JPH0318740B2 - - Google Patents

Info

Publication number
JPH0318740B2
JPH0318740B2 JP401385A JP401385A JPH0318740B2 JP H0318740 B2 JPH0318740 B2 JP H0318740B2 JP 401385 A JP401385 A JP 401385A JP 401385 A JP401385 A JP 401385A JP H0318740 B2 JPH0318740 B2 JP H0318740B2
Authority
JP
Japan
Prior art keywords
resin
container
molded product
liquid resin
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP401385A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61163643A (ja
Inventor
Yoshihiro Machida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP401385A priority Critical patent/JPS61163643A/ja
Publication of JPS61163643A publication Critical patent/JPS61163643A/ja
Publication of JPH0318740B2 publication Critical patent/JPH0318740B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP401385A 1985-01-16 1985-01-16 フイルム成型品を用いた電子部品の製造方法 Granted JPS61163643A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP401385A JPS61163643A (ja) 1985-01-16 1985-01-16 フイルム成型品を用いた電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP401385A JPS61163643A (ja) 1985-01-16 1985-01-16 フイルム成型品を用いた電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS61163643A JPS61163643A (ja) 1986-07-24
JPH0318740B2 true JPH0318740B2 (enrdf_load_stackoverflow) 1991-03-13

Family

ID=11573084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP401385A Granted JPS61163643A (ja) 1985-01-16 1985-01-16 フイルム成型品を用いた電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS61163643A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009057614A1 (ja) * 2007-10-31 2009-05-07 Nec Corporation 電子装置及びその製造方法、並びに実装基板

Also Published As

Publication number Publication date
JPS61163643A (ja) 1986-07-24

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