JPH03177469A - Varnish - Google Patents
VarnishInfo
- Publication number
- JPH03177469A JPH03177469A JP31705389A JP31705389A JPH03177469A JP H03177469 A JPH03177469 A JP H03177469A JP 31705389 A JP31705389 A JP 31705389A JP 31705389 A JP31705389 A JP 31705389A JP H03177469 A JPH03177469 A JP H03177469A
- Authority
- JP
- Japan
- Prior art keywords
- varnish
- imide
- polyamide
- polyimide
- baked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002966 varnish Substances 0.000 title claims abstract description 23
- 229920001721 polyimide Polymers 0.000 claims abstract description 21
- 239000004962 Polyamide-imide Substances 0.000 claims abstract description 20
- 229920002312 polyamide-imide Polymers 0.000 claims abstract description 20
- 239000009719 polyimide resin Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 abstract description 10
- 238000005187 foaming Methods 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 125000002723 alicyclic group Chemical group 0.000 abstract description 2
- 125000001931 aliphatic group Chemical group 0.000 abstract description 2
- 125000003118 aryl group Chemical group 0.000 abstract description 2
- 125000000623 heterocyclic group Chemical group 0.000 abstract description 2
- 125000000962 organic group Chemical group 0.000 abstract description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 8
- 125000005462 imide group Chemical group 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 5
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- -1 1,1-dimethyl-5-aminopentyl Chemical group 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920003055 poly(ester-imide) Polymers 0.000 description 2
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- XMXCPDQUXVZBGQ-UHFFFAOYSA-N 2,3,6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic acid Chemical compound ClC1=C(Cl)C(C(O)=O)=C2C(C(=O)O)=C(Cl)C(Cl)=C(C(O)=O)C2=C1C(O)=O XMXCPDQUXVZBGQ-UHFFFAOYSA-N 0.000 description 1
- SDWGBHZZXPDKDZ-UHFFFAOYSA-N 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=C(Cl)C(C(O)=O)=C2C(C(=O)O)=CC(Cl)=C(C(O)=O)C2=C1C(O)=O SDWGBHZZXPDKDZ-UHFFFAOYSA-N 0.000 description 1
- HUWXDEQWWKGHRV-UHFFFAOYSA-N 3,3'-Dichlorobenzidine Chemical compound C1=C(Cl)C(N)=CC=C1C1=CC=C(N)C(Cl)=C1 HUWXDEQWWKGHRV-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- ZRJAHFLFCRNNMR-UHFFFAOYSA-N 3-amino-2-(4-aminophenyl)benzoic acid Chemical compound C1=CC(N)=CC=C1C1=C(N)C=CC=C1C(O)=O ZRJAHFLFCRNNMR-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- OSGFBINRYVUILV-UHFFFAOYSA-N 4-[(4-aminophenyl)-diethylsilyl]aniline Chemical compound C=1C=C(N)C=CC=1[Si](CC)(CC)C1=CC=C(N)C=C1 OSGFBINRYVUILV-UHFFFAOYSA-N 0.000 description 1
- BLMSGSGJGUHKFW-UHFFFAOYSA-N 4-[(4-aminophenyl)-diphenylsilyl]aniline Chemical compound C1=CC(N)=CC=C1[Si](C=1C=CC(N)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BLMSGSGJGUHKFW-UHFFFAOYSA-N 0.000 description 1
- HWKHQQCBFMYAJZ-UHFFFAOYSA-N 4-amino-n-(3-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=CC(N)=C1 HWKHQQCBFMYAJZ-UHFFFAOYSA-N 0.000 description 1
- LBNFPUAJWZYIOQ-UHFFFAOYSA-N 4-n-(4-aminophenyl)-4-n-methylbenzene-1,4-diamine Chemical compound C=1C=C(N)C=CC=1N(C)C1=CC=C(N)C=C1 LBNFPUAJWZYIOQ-UHFFFAOYSA-N 0.000 description 1
- IIEKUGPEYLGWQQ-UHFFFAOYSA-N 5-[4-(4-amino-2-methylpentyl)phenyl]-4-methylpentan-2-amine Chemical compound CC(N)CC(C)CC1=CC=C(CC(C)CC(C)N)C=C1 IIEKUGPEYLGWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- AVRWEULSKHQETA-UHFFFAOYSA-N Thiophene-2 Chemical compound S1C=2CCCCCC=2C(C(=O)OC)=C1NC(=O)C1=C(F)C(F)=C(F)C(F)=C1F AVRWEULSKHQETA-UHFFFAOYSA-N 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- JLHMVTORNNQCRM-UHFFFAOYSA-N ethylphosphine Chemical compound CCP JLHMVTORNNQCRM-UHFFFAOYSA-N 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- KADGVXXDDWDKBX-UHFFFAOYSA-N naphthalene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C21 KADGVXXDDWDKBX-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- JRDBISOHUUQXHE-UHFFFAOYSA-N pyridine-2,3,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)N=C1C(O)=O JRDBISOHUUQXHE-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、厚塗り焼付しても発泡を生しない、ポリアミ
ドイミド含有のポリイミド系のワニスに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a polyimide-based varnish containing polyamideimide that does not cause foaming even when thickly coated and baked.
従来の技術及び課題
従来、ポリイミド、ポリアミドイミド、ポリエステルイ
ミドの如きポリイミド系樹脂を単独で用いてなるワニス
が知られていた。BACKGROUND ART Conventionally, varnishes made using polyimide resins such as polyimide, polyamideimide, and polyesterimide alone have been known.
しかしながら、かかるワニスを厚塗りして焼付処理する
と発泡する問題点があり、発泡を有しない焼付層を形成
するためには塗り厚さをｌｏ−以下に制御する必要があ
った。そのため例えば１ｏｓｓを超える焼付層を形成す
るためには、ワニスの塗布とその焼付処理を１０回以上
繰り返す必要のある問題点があった。However, if such a varnish is applied thickly and baked, there is a problem in that it foams, and in order to form a baked layer without foaming, it is necessary to control the coating thickness to less than lo-. Therefore, for example, in order to form a baked layer exceeding 1 oss, there is a problem in that it is necessary to repeat the application of varnish and the baking process ten or more times.
課題を解決するための手段
本発明らは前記の課題を克服し、厚塗り焼付しても発泡
問題を生じないワニスを開発するために鋭意研究を重ね
た結果、意外にもポリアミドイミドを所定の割合で用い
たポリイミド系樹脂の併用系ワニスとすることによりそ
の目的を達成できることを見出し、本発明をなすに至っ
た。Means for Solving the Problems As a result of extensive research in order to overcome the above-mentioned problems and develop a varnish that does not cause the foaming problem even when thickly coated and baked, the present inventors unexpectedly found that polyamide-imide was It was discovered that the object could be achieved by creating a varnish based on the combination of polyimide resins used in the same proportions, and the present invention was completed.
すなわち本発明は、ポリアミドイミドと他のポリイミド
系樹脂を用いてなり、ポリアミドイミドの使用割合が全
ポリマ中の１０〜５０重量％であることを特徴とするワ
ニスを提供するものである。That is, the present invention provides a varnish that uses polyamide-imide and other polyimide-based resins, and is characterized in that the proportion of polyamide-imide used is 10 to 50% by weight based on the total polymer.
作用
前記した割合でポリアミドイミドを用いたポリイミド系
樹脂の併用系ワニスとすることにより、その理由は不明
であるが１０〇−程度に厚塗りして焼付処理しても発泡
を生じない。Effect By using a varnish based on the combination of polyamide-imide and polyimide resin in the proportions described above, foaming does not occur even if the varnish is coated thickly to about 100% and baked, although the reason for this is unknown.
発明の構成要素の例示
本発明のワニスは、ポリアミドイミドと他のポリイミド
系樹脂を併用したものであり、ポリアミドイミドを全ポ
リマ中の１０〜５０重量％の割合で用いたものである。Examples of Constituent Elements of the Invention The varnish of the present invention is a combination of polyamide-imide and other polyimide resins, and the polyamide-imide is used in an amount of 10 to 50% by weight based on the total polymer.
ポリアミドイミドの使用割合が前記範囲外では、発泡を
生じて厚塗り焼付の目的が達成されない。If the proportion of polyamide-imide used is outside the above range, foaming will occur and the purpose of thick coating cannot be achieved.
前記したポリアミドイミド及びポリイミド系樹脂として
は、主鎖にイミド基を有する広範囲のものを用いつる。As the above-mentioned polyamide-imide and polyimide resin, a wide variety of resins having an imide group in the main chain can be used.
特に、ジアミンないしジイソシアネートの１８１又は２
種以上と、テトラカルボン酸ないしその誘導体の１種又
は２種以上を反応させて得たポリアミド酸を加熱処理し
て形成させたポリイミドにおける繰り返し単位に相当す
る次式で表される繰り返し単位を含有するものが好まし
く用いられる。その含有量は、ポリアミドイミドの場合
、３０〜９０モル％、その他のポリイミド系樹脂の場合
、３０モル％以上、就中５０モル％以上が好ましい。In particular, diamine or diisocyanate 181 or 2
Contains a repeating unit represented by the following formula, which corresponds to a repeating unit in a polyimide formed by heat-treating a polyamic acid obtained by reacting one or more types of tetracarboxylic acid or its derivatives with Those that do are preferably used. The content is preferably 30 to 90 mol% in the case of polyamide-imide, and 30 mol% or more in the case of other polyimide resins, particularly preferably 50 mol% or more.
（ただし、ＲＩ Ｒ２は炭素数が４〜５０、就中６
〜２０の４価の脂肪族、脂環族、芳香族、又はへテロ環
構造の有機基である。）
前記のジアミンの例としては、メタフェニレンジアミン
、バラフェニレンジアミン、２，２−ビス（４−アミノ
フェニル〉プロパン、４．４’−ジアミノジフェニルメ
タン、４．４’−ジアミノジフェニルサルファイド、４
．４’−ジアミノジフェニルスルホン、３，３°−ジア
ミノジフェニルスルホン、４．４゛−ジアミノジフェニ
ルエーテル、２．６−ジアミツビリジン、ビス（４−ア
ミノフェニル）ジエチルシラン、ビス（４−アミノフェ
ニル）ジフェニルシラン、ベンジジン、３．３’−ジク
ロロベンジジン、３．３’−ジメトキシベンジジン、ビ
ス〈４−アミノフェニル〉エチルホスフィンオキサイド
、４，４″−ジアミノベンゾフェノン、ビス（４−アミ
ノフェニル〉フェニルホスフィンオキサイド、ビス（４
−アミノフェニル）−Ｎ−ブチラミン、ビス（４−アミ
ノフェニル）−Ｎ−メチラミン、１，５−ジアミノナフ
タレン、３．３’ジメチル−４，４°−ジアミノビフェ
ニル、Ｎ−（３−アミノフェニル）−４−アミノベンザ
ミド、４−アミノフェニル−３−アミノベンゾエート、
２゜４−ビス（β−アミノ−ｔ−ブチル〉トルエン、ビ
ス（ｐ−β−アミノ−ｔ−ブチルフェニル）エーテル、
ｐ−ビス（２−メチル−４−アミノペンチル）ベンゼン
、ｐ−ビス（１，１−ジメチル−５−アミノペンチル）
ベンゼン１、ｍ−キシリレンジアミン、ｐ−キシリレン
ジアミン、ビス（４−アミノフェニル）−Ｎ−７エニラ
ミンなどがあげられる。(However, RI R2 has 4 to 50 carbon atoms, especially 6
~20 tetravalent aliphatic, alicyclic, aromatic, or heterocyclic organic groups. ) Examples of the diamines mentioned above include metaphenylenediamine, paraphenylenediamine, 2,2-bis(4-aminophenyl>propane, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfide,
．． 4'-diaminodiphenylsulfone, 3,3°-diaminodiphenylsulfone, 4.4'-diaminodiphenyl ether, 2,6-diamitubiridine, bis(4-aminophenyl)diethylsilane, bis(4-aminophenyl)diphenylsilane, Benzidine, 3,3'-dichlorobenzidine, 3,3'-dimethoxybenzidine, bis<4-aminophenyl>ethylphosphine oxide, 4,4''-diaminobenzophenone, bis(4-aminophenyl>phenylphosphine oxide, bis( 4
-aminophenyl)-N-butyramine, bis(4-aminophenyl)-N-methylamine, 1,5-diaminonaphthalene, 3,3'dimethyl-4,4°-diaminobiphenyl, N-(3-aminophenyl) -4-aminobenzamide, 4-aminophenyl-3-aminobenzoate,
2゜4-bis(β-amino-t-butyl)toluene, bis(p-β-amino-t-butylphenyl)ether,
p-bis(2-methyl-4-aminopentyl)benzene, p-bis(1,1-dimethyl-5-aminopentyl)
Examples include benzene 1, m-xylylene diamine, p-xylylene diamine, and bis(4-aminophenyl)-N-7 enilamine.
ジイソシアネートの例としては、エチレンジイソシアネ
ート、１．４−テトラメチレンジイソシアネート、１．
６−へキサメチレンジイソシアネート、１．１２−ドデ
カンジイソシアネート、シクロブテン−１，３−ジイソ
シアネート、シクロヘキサン−１，３−ジイソシアネー
ト、シクロヘキサン−１，４−ジイソシアネート、１，
３−フェニレンジイソシアネート、１，４−フェニレン
ジイソシアネート、２．４−１リレンジイソシアネート
、２．６−１リレンジイソシアネートなどがあげられる
。Examples of diisocyanates include ethylene diisocyanate, 1,4-tetramethylene diisocyanate, 1.
6-hexamethylene diisocyanate, 1,12-dodecane diisocyanate, cyclobutene-1,3-diisocyanate, cyclohexane-1,3-diisocyanate, cyclohexane-1,4-diisocyanate, 1,
Examples include 3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2.4-1 lylene diisocyanate, 2.6-1 lylene diisocyanate, and the like.
テトラカルボン酸ないしその誘導体の例としては、ピロ
メリット酸無水物、２，３．６．７−ナフタレン−テト
ラカルボン酸無水物、１，２．５．６−ナフタレン−テ
トラカルボン酸無水物、３，４゜９、ＩＯ−ペリレン−
テトラカルボン酸二無水物、ナフタレン−１，２，４，
５−テトラカルボン酸二無水物、ナフタレン−１，４，
５，８−テトラカルボン酸二無水物、２，６−ジクロロ
ナフタレンー１．４，５，８−テトラカルボン酸二無水
物、２．７−シクロロナフタレンー１．４，５．８−テ
トラカルボン酸二無水物、２，３．６．７−テトラクロ
ロナフタレンー１．４，５．８−テトラカルボン酸二無
水物、フェナンスレン−１，８，９，ｔｏ−テトラカル
ボン酸二無水物、ピリジン−２，３，５，６−テトラカ
ルボン酸二無水物、ベンゼン−１，２，３゜４−テトラ
カルボン酸二無水物、チオフェン−２゜３．４．５−テ
トラカルボン酸二無水物などがあげられる。Examples of tetracarboxylic acids and derivatives thereof include pyromellitic anhydride, 2,3.6.7-naphthalene-tetracarboxylic anhydride, 1,2.5.6-naphthalene-tetracarboxylic anhydride, 3 ,4゜9,IO-perylene-
Tetracarboxylic dianhydride, naphthalene-1,2,4,
5-tetracarboxylic dianhydride, naphthalene-1,4,
5,8-tetracarboxylic dianhydride, 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-cyclonaphthalene-1,4,5,8-tetra Carboxylic dianhydride, 2,3.6.7-tetrachloronaphthalene-1.4,5.8-tetracarboxylic dianhydride, phenanthrene-1,8,9,to-tetracarboxylic dianhydride, Pyridine-2,3,5,6-tetracarboxylic dianhydride, benzene-1,2,3゜4-tetracarboxylic dianhydride, thiophene-2゜3.4.5-tetracarboxylic dianhydride etc.
前記の繰り返し単位を有するポリアミドイミドとしては
例えば、米国特許第２．４２１，０２４号明細書、米国
特許第３，１８２，０７３号明細書に記載のものや、ト
リメリット酸と上記ジイソシアネートとの反応物などが
あげられる。Examples of the polyamideimide having the above-mentioned repeating unit include those described in U.S. Pat. Things can be given.
また、前記の繰り返し単位を有する、ポリアミドイミド
以外のポリイミド系樹脂としては例えば米国特許第２．
７１０．８５３号明細書、米国特許第２，７１２゜５４
３号明細書、米国特許第２．７３１，４４７号明細書、
米国特許第２．８８０，２３０号明細書、米国特許第２
，９００．３６９号明細書に記載のポリイミド（前記繰
り返し単位の含有１ｔｏｏ％〉、米国特許第４．３２９
．３９７号明細書に記載のポリエステルイミドなどがあ
げられる。Examples of polyimide resins other than polyamideimide having the above-mentioned repeating units include those described in US Patent No. 2.
No. 710.853, U.S. Pat. No. 2,712.54
Specification No. 3, U.S. Patent No. 2,731,447,
U.S. Patent No. 2,880,230, U.S. Pat.
, 900.369 (containing 1too% of the repeating unit), US Pat. No. 4.329
．． Examples include polyesterimide described in the specification of No. 397.
なお、本発明のワニスにおけるポリアミドイミドないし
ポリイミド系樹脂には、加熱処理によりイミド環を形成
するアミド酸の状態にあるものも含む。Note that the polyamideimide or polyimide resin in the varnish of the present invention includes those in an amic acid state that forms an imide ring by heat treatment.
ワニスの調製は、ポリアミドイミド及び他のポリイミド
系樹脂の１種又は２種以上を、Ｎ−メチルピロリドンの
如き可溶性溶媒に溶解させることにより得ることができ
る。固形分濃度は適宜に決定してよいが、一般には１０
〜５０重量％とされる。The varnish can be prepared by dissolving one or more polyamide-imide and other polyimide resins in a soluble solvent such as N-methylpyrrolidone. The solid content concentration may be determined as appropriate, but is generally 10
~50% by weight.
本発明では厚猷り焼付が可能であるため、従来よりも固
形分濃度の高いワニスとして調製することもできる。Since thick baking is possible in the present invention, it is also possible to prepare a varnish with a higher solid content concentration than conventional varnishes.
本発明のワニスは、各種線材の焼付被覆層等の形成に好
ましく用いうる。その線材としては例えば鉄線を被覆し
てなる鉄系等のコントロール線、光ファイバないしそれ
を束ねたイメージガイド、各種の巻線などがあげられる
。焼付層を付与する目的も適宜であってよい。例えばコ
ントロール線や巻線等の場合には錆止め、撚線のキシミ
防止、エンジン回り等の高温雰囲気下での酸化劣化の防
止などに有用である。また光ファイバないしイメージガ
イド等の場合には熱劣化の防止などに有用である。The varnish of the present invention can be preferably used for forming baked coating layers of various wire rods. Examples of such wires include iron-based control wires made of coated iron wires, optical fibers or image guides made of optical fibers bundled together, and various types of winding wires. The purpose of providing the baked layer may be arbitrary. For example, in the case of control wires, winding wires, etc., it is useful for preventing rust, preventing stranded wires from squeaking, and preventing oxidative deterioration in high-temperature atmospheres such as those around engines. It is also useful for preventing thermal deterioration in the case of optical fibers, image guides, etc.
焼付層の形成は、例えば処理対象の線材にワニスを塗布
して所定の温度で焼付処理する方式など従来に準じ行っ
てよいが、その場合に本発明のワニスでは１０〇四程度
に厚塗り塗布しても目的を達成することができる。焼付
温度は、塗膜厚や加熱時間等により適宜に決定してよい
が、一般には２５０〜４５０℃とされる。The baking layer may be formed in a conventional manner, such as by applying varnish to the wire material to be treated and baking it at a predetermined temperature. You can still achieve your goal. The baking temperature may be appropriately determined depending on the coating thickness, heating time, etc., but is generally 250 to 450°C.
発明の効果
本発明によれば、ポリアミドイミドを所定の割合で併用
したので、発泡を伴うことなく厚塗り焼付けすることが
できるポリイミド系ワニスを得ることができ、耐熱性に
優れるポリイミド系樹脂からなる厚い焼付層を効率よく
形成することができる。Effects of the Invention According to the present invention, since polyamide-imide is used in a predetermined ratio, it is possible to obtain a polyimide-based varnish that can be coated thickly and baked without foaming, and is made of a polyimide-based resin with excellent heat resistance. A thick baked layer can be efficiently formed.
実施例
実施例１〜９．比較例１，２
表に示したポリイミド系樹脂をＮ−メチルピロリドンに
溶解させて得た固形分濃度２５重量％のワニス浴に、直
径０．８ｍｍの鉄線を導入してワニスを塗布し、
４００℃で焼付処理して形成された焼付層を観察評価し
、
その結果を表に示した。Examples Examples 1 to 9. Comparative Examples 1 and 2 An iron wire with a diameter of 0.8 mm was introduced into a varnish bath with a solid content concentration of 25% by weight obtained by dissolving the polyimide resin shown in the table in N-methylpyrrolidone, and a varnish was applied. The baked layer formed by baking at ℃ was observed and evaluated, and the results are shown in the table.
なお前記 焼付層の厚さは６０同であった。In addition, the above The thickness of the baked layer was 60 mm.
＊１：日立化成社製、Ｈ１−４０５（イミド基含有量５
０モル％）
＊２：ポリイミド：米国デュポン社製、 Ｐｙｒｅ
ＭＬ（イミド基含有量１００モル％）
＊３：束特塗料社製、ネオヒートＡＩ（イミド基含有量
５０モル％）
＊４：日東電工社製、デラコートＡ Ｉ −５００（イ
ミド基含有量５０モル％〉
＊５：ポリイミド：東し社製、トレニース＃３０００（
イミド基含有量１００モル％）
＊６：ポリエーテルイミド：ＧＥ社製、ウルテム（イミ
ド基含有量５０モル％〉*1: Manufactured by Hitachi Chemical Co., Ltd., H1-405 (imide group content 5
0 mol%) *2: Polyimide: Pyre, manufactured by DuPont, USA
ML (Imide group content: 100 mol%) *3: Neoheat AI (imide group content: 50 mol%), manufactured by Tsukutoku Toyo Co., Ltd. *4: Delacoat AI-500, manufactured by Nitto Denko Co., Ltd. (imide group content: 50 mol%) %> *5: Polyimide: Toshisha Co., Ltd., Trenice #3000 (
(Imide group content: 100 mol%) *6: Polyetherimide: Manufactured by GE, Ultem (Imide group content: 50 mol%)
Claims (1)
なり、ポリアミドイミドの使用割合が全ポリマ中の１０
〜５０重量％であることを特徴とするワニス。1. Made using polyamide-imide and other polyimide resins, the proportion of polyamide-imide used in the total polymer is 10%.
A varnish characterized in that it is ~50% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31705389A JPH03177469A (en) | 1989-12-05 | 1989-12-05 | Varnish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31705389A JPH03177469A (en) | 1989-12-05 | 1989-12-05 | Varnish |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03177469A true JPH03177469A (en) | 1991-08-01 |
Family
ID=18083894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31705389A Pending JPH03177469A (en) | 1989-12-05 | 1989-12-05 | Varnish |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03177469A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4831480A (en) * | 1971-08-27 | 1973-04-25 | ||
| JPS5082133A (en) * | 1973-10-30 | 1975-07-03 | ||
| JPS5653149A (en) * | 1979-07-19 | 1981-05-12 | Upjohn Co | Polymer blend* solution and film |
| JPS5834828A (en) * | 1981-08-25 | 1983-03-01 | ゼネラル・エレクトリック・カンパニイ | Blend of polyether imide and polyamide imide |
| JPS60240760A (en) * | 1984-05-16 | 1985-11-29 | Toray Ind Inc | Heat-resistant thermoplastic resin composition |
| JPS63224771A (en) * | 1987-03-16 | 1988-09-19 | Tamura Kaken Kk | Formation of polyimide resin film |
| JPS63305166A (en) * | 1987-06-05 | 1988-12-13 | Mitsui Toatsu Chem Inc | Polyimide resin composition |
| JPS6440570A (en) * | 1987-08-06 | 1989-02-10 | Hitachi Chemical Co Ltd | Polyamidimide resin paste |
| JPH02115265A (en) * | 1988-10-24 | 1990-04-27 | Toyobo Co Ltd | Heat-resistant film and its laminate |
| JPH02289646A (en) * | 1988-12-29 | 1990-11-29 | Hitachi Chem Co Ltd | Heat-resistant resin paste and ic using same paste |
| JPH03115478A (en) * | 1989-09-29 | 1991-05-16 | Showa Electric Wire & Cable Co Ltd | Insulating coating material and insulated wire |
-
1989
- 1989-12-05 JP JP31705389A patent/JPH03177469A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4831480A (en) * | 1971-08-27 | 1973-04-25 | ||
| JPS5082133A (en) * | 1973-10-30 | 1975-07-03 | ||
| JPS5653149A (en) * | 1979-07-19 | 1981-05-12 | Upjohn Co | Polymer blend* solution and film |
| JPS5834828A (en) * | 1981-08-25 | 1983-03-01 | ゼネラル・エレクトリック・カンパニイ | Blend of polyether imide and polyamide imide |
| JPS60240760A (en) * | 1984-05-16 | 1985-11-29 | Toray Ind Inc | Heat-resistant thermoplastic resin composition |
| JPS63224771A (en) * | 1987-03-16 | 1988-09-19 | Tamura Kaken Kk | Formation of polyimide resin film |
| JPS63305166A (en) * | 1987-06-05 | 1988-12-13 | Mitsui Toatsu Chem Inc | Polyimide resin composition |
| JPS6440570A (en) * | 1987-08-06 | 1989-02-10 | Hitachi Chemical Co Ltd | Polyamidimide resin paste |
| JPH02115265A (en) * | 1988-10-24 | 1990-04-27 | Toyobo Co Ltd | Heat-resistant film and its laminate |
| JPH02289646A (en) * | 1988-12-29 | 1990-11-29 | Hitachi Chem Co Ltd | Heat-resistant resin paste and ic using same paste |
| JPH03115478A (en) * | 1989-09-29 | 1991-05-16 | Showa Electric Wire & Cable Co Ltd | Insulating coating material and insulated wire |
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