JPH0317628U - - Google Patents

Info

Publication number
JPH0317628U
JPH0317628U JP7755989U JP7755989U JPH0317628U JP H0317628 U JPH0317628 U JP H0317628U JP 7755989 U JP7755989 U JP 7755989U JP 7755989 U JP7755989 U JP 7755989U JP H0317628 U JPH0317628 U JP H0317628U
Authority
JP
Japan
Prior art keywords
resin
resin sealing
load
reaction force
difference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7755989U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7755989U priority Critical patent/JPH0317628U/ja
Publication of JPH0317628U publication Critical patent/JPH0317628U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP7755989U 1989-06-30 1989-06-30 Pending JPH0317628U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7755989U JPH0317628U (enrdf_load_stackoverflow) 1989-06-30 1989-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7755989U JPH0317628U (enrdf_load_stackoverflow) 1989-06-30 1989-06-30

Publications (1)

Publication Number Publication Date
JPH0317628U true JPH0317628U (enrdf_load_stackoverflow) 1991-02-21

Family

ID=31620060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7755989U Pending JPH0317628U (enrdf_load_stackoverflow) 1989-06-30 1989-06-30

Country Status (1)

Country Link
JP (1) JPH0317628U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008531965A (ja) * 2005-02-23 2008-08-14 アイ・ディ・イー・テクノロジーズ・リミテッド 冷媒として水を使用する小型ヒートポンプ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008531965A (ja) * 2005-02-23 2008-08-14 アイ・ディ・イー・テクノロジーズ・リミテッド 冷媒として水を使用する小型ヒートポンプ

Similar Documents

Publication Publication Date Title
MY129530A (en) A method of and apparatus for aligning the bonding head of an apparatus for bonding semiconductor chips to a career material
US5340011A (en) Adjustable height work holder for bonding semiconductor dies
JPH0317628U (enrdf_load_stackoverflow)
US6505823B2 (en) Apparatus for positioning a semiconductor pellet
KR19990082843A (ko) 반도체 다이본다용 위치인식과 검사장치 및 그 방법
JPH01129827U (enrdf_load_stackoverflow)
CN212402469U (zh) 一种依靠杠杆送料的半导体元件包装后的下料设备
CN223014176U (zh) 一种芯片db和金线wb的2d和3d视觉检测机构及其喷墨定位机构
JP2002164361A (ja) 半導体製造装置および半導体製造方法
CN223011191U (zh) 一种芯片db和金线wb的2d和3d视觉检测机构
JPS635228Y2 (enrdf_load_stackoverflow)
CN212907662U (zh) 一种固晶一体机的刷胶合片机构
KR200150084Y1 (ko) 와이어 본딩장비의 피더
JPS6424840U (enrdf_load_stackoverflow)
JPS6359134U (enrdf_load_stackoverflow)
JPS6318836U (enrdf_load_stackoverflow)
JPS625144U (enrdf_load_stackoverflow)
JPS6324833U (enrdf_load_stackoverflow)
JPH02105429A (ja) リードフレーム供給装置
JP4694381B2 (ja) ワーククランプ装置
KR200303026Y1 (ko) 반도체 다이본딩 장비의 보트 로딩불량 검출장치
CN112374133A (zh) 一种金属卡扣上料机构
JPS6015954A (ja) フレ−ム付け装置
JPS6312832U (enrdf_load_stackoverflow)
JPH0260246U (enrdf_load_stackoverflow)