JPH0318740B2 - - Google Patents
Info
- Publication number
- JPH0318740B2 JPH0318740B2 JP401385A JP401385A JPH0318740B2 JP H0318740 B2 JPH0318740 B2 JP H0318740B2 JP 401385 A JP401385 A JP 401385A JP 401385 A JP401385 A JP 401385A JP H0318740 B2 JPH0318740 B2 JP H0318740B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- container
- molded product
- liquid resin
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 44
- 239000011347 resin Substances 0.000 claims description 44
- 239000007788 liquid Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
この発明は耐熱性フイルムを用い成型した成型
品を用い液体樹脂を注入充填し、電子部品を挿入
し、樹脂封止する電子部品の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method of manufacturing electronic components, in which a molded product made of a heat-resistant film is injected and filled with liquid resin, electronic components are inserted, and the molded product is sealed with resin.
従来の技術
IC等の電子部品の樹脂封止はインジエクシヨ
ンモールド法を用い電子部品素子の周囲を樹脂成
型する方法か、単体の容器に素子を挿入し、樹脂
を注入固化する方法で電子部品を生産していた。Conventional technology Electronic components such as ICs are encapsulated with resin by molding resin around the electronic component element using the injection molding method, or by inserting the element into a single container and injecting resin and solidifying the electronic component. was producing.
発明が解決しようとする問題点
従来の製造方法を用いるとき、インジエクシヨ
ンモールド方法の場合には樹脂に圧力を加え型に
注入するため素子に圧力を加え型に注入するため
素子に圧力がかかり細い導線が切断したり短絡事
故の発生が避けられなかつた。また成型型の製作
費が極めて高く改造が困難であり、注入した樹脂
がランナー等に残されるので充填量の歩留りが悪
い等の問題があつた。単体の容器内に液体樹脂を
充填する方法の場合には容器の肉厚を厚くしなけ
ればならず、容器の価格が高価となり、リードフ
レーム等で素子が連結されている電子部品を容器
内に挿入することは自動化が難しく、充填する樹
脂の計量も一個づつ行わねばならず、樹脂の容器
内のレベルを一定にすることが困難であつた。別
に粉体塗装を用いた方法もあるが、空気を下方か
ら送り流動化した粉体樹脂に予じめ加熱した素子
を浸漬し、素子に粉体を溶着させる手段のため偏
平状の素子の上面には樹脂が付着しにくく、また
リード線に微粉末が付着し易く導通不良が生じ易
い難点がある。Problems to be Solved by the Invention When using conventional manufacturing methods, in the case of injection molding, pressure is applied to the resin and injected into the mold, so pressure is applied to the element and pressure is applied to the element. The occurrence of thin conductor wires breaking or short circuits was unavoidable. In addition, the manufacturing cost of the mold is extremely high and modification is difficult, and the injected resin remains on the runner, etc., resulting in problems such as poor filling yield. In the case of filling a single container with liquid resin, the wall thickness of the container must be increased, making the container expensive, and it is difficult to place electronic components whose elements are connected by lead frames etc. Insertion is difficult to automate, and the resin to be filled must be measured one by one, making it difficult to maintain a constant level of resin in the container. Another method is to use powder coating, but this method involves immersing a preheated element in fluidized powder resin by sending air from below, and welding the powder to the element. However, resin does not easily adhere to the lead wire, and fine powder easily adheres to the lead wire, resulting in poor continuity.
問題点を解決するための手段
この発明は、複数個の電子部品素子を収納する
容器が頂面部で隣り合わせにつながつた成型体の
外周に溢れでた液体樹脂を貯蔵する貯蔵部を有し
たフイルムの成型品を用い、この成型品の各容器
の中に熱硬化性液体樹脂を注入し充填する工程
と、この充填された液体樹脂の中に電子部品素子
を挿入する工程と、この液体樹脂を加熱硬化し電
子部品素子を樹脂封止する工程と、この容器の頂
面のつながり部をカツターで切断しフイルム成型
品を用い樹脂封止した電子部品の製造方法であ
る。Means for Solving the Problems The present invention provides a film having a storage section for storing liquid resin overflowing around the outer periphery of a molded body in which containers for storing a plurality of electronic component elements are connected adjacently at the top surface. Using a molded product, there are a process of injecting and filling a thermosetting liquid resin into each container of the molded product, a process of inserting an electronic component element into the filled liquid resin, and a process of heating the liquid resin. The process includes a step of curing and sealing the electronic component element with a resin, and a method of manufacturing an electronic component by cutting the connecting portion on the top surface of the container with a cutter and sealing the electronic component with a resin using a film molded product.
作 用
この発明は、リードフレームの先端部に装着さ
れたIC等の電子部品素子を液体樹脂が注入され
た成型品の容器内に挿入し、液体樹脂が固化した
後成型品の所定個所を切断することにより製造す
るもので、成型品の外周に溢れ出た液体樹脂を貯
蔵する貯蔵部を設けたことにより、環境整備上有
利であり、また各容器内には均一な量の液体樹脂
が充填され、さらに多数の電子部品が多量に生産
できるので生産性を高めることができる。Operation This invention involves inserting an electronic component element such as an IC mounted on the tip of a lead frame into a container of a molded product filled with liquid resin, and cutting the molded product at a predetermined location after the liquid resin has solidified. By providing a storage section to store the liquid resin that overflows around the outer periphery of the molded product, it is advantageous in terms of environmental maintenance, and each container is filled with a uniform amount of liquid resin. Furthermore, a large number of electronic components can be produced in large quantities, thereby increasing productivity.
実施例
この発明の実施例を図面に基づき説明すると、
１は耐熱性のポリエステル樹脂等のフイルムを原
料として成型加工したフイルム成型品である。こ
の成型品１にはIC素子２を内蔵する凹所３が複
数形成された容器４と、この容器４の頂面部５に
は隣り合つた容器４同士をつなぐつなぎ部６があ
り、成型品１の外周部７には溢れでた液体樹脂を
成型品１からこぼれ出ないよう貯蔵する貯蔵部８
が設けられている。貯蔵部８の形状、大きさは適
宜選べばよい。Embodiment An embodiment of this invention will be described based on the drawings.
1 is a film molded product made from a heat-resistant polyester resin film as a raw material. The molded product 1 includes a container 4 in which a plurality of recesses 3 are formed to house IC elements 2, and a connecting portion 6 on the top surface 5 of the container 4 that connects adjacent containers 4. A storage section 8 is provided at the outer circumference 7 of the molded product 1 to store the overflowing liquid resin so that it does not spill out from the molded product 1.
is provided. The shape and size of the storage section 8 may be selected as appropriate.
この成型品１の各容器４の凹所３内に定量の熱
硬化性液体樹脂１０を注入充填する。このとき成
型品１を載置する受け台を移動するか、充填ノズ
ルを移動しながら容器４内に樹脂１０を注入する
かは自由である。 A fixed amount of thermosetting liquid resin 10 is injected and filled into the recess 3 of each container 4 of this molded product 1. At this time, it is free to choose whether to move the pedestal on which the molded product 1 is placed or to inject the resin 10 into the container 4 while moving the filling nozzle.
所定量の樹脂１０が充填された容器４内にリー
ドフレーム１２の先端部に装着されたIC素子２
を挿入する。このとき溢れでた樹脂１０は成型品
１の外周部に設けられた貯蔵部８に溜まり、成型
品１から外部に溢れ出すことがなく、容器４内の
樹脂の上面のレベルは常に一定に保たれる。多数
のリードフレームを一度に成型品に挿入すること
ができる。 An IC element 2 is mounted on the tip of a lead frame 12 in a container 4 filled with a predetermined amount of resin 10.
Insert. The resin 10 that overflows at this time is collected in a storage part 8 provided on the outer periphery of the molded product 1, and does not overflow from the molded product 1 to the outside, and the level of the upper surface of the resin in the container 4 is always kept constant. dripping Multiple lead frames can be inserted into a molded product at once.
この後、成型品１に素子２が挿入された状態の
まま硬化炉に入れ、樹脂１０を加熱硬化させ、樹
脂が固化したら、リードフレーム１２の所定個所
を切断し、保持部１４を切り離す。 Thereafter, the molded product 1 with the element 2 inserted therein is placed in a curing furnace to heat and harden the resin 10. Once the resin is solidified, the lead frame 12 is cut at a predetermined location and the holding portion 14 is separated.
次に成型品１の容器つなぎ部６をカツター１６
で切断すれば電子部品２０が製造できる。成型品
の貯蔵部８は切り離されるので廃棄すればよい。 Next, cut the container connection part 6 of the molded product 1 with the cutter 16.
The electronic component 20 can be manufactured by cutting with. The storage section 8 of the molded product is separated and can be discarded.
発明の効果
(1) 電子部品素子は液体樹脂が容器内に注入され
た後挿入するので、充填樹脂は無圧力状態であ
り、素子に無理な負荷が加わらず、従つて、リ
ード線の切断事故や、短絡事故が生じなくなつ
た。Effects of the invention (1) Since the electronic component element is inserted after the liquid resin is injected into the container, the filled resin is in a pressureless state, and no excessive load is applied to the element, thus preventing lead wire breakage accidents. Also, short circuit accidents no longer occur.
(2) 成型品の容器の上面は平面なのでリードフレ
ームへの樹脂の這い上りがなく導通不良が少
い。(2) Since the top surface of the molded product container is flat, there is no resin creeping up onto the lead frame, reducing conduction defects.
(3) 成型品は絶縁性フイルムを用いているので素
子の挿入に対し多少ずれても外部との耐電圧性
は保持できる。(3) Since the molded product uses an insulating film, it can maintain voltage resistance with the outside even if it is slightly misaligned with the insertion of the element.
(4) 単位型樹脂ケースに比べ、フイルムを用いる
ので肉厚を薄くでき、安価にできる。(4) Compared to unit-type resin cases, the use of film allows for thinner walls and lower costs.
(5) 素子を多数同時に、成型品の中に挿入できる
ので自動化が容易に行え、生産性が向上する。(5) Since a large number of elements can be inserted into a molded product at the same time, automation is easy and productivity is improved.
(6) 液体樹脂の充填量を適正化できるので、樹脂
の歩止まりを向上できる。(6) Since the filling amount of liquid resin can be optimized, the yield of resin can be improved.
(7) 成型品の外周部に樹脂の余剰分を貯蔵する貯
蔵部が設けてあるので装置等を汚すことがな
い。(7) A storage section for storing excess resin is provided on the outer periphery of the molded product, so equipment etc. will not be contaminated.
第１図は本発明で製造したICの斜視図、第２
図は本発明の成型品の平面図、第３図は同断面
図、第４図は樹脂を充填した断面図、第５図は
IC素子を挿入した断面図、第６図は同側面図、
第７図はリードフレームを切断した側面図、第８
図は成型品を切断する工程を示す側面図。
図面において、１はフイルムで作られた成型
品、２はIC素子、３は凹所、４は容器、５は頂
面部、６はつなぎ部、８は貯蔵部、１０は液体樹
脂、１２はリードフレーム、１４はリードフレー
ムの保持部、１６はカツター、２０は電子部品。
Figure 1 is a perspective view of an IC manufactured by the present invention, Figure 2 is a perspective view of an IC manufactured according to the present invention.
The figure is a plan view of the molded product of the present invention, Figure 3 is a sectional view of the same, Figure 4 is a sectional view of the molded product filled with resin, and Figure 5 is a sectional view of the molded product of the present invention.
A cross-sectional view with the IC element inserted, Figure 6 is a side view of the same,
Figure 7 is a side view of the lead frame cut away, Figure 8
The figure is a side view showing the process of cutting a molded product. In the drawings, 1 is a molded product made of film, 2 is an IC element, 3 is a recess, 4 is a container, 5 is a top part, 6 is a joint part, 8 is a storage part, 10 is a liquid resin, and 12 is a lead 14 is a lead frame holding part, 16 is a cutter, and 20 is an electronic component.
Claims (1)
同士が頂面部でお互いにつながつており、外周に
は溢れでた液体樹脂を貯蔵する貯蔵部を有したフ
イルム成型品を用い、この成型品の各容器に対し
熱硬化性液体樹脂を注入充填する工程と、この熱
硬化性液体樹脂が充填された各容器に対し、リー
ドフレームの先端部に装着された電子部品素子を
この容器の中に挿入する工程と、この容器内の熱
硬化性液体樹脂を加熱硬化させ、この樹脂で電子
部品素子を樹脂封止する工程と、この容器を所定
個所で切断し電子部品をうる工程とからなるフイ
ルム成型品を用いた電子部品の製造方法。1 A film molded product is used, which includes a container in which a plurality of recesses are formed, the containers are connected to each other at the top, and a storage section on the outer periphery for storing overflowing liquid resin is used. A process of injecting thermosetting liquid resin into each container of the product, and inserting the electronic component mounted on the tip of the lead frame into each container filled with this thermosetting liquid resin. The thermosetting liquid resin in the container is heated and cured, and the electronic component element is sealed with this resin. The container is cut at a predetermined point to obtain the electronic component. A method for manufacturing electronic components using film molded products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP401385A JPS61163643A (en) | 1985-01-16 | 1985-01-16 | Manufacture of electronic component part using film molded shape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP401385A JPS61163643A (en) | 1985-01-16 | 1985-01-16 | Manufacture of electronic component part using film molded shape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61163643A JPS61163643A (en) | 1986-07-24 |
| JPH0318740B2 true JPH0318740B2 (en) | 1991-03-13 |
Family
ID=11573084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP401385A Granted JPS61163643A (en) | 1985-01-16 | 1985-01-16 | Manufacture of electronic component part using film molded shape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61163643A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009057614A1 (en) * | 2007-10-31 | 2009-05-07 | Nec Corporation | Electronic device, electronic device manufacturing method, and mounting board |
-
1985
- 1985-01-16 JP JP401385A patent/JPS61163643A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61163643A (en) | 1986-07-24 |
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