JPS6440570A - Polyamidimide resin paste - Google Patents

Polyamidimide resin paste

Info

Publication number
JPS6440570A
JPS6440570A JP19665787A JP19665787A JPS6440570A JP S6440570 A JPS6440570 A JP S6440570A JP 19665787 A JP19665787 A JP 19665787A JP 19665787 A JP19665787 A JP 19665787A JP S6440570 A JPS6440570 A JP S6440570A
Authority
JP
Japan
Prior art keywords
pref
resin
polyamidimide
fine particles
dispersing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19665787A
Other languages
Japanese (ja)
Inventor
Hiroshi Nishizawa
Kenji Suzuki
Yoshiyuki Mukoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP19665787A priority Critical patent/JPS6440570A/en
Publication of JPS6440570A publication Critical patent/JPS6440570A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

PURPOSE:To obtain the titled inexpensive paste having specific thixotropy coefficient, outstanding in film-formability at low temperatures suitable for the forming of alpha-ray shielding film for semiconductor chips, by dispersing resin fine particles in a polyamidimide resin solution. CONSTITUTION:The objective paste with a thixotropy coefficient of >=1.5 can be obtained by dispersing (A) a polyamidimide resin solution prepared by dissolving (i) a polyamidimide resin (pref. from reactive acid derivative from trimellitic anhydride and diamine or diisocyanate) in (ii) a solvent (pref. N- methylpyrrolidone) so as to be pref. 10-40wt.% for the concentration with (B) pref. 5-40wt.% based on said solution, of resin fine particles (pref. consisting of aromatic polyimide resin with an average size of <=30mum, maximum size of <=40mum tap bulk density of <=0.8g/cm<3> and specific surface area of >=1m<2>/g, of spherical shape).
JP19665787A 1987-08-06 1987-08-06 Polyamidimide resin paste Pending JPS6440570A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19665787A JPS6440570A (en) 1987-08-06 1987-08-06 Polyamidimide resin paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19665787A JPS6440570A (en) 1987-08-06 1987-08-06 Polyamidimide resin paste

Publications (1)

Publication Number Publication Date
JPS6440570A true JPS6440570A (en) 1989-02-10

Family

ID=16361425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19665787A Pending JPS6440570A (en) 1987-08-06 1987-08-06 Polyamidimide resin paste

Country Status (1)

Country Link
JP (1) JPS6440570A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03177469A (en) * 1989-12-05 1991-08-01 Mitsubishi Cable Ind Ltd Varnish
EP0984051A4 (en) * 1997-05-30 2001-12-05 Hitachi Chemical Co Ltd Heat-resistant adhesives and semiconductor devices produced therewith

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03177469A (en) * 1989-12-05 1991-08-01 Mitsubishi Cable Ind Ltd Varnish
EP0984051A4 (en) * 1997-05-30 2001-12-05 Hitachi Chemical Co Ltd Heat-resistant adhesives and semiconductor devices produced therewith

Similar Documents

Publication Publication Date Title
JPS6486574A (en) Superconducting device
EP0261430A3 (en) Biaxially oriented polyester film
JPS6440570A (en) Polyamidimide resin paste
JPS57143329A (en) Photosensitive resin and its production
EP0553581A3 (en) Transparent amorphous compositions with improved resistance to chemical agents
JPS6436649A (en) Polyamidimide resin paste
JPS57200452A (en) Preparation of polyimide powder
JPS6416833A (en) Polyamic acid copolymer, polyimide copolymer therefrom and production thereof
JPS57180633A (en) Curable polyimide resin composition
JPS5744618A (en) Preparation of polyimide copolymer
JPS5753559A (en) Resin composition containing polyamideimide resin
JPS5614517A (en) Production of polyamideimide
JPS55165915A (en) Thermosetting resin composition
JPS641750A (en) Resin dispersion
JPS5728128A (en) Heat-resistant composition
JPS52108497A (en) Preparation of polyimide resins
DORMAN et al. Variability of the magnetic field in high-velocity streams of the solar wind
Creuzet et al. Thermal Expansion and Spin Density Fluctuations in TiBe sub 2--x Cu sub x Itinerant Ferromagnets
Takeuchi Crystal Structure and Plasticity of Intermetallic Compounds.(Retroactive Coverage)
Lyman Packaging rules components conference.
Gannett et al. Melt-Fusible Copolyimides
JPS56110720A (en) Preparation of polyester of high polymerization degree
Kobayashi et al. Reduction of DX center concentration in Al sub (0. 3) Ga sub (0. 7) As with In.
JPS57190040A (en) Polyester composition
Tarenkov et al. Observation of Vortex Structures in the Vicinity of the Resistive Transition in Granular Aluminium Films