を示す拡大部分平面図である。
11……基板、12……銅被膜、13及び14
……切込溝、13b,13c及び13d……膨大
部、14b,14c及び14d……膨大部。
Fig. 1 is a plan view of one embodiment of this invention, Fig. 2 is a plan view of another embodiment, Fig. 3 is a plan view of yet another embodiment, and Fig. 4 is a plan view of various aspects of the cut groove. 5 is a plan view and a sectional view of a conventional panel heater, FIG. 6 is a plan view and a sectional view of another conventional panel heater, and FIG. 7 is a current distribution of the panel heater shown in FIG. FIG. 11...Substrate, 12...Copper coating, 13 and 14
... Cut grooves, 13b, 13c and 13d... Ampulla, 14b, 14c and 14d... Ampulla.
Claims (1)
熱源に利用するインダクシヨンプラズマ・コーテ
イング法によつて銅粉末を付着させて形成した銅
被膜に、上記基板の両側端から交互に切込溝を設
けることによりジグザグ状をなす一連の電流通路
を形成させたパネル状ヒータにおいて、上記切込
溝の先端に膨大部を形成したことを特徴とするパ
ネル状ヒータ。 Cut grooves are provided alternately from both sides of the substrate in a copper coating formed by adhering copper powder to the surface of an insulating substrate by an induction plasma coating method that uses induction plasma as a heat source. What is claimed is: 1. A panel-shaped heater in which a series of zigzag current paths are formed, characterized in that an enlarged portion is formed at the tip of the cut groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8035889U JPH0319292U (en) | 1989-07-07 | 1989-07-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8035889U JPH0319292U (en) | 1989-07-07 | 1989-07-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0319292U true JPH0319292U (en) | 1991-02-26 |
Family
ID=31625344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8035889U Pending JPH0319292U (en) | 1989-07-07 | 1989-07-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0319292U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001030115A1 (en) * | 1999-10-22 | 2001-04-26 | Ibiden Co., Ltd. | Ceramic heater |
WO2001031978A1 (en) * | 1999-10-22 | 2001-05-03 | Ibiden Co., Ltd. | Ceramic heater |
JP2016171066A (en) * | 2015-03-09 | 2016-09-23 | 株式会社ニューフレアテクノロジー | Heater and semiconductor manufacturing device using the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5833665U (en) * | 1981-08-29 | 1983-03-04 | 株式会社明電舎 | Gondola for high-rise buildings |
-
1989
- 1989-07-07 JP JP8035889U patent/JPH0319292U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5833665U (en) * | 1981-08-29 | 1983-03-04 | 株式会社明電舎 | Gondola for high-rise buildings |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001030115A1 (en) * | 1999-10-22 | 2001-04-26 | Ibiden Co., Ltd. | Ceramic heater |
WO2001031978A1 (en) * | 1999-10-22 | 2001-05-03 | Ibiden Co., Ltd. | Ceramic heater |
JP2016171066A (en) * | 2015-03-09 | 2016-09-23 | 株式会社ニューフレアテクノロジー | Heater and semiconductor manufacturing device using the same |