JPH0319261A - Lead frame for semiconductor - Google Patents

Abstract

PURPOSE:To prevent the exfoliation of a semiconductor circuit pellet by constituting a semiconductor seating part of a honeycomb type metal mesh, and increasing the fixing strength. CONSTITUTION:A semiconductor seating part 1 has a retaining lead wire 5, and is constituted in a regular hexagon mesh structure whose periphery is surrounded by uniform width metal. This mesh structure reduces thermal stress generated by heat, and increases the fixing strength. When the seating part 1 is made of a mesh, metal part is little, so that stress caused by thermal expansion is small and the generated stress is reduced by the deformation of the mesh part. When a honeycomb type metal mesh, i.e., a regular hexagon mesh structure is used, resistance to thermal stress is increased, and cracks and exfoliation of an integrated circuit pellet 7 can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a semiconductor reel frame used in the assembly of integrated circuits.

2. Prior Art Conventionally, as shown in FIG. 3, in the above-mentioned lead frame, the semiconductor mounting portion 1 is made of a rectangular housing without holes or a square metal plate, and the button 9 is connected to the connecting portion 4 of the semiconductor mounting portion 1. It was connected with a support lead wire 6.

Problems to be Solved by the Invention According to the conventional frame, after the integrated circuit pellet 6 is fixed to the semiconductor placing part 1, the resin is bonded, and the external lead part 3 is processed, the finished product is subjected to stress due to heat. If you add
There were problems such as the integrated circuit pellet 6 cracking due to the difference in thermal expansion coefficient between the semiconductor placing part 1 and the sealing resin, and the integrated circuit pellet 6 peeling off from the semiconductor placing part 1.

In FIG. 2, only the protruding portion of the integrated circuit pellet 6 of the semiconductor placing part 1 is fixed by the external sealing resin, and the semiconductor placing part 1 has a larger coefficient of thermal expansion than the sealing resin. This is because thermal expansion generates stress in the center of the semiconductor placement part 1, causing the semiconductor placement part 1 to warp as shown in FIG. At this time, if the adhesive force fixing the integrated circuit pellet 6 is strong, cracks will appear in the integrated circuit pellet 6, and if the adhesive force is weak, the integrated circuit pellet 6 will peel off from the semiconductor placement part 1. It turns out.

Means for Solving the Problems In order to solve this problem, the present invention provides a semiconductor placement section 1.
A mesh-shaped metal is used for the mesh, and the mesh structure is a regular hexagon (no. 12 cam shape).

If the working semiconductor placement part 1 is made of a mesh, even if thermal stress is applied as described above, there are fewer metal parts than in the conventional case, so the stress due to thermal expansion will be small, and the generated stress will also be reduced. It is reduced by deforming a part of the mesh.

By making the mesh structure a regular hexagon, the entire surface is constructed as a relatively simple line structure with a single angle, and the area of the metal used is reduced compared to when using other mesh Vs structures. This makes it possible to make it structurally stronger while being smaller.

Embodiment FIG. 1 is a pattern diagram of a semiconductor lead frame according to an embodiment of the present invention. In Figure 1, internal lead 2
．． External lead 3. The connecting portion 4 and the supporting lead wire 5 of the semiconductor placing portion 1 are conventional ones or none. Semiconductor laying part 1
As shown in FIG. 2, the periphery is made of metal with a uniform width, and the inside has a regular hexagonal mesh structure made of metal with a uniform width. This mesh structure serves as a buffer structure that reduces thermal stress generated by heat.

Effects of the Invention As described above, according to the present invention, it is possible to prevent cracking and peeling of integrated circuit pellets that occur when thermal stress is applied to a resin-sealed semiconductor product.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a semiconductor lead frame according to an embodiment of the present invention, FIG. 2 is an enlarged view of a semiconductor placement part of the present invention, and FIG. 3 is a plan view showing a conventional semiconductor lead frame. FIG. 4 is a diagram showing deformation of the semiconductor placement part due to heat. DESCRIPTION OF SYMBOLS 1... Semiconductor laying part, 2... Internal lead part, 3... External lead part, 4... Connection part, 6...・Lead wire for supporting the semiconductor laying part,
6... Integrated circuit pellet, 7... Metal mesh, 8... Adhesive, 9... Deflection due to stress. Figure 2 l Figure

Claims (1)

[Claims] A semiconductor lead frame having a semiconductor placing part, an internal lead part, and an external lead part, characterized in that the semiconductor placing part is constituted by a honeycomb-shaped metal mesh (a metal having a regular hexagonal mesh structure). Lead frames for semiconductors.