JPH03169547A - Laminate - Google Patents
LaminateInfo
- Publication number
- JPH03169547A JPH03169547A JP30858089A JP30858089A JPH03169547A JP H03169547 A JPH03169547 A JP H03169547A JP 30858089 A JP30858089 A JP 30858089A JP 30858089 A JP30858089 A JP 30858089A JP H03169547 A JPH03169547 A JP H03169547A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- laminate
- soft
- polypropylene
- ethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 polypropylene Polymers 0.000 claims abstract description 83
- 239000004743 Polypropylene Substances 0.000 claims abstract description 80
- 229920001155 polypropylene Polymers 0.000 claims abstract description 77
- 239000000463 material Substances 0.000 claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 13
- 239000004744 fabric Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229920001971 elastomer Polymers 0.000 claims abstract description 6
- 239000005060 rubber Substances 0.000 claims abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- 229920000298 Cellophane Polymers 0.000 claims abstract description 5
- 239000000123 paper Substances 0.000 claims abstract description 5
- 239000002023 wood Substances 0.000 claims abstract description 5
- 239000010985 leather Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 abstract description 72
- 238000006116 polymerization reaction Methods 0.000 abstract description 63
- 229920000642 polymer Polymers 0.000 abstract description 20
- 239000002002 slurry Substances 0.000 abstract description 12
- 229920005604 random copolymer Polymers 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 abstract description 5
- 239000012808 vapor phase Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 54
- 150000001875 compounds Chemical class 0.000 description 52
- 239000007787 solid Substances 0.000 description 32
- 239000003054 catalyst Substances 0.000 description 28
- 229920001577 copolymer Polymers 0.000 description 25
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 23
- 230000001070 adhesive effect Effects 0.000 description 23
- 239000007789 gas Substances 0.000 description 21
- 239000011949 solid catalyst Substances 0.000 description 20
- 150000001491 aromatic compounds Chemical class 0.000 description 17
- 239000010936 titanium Substances 0.000 description 17
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 16
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 16
- 229910052719 titanium Inorganic materials 0.000 description 15
- 125000003545 alkoxy group Chemical group 0.000 description 14
- 229910052782 aluminium Inorganic materials 0.000 description 14
- 125000004432 carbon atom Chemical group C* 0.000 description 13
- 150000002681 magnesium compounds Chemical class 0.000 description 13
- 150000003609 titanium compounds Chemical class 0.000 description 13
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000011777 magnesium Substances 0.000 description 10
- 229910052749 magnesium Inorganic materials 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 239000005022 packaging material Substances 0.000 description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 8
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 8
- 230000003197 catalytic effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 7
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 7
- 239000004677 Nylon Substances 0.000 description 7
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 7
- 238000007334 copolymerization reaction Methods 0.000 description 7
- 229920001778 nylon Polymers 0.000 description 7
- 150000004291 polyenes Polymers 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001336 alkenes Chemical class 0.000 description 6
- 238000009835 boiling Methods 0.000 description 6
- MGWAVDBGNNKXQV-UHFFFAOYSA-N diisobutyl phthalate Chemical compound CC(C)COC(=O)C1=CC=CC=C1C(=O)OCC(C)C MGWAVDBGNNKXQV-UHFFFAOYSA-N 0.000 description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 6
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 125000005843 halogen group Chemical group 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000004711 α-olefin Substances 0.000 description 5
- XWJBRBSPAODJER-UHFFFAOYSA-N 1,7-octadiene Chemical compound C=CCCCCC=C XWJBRBSPAODJER-UHFFFAOYSA-N 0.000 description 4
- SHSGDXCJYVZFTP-UHFFFAOYSA-N 4-ethoxybenzoic acid Chemical compound CCOC1=CC=C(C(O)=O)C=C1 SHSGDXCJYVZFTP-UHFFFAOYSA-N 0.000 description 4
- ZYEMGPIYFIJGTP-UHFFFAOYSA-N O-methyleugenol Chemical compound COC1=CC=C(CC=C)C=C1OC ZYEMGPIYFIJGTP-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 4
- 239000001273 butane Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 150000002170 ethers Chemical class 0.000 description 4
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 4
- 150000004820 halides Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 239000005711 Benzoic acid Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 235000010233 benzoic acid Nutrition 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 3
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 3
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000012685 gas phase polymerization Methods 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000005001 laminate film Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920006122 polyamide resin Polymers 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920005629 polypropylene homopolymer Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 3
- 229940030010 trimethoxybenzene Drugs 0.000 description 3
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 2
- OHBQPCCCRFSCAX-UHFFFAOYSA-N 1,4-Dimethoxybenzene Chemical compound COC1=CC=C(OC)C=C1 OHBQPCCCRFSCAX-UHFFFAOYSA-N 0.000 description 2
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 2
- QSZCGGBDNYTQHH-UHFFFAOYSA-N 2,3-dimethoxyphenol Chemical compound COC1=CC=CC(O)=C1OC QSZCGGBDNYTQHH-UHFFFAOYSA-N 0.000 description 2
- PETRWTHZSKVLRE-UHFFFAOYSA-N 2-Methoxy-4-methylphenol Chemical compound COC1=CC(C)=CC=C1O PETRWTHZSKVLRE-UHFFFAOYSA-N 0.000 description 2
- WNZQDUSMALZDQF-UHFFFAOYSA-N 2-benzofuran-1(3H)-one Chemical compound C1=CC=C2C(=O)OCC2=C1 WNZQDUSMALZDQF-UHFFFAOYSA-N 0.000 description 2
- ASHGTJPOSUFTGB-UHFFFAOYSA-N 3-methoxyphenol Chemical compound COC1=CC=CC(O)=C1 ASHGTJPOSUFTGB-UHFFFAOYSA-N 0.000 description 2
- ZEYHEAKUIGZSGI-UHFFFAOYSA-N 4-methoxybenzoic acid Chemical compound COC1=CC=C(C(O)=O)C=C1 ZEYHEAKUIGZSGI-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- ZFMSMUAANRJZFM-UHFFFAOYSA-N Estragole Chemical compound COC1=CC=C(CC=C)C=C1 ZFMSMUAANRJZFM-UHFFFAOYSA-N 0.000 description 2
- FHUODBDRWMIBQP-UHFFFAOYSA-N Ethyl p-anisate Chemical compound CCOC(=O)C1=CC=C(OC)C=C1 FHUODBDRWMIBQP-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 150000004791 alkyl magnesium halides Chemical class 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- SESFRYSPDFLNCH-UHFFFAOYSA-N benzyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC1=CC=CC=C1 SESFRYSPDFLNCH-UHFFFAOYSA-N 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- XSIFPSYPOVKYCO-UHFFFAOYSA-N butyl benzoate Chemical compound CCCCOC(=O)C1=CC=CC=C1 XSIFPSYPOVKYCO-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- RRAFCDWBNXTKKO-UHFFFAOYSA-N eugenol Chemical compound COC1=CC(CC=C)=CC=C1O RRAFCDWBNXTKKO-UHFFFAOYSA-N 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- NUJGJRNETVAIRJ-UHFFFAOYSA-N octanal Chemical compound CCCCCCCC=O NUJGJRNETVAIRJ-UHFFFAOYSA-N 0.000 description 2
- YLYBTZIQSIBWLI-UHFFFAOYSA-N octyl acetate Chemical compound CCCCCCCCOC(C)=O YLYBTZIQSIBWLI-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000004627 transmission electron microscopy Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UHHCYAAVGADGGP-HTQZYQBOSA-N (1s,2s)-1,2-bis(ethenyl)cyclobutane Chemical compound C=C[C@@H]1CC[C@H]1C=C UHHCYAAVGADGGP-HTQZYQBOSA-N 0.000 description 1
- RWPFLARVZWFRBO-DAIXLEOSSA-N (2R,3R)-2-(2,4-difluorophenyl)-1-(1,2,4-triazol-1-yl)butane-2,3-diol methanesulfonic acid Chemical compound CS(O)(=O)=O.C[C@@H](O)[C@](O)(Cn1cncn1)c1ccc(F)cc1F RWPFLARVZWFRBO-DAIXLEOSSA-N 0.000 description 1
- BJMLLSSSTGHJJE-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzoate Chemical compound C1=CC(C)=CC=C1C(=O)OC(=O)C1=CC=C(C)C=C1 BJMLLSSSTGHJJE-UHFFFAOYSA-N 0.000 description 1
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- RJUCIROUEDJQIB-GQCTYLIASA-N (6e)-octa-1,6-diene Chemical compound C\C=C\CCCC=C RJUCIROUEDJQIB-GQCTYLIASA-N 0.000 description 1
- GYPMBQZAVBFUIZ-UHFFFAOYSA-N 1,2-dimethoxy-4-methylbenzene Chemical compound COC1=CC=C(C)C=C1OC GYPMBQZAVBFUIZ-UHFFFAOYSA-N 0.000 description 1
- DPZNOMCNRMUKPS-UHFFFAOYSA-N 1,3-Dimethoxybenzene Chemical compound COC1=CC=CC(OC)=C1 DPZNOMCNRMUKPS-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- OSIGJGFTADMDOB-UHFFFAOYSA-N 1-Methoxy-3-methylbenzene Chemical compound COC1=CC=CC(C)=C1 OSIGJGFTADMDOB-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- YRGAYAGBVIXNAQ-UHFFFAOYSA-N 1-chloro-4-methoxybenzene Chemical compound COC1=CC=C(Cl)C=C1 YRGAYAGBVIXNAQ-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
- BQMLWEKOSHSOFT-UHFFFAOYSA-N 1-ethoxy-2,2-dimethylpropane Chemical compound CCOCC(C)(C)C BQMLWEKOSHSOFT-UHFFFAOYSA-N 0.000 description 1
- POXXQVSKWJPZNO-UHFFFAOYSA-N 1-o-ethyl 2-o-(2-methylpropyl) benzene-1,2-dicarboxylate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC(C)C POXXQVSKWJPZNO-UHFFFAOYSA-N 0.000 description 1
- YNOQMANFEGIPDL-UHFFFAOYSA-N 1-o-ethyl 2-o-propyl benzene-1,2-dicarboxylate Chemical compound CCCOC(=O)C1=CC=CC=C1C(=O)OCC YNOQMANFEGIPDL-UHFFFAOYSA-N 0.000 description 1
- LCICHIHLCDAKBX-UHFFFAOYSA-N 1-o-ethyl 3-o-(2-methylpropyl) benzene-1,3-dicarboxylate Chemical compound CCOC(=O)C1=CC=CC(C(=O)OCC(C)C)=C1 LCICHIHLCDAKBX-UHFFFAOYSA-N 0.000 description 1
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- 150000002901 organomagnesium compounds Chemical class 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- FCJSHPDYVMKCHI-UHFFFAOYSA-N phenyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OC1=CC=CC=C1 FCJSHPDYVMKCHI-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920000131 polyvinylidene Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920006302 stretch film Polymers 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- HVZJRWJGKQPSFL-UHFFFAOYSA-N tert-Amyl methyl ether Chemical compound CCC(C)(C)OC HVZJRWJGKQPSFL-UHFFFAOYSA-N 0.000 description 1
- NUMQCACRALPSHD-UHFFFAOYSA-N tert-butyl ethyl ether Chemical compound CCOC(C)(C)C NUMQCACRALPSHD-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ADLSSRLDGACTEX-UHFFFAOYSA-N tetraphenyl silicate Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(OC=1C=CC=CC=1)OC1=CC=CC=C1 ADLSSRLDGACTEX-UHFFFAOYSA-N 0.000 description 1
- 150000007970 thio esters Chemical class 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- UBZYKBZMAMTNKW-UHFFFAOYSA-J titanium tetrabromide Chemical compound Br[Ti](Br)(Br)Br UBZYKBZMAMTNKW-UHFFFAOYSA-J 0.000 description 1
- NLLZTRMHNHVXJJ-UHFFFAOYSA-J titanium tetraiodide Chemical compound I[Ti](I)(I)I NLLZTRMHNHVXJJ-UHFFFAOYSA-J 0.000 description 1
- DPNUIZVZBWBCPB-UHFFFAOYSA-J titanium(4+);tetraphenoxide Chemical compound [Ti+4].[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1 DPNUIZVZBWBCPB-UHFFFAOYSA-J 0.000 description 1
- ZFDIRQKJPRINOQ-UHFFFAOYSA-N transbutenic acid ethyl ester Natural products CCOC(=O)C=CC ZFDIRQKJPRINOQ-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- LFXVBWRMVZPLFK-UHFFFAOYSA-N trioctylalumane Chemical compound CCCCCCCC[Al](CCCCCCCC)CCCCCCCC LFXVBWRMVZPLFK-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、各種製品の外装および内装材料、農業用フィ
ルム、鋼材被覆材料等として好適な積層体に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a laminate suitable for use as exterior and interior materials for various products, agricultural films, steel coating materials, and the like.
[従来の技術]
従来、ホモタイプおよびソロックタイプのボリプロビレ
ン樹脂(PP)は各種のものが知られており、それらP
Pと他の材料とを組合せてなるシート材や包装材等が種
々の分野において利用されている.
[発明が解決すべき問題点]
しかしながら,従来のボリプロビレン樹脂は、一般に溶
着温度が160″C以上と高く、しかも曲げ弾性率か9
0 0 0 kg/c1以上で硬い性質を有していた
。したかって,従来のポリプロピレン樹脂を含む積層体
により形成されたシート材や包装材等は、ヒートシール
性が悪く,シかも柔軟性に欠けるため、使用対象によっ
ては必ずしも取扱いが容易なものではなかった。また、
従来は各材料間のシーラントととして、直釦状低密度ポ
リエチレン(LLDPE)を使用していたか,耐熱温度
が115〜125゜Cと低く、そのため使用対魚か限定
される場合があった.
そこで、本発明は、低温ヒートシール性が良好で、柔軟
性に富み,しかも耐熱性に優れた積層体の提供を目的と
する,
[3題を解決するための手段コ
本発明は、前記目的を達戊するために鋭意検討を行った
結果、特定のポリプロピレン樹脂を使用して積層体をa
處することにより、溶着温度を下げることかてき、適度
な柔軟性と優れた#熱性を有して前記課題を解決できる
ことを見出し、この知見に基づいて本発明を完成するに
至った。[Prior art] Various homotype and Solock type polypropylene resins (PP) have been known, and these P
Sheets and packaging materials made by combining P and other materials are used in various fields. [Problems to be solved by the invention] However, conventional polypropylene resins generally have a high welding temperature of 160"C or higher, and have a flexural modulus of 9.
It had hard properties at 0 0 0 kg/c1 or more. Therefore, sheet materials, packaging materials, etc. formed from conventional laminates containing polypropylene resin have poor heat-sealability and lack flexibility, making them not necessarily easy to handle depending on the intended use. . Also,
Conventionally, straight-button low-density polyethylene (LLDPE) has been used as a sealant between each material, and its heat resistance is as low as 115-125°C, which may limit its use with fish. Therefore, the present invention aims to provide a laminate that has good low-temperature heat sealability, is highly flexible, and has excellent heat resistance. As a result of intensive research to achieve
The inventors have found that by lowering the welding temperature, the above problems can be solved by providing appropriate flexibility and excellent thermal properties, and based on this knowledge, the present invention has been completed.
すなわち、本発明の積層体は、少なくとも一つの材料層
を軟質ボリプロビレンを主体として形成されてなること
を#徴とする。また、本発明の実施悪様として、少なく
とも熱可塑性樹脂または熱硬化性樹脂のうちいずれか一
つからなる材料層を含むものであってもよい.あるいは
、少なくとも金属、ゴム,布、紙、木、セロハン、また
は皮革のうちいずれか一つからなる材料層を含むもので
あってもよい.
本明細書において「軟質ボリプロビレン」とは,以下の
(1)〜(4)に記載のホモ重合体、または共重合体、
更にはそれら重合体を含有するMX戒物のいずれかを意
味する.
( 1 ) (i)固右粘度か1.2d文/g以上であ
る沸騰へブタン可溶性ボリプロビレン10〜90重量%
と(ii)固有粘度か0.5〜9.Od文/gてある沸
騰へブタン不溶性ポリプロピレン90〜10重量%とか
らなるボリブロビレン系重合体(a),( 2 ) (
i)α−オレフィン単位含有量が0.1〜5モル%であ
り、(ii)固有粘度が1.2d l / g以上であ
る沸騰ヘキサン可溶分が20〜99.9重量%であり、
そして(ii+)引張弾性率が5 0 0 0 Kg/
c1以下である、プロピレンと炭素数4〜30のα−オ
レフィンとのランダム共重合体(b)、
(3)(i)@記ポリプロピレン系重合体(a)lO〜
95重量%と. (ii)エチレン単位含有量が10〜
60モル%て、固右粘度が0.5〜7.0dl7gであ
るエチレンープロピレン共重合体(c)及び/又は
(ii)エチレン単位含有量が10〜60モル%て、ボ
リエン単位含有量が1〜10モル%で、固有粘度が0.
5〜7.Odi/gであるエチレンープロピレンーボリ
エン共重合体(c’ )90〜5重量%とからなるブロ
ビレン系!l戒物(d)、および(4)(i)前記ラン
ダム共重合体(b)10〜95重量%と. (ii)前
記エチレンーブロビレン共重合体(C)及び/又はエチ
レンープロピレンーボリエン共重合体(c’)90〜5
瓜量%とからなるプロピレン系組戊物(e)。That is, the laminate of the present invention is characterized in that at least one material layer is formed mainly from soft polypropylene. Further, as a mode of implementation of the present invention, it may include a material layer made of at least one of thermoplastic resin or thermosetting resin. Alternatively, it may include a material layer made of at least one of metal, rubber, cloth, paper, wood, cellophane, or leather. In this specification, "soft polypropylene" refers to homopolymers or copolymers described in (1) to (4) below,
Furthermore, it means any of the MX precepts containing these polymers. (1) (i) 10 to 90% by weight of boiling butane-soluble polypropylene with a solid viscosity of 1.2 dm/g or more
and (ii) an intrinsic viscosity of 0.5 to 9. Polypropylene polymer (a), (2) (
i) α-olefin unit content is 0.1 to 5 mol%, (ii) boiling hexane soluble content having an intrinsic viscosity of 1.2 dl/g or more is 20 to 99.9% by weight,
and (ii+) the tensile modulus is 5 0 0 0 Kg/
Random copolymer of propylene and α-olefin having 4 to 30 carbon atoms (b), (3) (i) @ polypropylene polymer (a) 1O~
95% by weight. (ii) Ethylene unit content is 10~
Ethylene-propylene copolymer (c) having an ethylene unit content of 60 mol% and a solid viscosity of 0.5 to 7.0 dl7g and/or (ii) an ethylene unit content of 10 to 60 mol% and a polyene unit content of 1 to 10 mol%, and the intrinsic viscosity is 0.
5-7. A brobylene system consisting of 90 to 5% by weight of ethylene-propylene-borien copolymer (c') with Odi/g! (d), and (4) (i) 10 to 95% by weight of the random copolymer (b). (ii) The ethylene-propylene copolymer (C) and/or the ethylene-propylene-boriene copolymer (c') 90-5
A propylene-based composite (e) consisting of a melon amount%.
なお、前記のポリプロピレン系重合体(a)は次の性質
(i)〜( iv)を有しているものが特に好ましい.
( i) ” G:−NMRによるベンタッド分率にお
いて、rrrr/1−msamが20%以上である.(
ii)示差8量分析計(DSC)にてΔI4定した融解
ピーク温度(Tm)が150’C以上である.(iii
)DSCにて測定した融解エンタルピー(△H)か1
0 0 J/g以下てある。In addition, it is particularly preferable that the polypropylene polymer (a) has the following properties (i) to (iv). (i) ``G:-In the bentad fraction by NMR, rrrr/1-msam is 20% or more. (
ii) The melting peak temperature (Tm) determined by ΔI4 using a differential octometer (DSC) is 150'C or higher. (iii
) Enthalpy of fusion (△H) measured by DSC or 1
It is less than 0 0 J/g.
( iv)透過型電子顕微鏡での観察において、ドメイ
ン構造か観察される.
本発明で用いる軟質ポリプロピレンのうち、前記のポリ
プロピレン系重合体(a)及びランダム共重合体(b)
は、例えば,以下に記載の気相1段重合法又はスラリー
l段重合法のいずれかによってyJ製することができる
。以下、それらの調製法について順に説明する.
笈紅工里盈亘丑
気相1段重合法で用いる触媒系は,例えば、( ■)
(i)結晶性ポリオレフィンと(ii)マグネシウム、
チタン、ハロゲン原子および電子供与性化合物からなる
固体触媒戒分とからなる固体成分、
(■)有機アルミニウム化合物
(m)アルコキシ基含有芳香族化合物,および(IV)
電子供与性化合物
の組合せからなる.
前記の固体戒分(I)は、結晶性ポリオレ7イン(i)
lffii部に対して固体触媒戒分(ii)を0.00
5〜30重量部(好ましくは0.02へlO′rfLf
fi部)の割合て含んでなる。(iv) Domain structure is observed in transmission electron microscopy. Among the flexible polypropylenes used in the present invention, the above-mentioned polypropylene polymer (a) and random copolymer (b)
can be produced by yJ, for example, by either the gas phase one-stage polymerization method or the slurry one-stage polymerization method described below. The preparation methods for these will be explained in order below. The catalyst system used in the gas phase one-stage polymerization method is, for example, (■)
(i) crystalline polyolefin and (ii) magnesium;
A solid component consisting of titanium, a halogen atom, and a solid catalyst component consisting of an electron-donating compound, (■) an organoaluminum compound (m) an alkoxy group-containing aromatic compound, and (IV)
It consists of a combination of electron-donating compounds. The solid component (I) is crystalline polyolefin (i)
0.00 solid catalyst fraction (ii) for lffii part
5 to 30 parts by weight (preferably 0.02 to lO'rfLf
fi part).
前記の固体戊分(I)は、例えば、固体触媒或分(ii
)と有機アルミニウム化合物と場合により電子供与性化
合物との存在下に、オレフィンを予備重合させる方法に
よって調製することができる(予a重合法).
ここで、固体触媒成分(ii)は、マグネシウム、チタ
ン、ハロゲン原子および電子供与性化合物を必須戊分と
するものであり、これはマグネシウム化合物とチタン化
合物と電子供与性化合物とを接触させることによって調
製することができる.マグネシウム化合物としては、例
えばマグネシウムシクロリドなどのマグネシウムシハラ
イド、酸化マグネシウム、水酸化マグネシウム、ハイド
ロタルサイト、マグネシウムのカルボン酸塩、ジエトキ
シマグネシウムなどのアルコキシマグネシウム,アリロ
キシマグネシウム、アルコキシマグネシウムハライト、
アリロキシマグネシウムハライト、エチルツチルマクネ
シウムなどのアルキルマクネシウム、アルキルマグネシ
ウムハライド,あるいは有機マグネシウム化合物と電子
供与体、ハロシラン、アルコキシシラン、シラノール及
びアルミニウム化合物などとの反応物などを挙げること
ができるが、これらの中てマクネシウムハライト、アル
コキシマグネシウム、アルキルマグネシウム、アルキル
マグネシウムハライドか好適である.また、これらのマ
グネシウム化合物はl種たけて用いてもよいし、2種以
上を組み合せて用いてもよい.
また、チタン化合物としては、例えばテトラメトキシチ
タン、テトラエトキシチタン,テトラーn−ブロボキシ
チタン、テトライソプロボキシチタン、テトラーn−ブ
トキシチタン、テトライソブトキシチタン、テトラシク
ロへキシロキシチタン、テトラフエノキシチタンなどの
テトラアルコキシチタン、四塩化チタン、四臭化チタン
、四ヨウ化チタンなどのテトラハロゲン化チタン、メト
キシチタニウムトリクロリド、エトキシチタニウムトリ
クロリド、プロボキシチタニウムトリクロリド、n−ブ
トキシチタニウムトリクロリド、エトキシチタニウムト
リブロミドなどのトリハロゲン化アルコキシチタン、ジ
メトキシチタニウムジクロリト、ジエトキシチタニウム
ジクロリト、ジプロボキシチタニウムジクロリド,ジー
n−プロボキシチタニウムジクロリド、ジエトキシチタ
ニウムジブロミドなどのジハロゲン化ジアルコキシチタ
ン、トリメトキシチタニウムクロリド、トリエトキシチ
タニウムクロリト、トリブロボキシチタニウムクロリト
、トリーn−ブトキシチタニウムクロリドなどのモノハ
ゴゲン化トリアルコキシチタンなどが挙げられるが,こ
れらの中で高ハロゲン含有チタン化合物、特に四塩化チ
タンか好適である.これらのチタン化合物はそれぞれ単
独で用いてもよいし、2種以上を組み合せて用いてもよ
い.
電子供与性化合物は、酸素、窒素、リン、イ才ウ,ケイ
素などを含有する有機化合物であり、基木的にはプロピ
レンの重合において、規則性を向上することかてきるも
のてある。The solid fraction (I) may be, for example, a solid catalyst fraction (ii).
), an organoaluminum compound, and optionally an electron-donating compound, it can be prepared by a method of prepolymerizing an olefin (pre-a polymerization method). Here, the solid catalyst component (ii) essentially contains magnesium, titanium, a halogen atom, and an electron donating compound, and this is achieved by bringing the magnesium compound, titanium compound, and electron donating compound into contact with each other. It can be prepared. Examples of the magnesium compound include magnesium cyhalide such as magnesium cyclolide, magnesium oxide, magnesium hydroxide, hydrotalcite, magnesium carboxylate, alkoxymagnesium such as diethoxymagnesium, allyloxymagnesium, alkoxymagnesium halide,
Examples include alkylmagnesiums such as allyloxymagnesium halide and ethyltutylmacnesium, alkylmagnesium halides, and reaction products of organomagnesium compounds with electron donors, halosilanes, alkoxysilanes, silanols, and aluminum compounds. Among these, magnesium halide, alkoxymagnesium, alkylmagnesium, and alkylmagnesium halide are preferred. Moreover, these magnesium compounds may be used in one type or in combination of two or more types. Examples of titanium compounds include tetramethoxytitanium, tetraethoxytitanium, tetra-n-broboxytitanium, tetraisoproboxytitanium, tetra-n-butoxytitanium, tetraisobutoxytitanium, tetracyclohexyloxytitanium, tetraphenoxytitanium, etc. Tetrahalogenated titanium such as tetraalkoxytitanium, titanium tetrachloride, titanium tetrabromide, titanium tetraiodide, methoxytitanium trichloride, ethoxytitanium trichloride, proboxytitanium trichloride, n-butoxytitanium trichloride, ethoxytitanium Trihalogenated alkoxytitanium such as tribromide, dihalogenated dialkoxytitanium such as dimethoxytitanium dichloride, diethoxytitanium dichloride, diproboxytitanium dichloride, di-n-proboxytitanium dichloride, diethoxytitanium dibromide, trimethoxy Examples include monohalogenated trialkoxytitanium such as titanium chloride, triethoxytitanium chloride, tribroboxytitanium chloride, and tri-n-butoxytitanium chloride, but among these, high halogen-containing titanium compounds, especially titanium tetrachloride, etc. It is suitable. These titanium compounds may be used alone or in combination of two or more. The electron-donating compound is an organic compound containing oxygen, nitrogen, phosphorus, sulfur, silicon, etc., and is used as a base material to improve regularity in the polymerization of propylene.
このような電子供与性化合物としては、例えばエステル
類、チオエステル類、アくン類,ケトン類、ニトリル類
,ホスフィン類、エーテル類、チオエーテル類、酸無水
物、酸ハライト顆、酸アミト類、アルデヒド類、有機酸
頬などを挙げることがてきる.更には、例えば、シフェ
ニルジメトキシシラン,ジフェニルジエトキシシラン、
シベンジルジメトキシラン、テトラメトキシシラン、テ
トラエトキシシラン,テトラフェノキシシラン、メチル
トリメトキシシラン、メチルトリエトキシシラン、メチ
ルトリフェノキシシラン、フェニルトリメトキシシラン
、ペンジルトリメトキシシランなどの有機ケイ素化合物
、フタル酸一n−ブチル、フタル酸ジイソブチルなどの
芳香族ジカルボン酸エステル、安,q香酸、p−メトキ
シ安息香酸、p一エトキシ安息香酸、トルイル酸などの
芳香族モノカルボン酸の炭素a1〜4のアルキルエステ
ル,イソブロビルメチルエーテル、インブロピルエチル
エーテル、t−ブチルメチルエーテル、t−プチルエチ
ルエーテル、t−ブチルーn−プロビルエーテル、t−
ブチルーn−プチルエーテル、t−アミルメチルエーテ
ル、t−アミルエチルエーテルなどの非対称エーテル、
2,2゜−アゾビス(2−エチルプロパン)、2,2−
アゾビス(2−エチルブロバン),2.2゛−アゾビス
(2−メチルベンタン)、a,a゜−アゾビスイソブチ
ロニトリル、1.1’−アゾビス(1−シクロヘキサン
カルボン酸)、(l−フェニルメチル)一アゾジフェニ
ルメタン、2−フェニルアゾ−2.4−ジメチル−4−
トリキシベンタンニトリルなどのアゾ結合に立体障害置
換基が結合して或るアゾ化合物などが挙げられ、これら
はl種を用いてもよいし、2種以上を組み合せて用いて
もよい.
具体的には、ジメチルフタレート、ジエチルフタレート
、ジブロピルフタレート、シイソブチルフタレート、メ
チルエチルフタレート,メチルブロピルフタレート、メ
チルイソブチルフタレート、エチルプロピルフタレート
、エチルイソブチルフタレート、プロビルイソツチルフ
タレート、ジメチルテレフタレート、ジエチルテレフタ
レート、シブロピルテレフタレート、ジイソブチルテレ
フタレート、メチルエチルテレフタレート、メチルプロ
ビルテレフタレート、メチルイソブチルテレフタレート
、エチルブロピルテレフタレート、エチルイソブチルテ
レフタレート、プロビルイソブチルテレフタレート、シ
メチルイソフタレート、ジエチルイソフタレート、ジブ
ロピルイソフタレート、シイソブチルイソフタレート、
メチルエチルイソフタレート,メチルプロピルイソフタ
レート、メチルイソブチルインフタレート、エチルブロ
ピルイソフタレート、エチルイソブチルイソフタレート
及びプロビルイソブチルイソフタレートなどの芳香族ジ
カルボン酸ジエステル、ギ酸メチル、酢酸エチル、酢酸
ビニル、酢酸プロビル、酢酸オクチル、酢酸シクロヘキ
シル、プロピオン酸エチル、酢酸エチル、吉草酸エチル
、クロロ酢酸メチル,ジクロロ酢酸エチル,メタクリル
酸メチル、クロトン酸エチル、ピバリン酸エチル、マレ
イン酸シメチル、シクロヘキサンカルボン酸エチル、安
息香酸エチル、安息香酸ブロビル、安息香酸ブチル、安
息香酸オクチル、安息香酸シクロヘキシル、安息香酸フ
ェニル、安息香酸ベンジル、トルイル酸エチル、トルイ
ル酸アミル、アニス酸エチル、エトキシ安息香酸エチル
、P−ブトキシ安息香酸エチル、O−クロロ安息香酩エ
チル及びナフトエ酸エチルなどのモノエステル、γ−バ
レロラクトン、クマリン、フタリド、炭酸エチレンなど
の炭素数2〜l8のエステル類、安息香酸、p一才キシ
安息香酸などの有機酸類,無水コハク酸,無水安息香酸
、無水p−トルイル酸などの酸無水物類,アセトン,メ
チルエチルケトン、メチルイソブチルケトン、アセトフ
ェノン,ペンゾフェノン,ベンゾキノンなどの炭素数3
〜l5のケトン類,アセトアルデヒド、オクチルアルデ
ヒト、ベンズアルデヒド、トルアルデヒト、ナフチルア
ルデヒドなどの炭素数2〜l5のアルデヒド類、アセチ
ルクロリド,ペンジルクロリト,トルイル酸クロリト、
アニス酸クロリドなどの炭素数2〜l5の酸ハライド類
、メチルエーテル、エチルエーテル、イソプロビルエー
テル、n−フチルエーテル、アミルエーテル、テトラヒ
ドロフラン、アニソール、ジフェニルエーテル、エチレ
ングリコールブチルエーテルなどの炭素数2〜20のエ
ーテル類、酢酸アミド、安息香酸アクト,トルイル酸ア
くドなどの酸アミド類、トリブチルアミン、N,N’−
ジメチルピベラジン、トソベンジルアミン、アニリン、
ピリジン,ピコリン、テトラメチルエチレンジアミンな
どのアミン類、アセトニトリル、ペンゾニトリル、トル
ニトリルなどのニトリル類などを挙げることができる.
これらの中で、エステル類、エーテル類、ケトン類及び
酸無水物が好ましく,特に、フタル酸ジーn−ブチル、
フタル酸ジイソブチルなどの芳香族ジカルボン酸ジエス
テル、安息香酸、p−メトシキ安息香酸,P一エトキシ
安息香酸、トルイル酸などの芳香族モノカルボン酸の炭
素数l〜4のアルキルエステルなどが好適である。芳香
族シカルボン酸ジエステルは、触媒活性及び活性持続性
を向上させるのて特に好ましい。Examples of such electron-donating compounds include esters, thioesters, amines, ketones, nitriles, phosphines, ethers, thioethers, acid anhydrides, acid halide granules, acid amides, and aldehydes. Examples include organic acids, etc. Furthermore, for example, cyphenyldimethoxysilane, diphenyldiethoxysilane,
Organosilicon compounds such as cybenzyldimethoxylane, tetramethoxysilane, tetraethoxysilane, tetraphenoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltriphenoxysilane, phenyltrimethoxysilane, penzyltrimethoxysilane, phthalic acid Aromatic dicarboxylic acid esters such as 1-n-butyl and diisobutyl phthalate, alkyls of carbons a1 to 4 of aromatic monocarboxylic acids such as ben, q-aroic acid, p-methoxybenzoic acid, p-ethoxybenzoic acid, toluic acid, etc. ester, isobrobyl methyl ether, inbropylethyl ether, t-butyl methyl ether, t-butyl ethyl ether, t-butyl-n-propylether, t-
Asymmetric ethers such as butyl n-butyl ether, t-amylmethyl ether, t-amyl ethyl ether,
2,2゜-azobis(2-ethylpropane), 2,2-
Azobis(2-ethylbroban), 2.2′-azobis(2-methylbentane), a,a°-azobisisobutyronitrile, 1.1′-azobis(1-cyclohexanecarboxylic acid), (l- phenylmethyl) monoazodiphenylmethane, 2-phenylazo-2,4-dimethyl-4-
Examples include azo compounds in which a sterically hindering substituent is bonded to an azo bond, such as tricybentanenitrile, and these compounds may be used singly or in combination of two or more. Specifically, dimethyl phthalate, diethyl phthalate, dibropylphthalate, diisobutyl phthalate, methyl ethyl phthalate, methyl propyl phthalate, methyl isobutyl phthalate, ethyl propyl phthalate, ethyl isobutyl phthalate, probylisottylphthalate, dimethyl terephthalate, Diethyl terephthalate, sibropyl terephthalate, diisobutyl terephthalate, methyl ethyl terephthalate, methylpropyl terephthalate, methyl isobutyl terephthalate, ethylpropyl terephthalate, ethyl isobutyl terephthalate, probyl isobutyl terephthalate, dimethyl isophthalate, diethyl isophthalate, dibropyl isophthalate, cyisobutyl isophthalate,
Aromatic dicarboxylic acid diesters such as methyl ethyl isophthalate, methyl propyl isophthalate, methyl isobutyl inphthalate, ethyl propyl isophthalate, ethyl isobutyl isophthalate and probyl isobutyl isophthalate, methyl formate, ethyl acetate, vinyl acetate, probyl acetate , octyl acetate, cyclohexyl acetate, ethyl propionate, ethyl acetate, ethyl valerate, methyl chloroacetate, ethyl dichloroacetate, methyl methacrylate, ethyl crotonate, ethyl pivalate, dimethyl maleate, ethyl cyclohexanecarboxylate, ethyl benzoate , brovyl benzoate, butyl benzoate, octyl benzoate, cyclohexyl benzoate, phenyl benzoate, benzyl benzoate, ethyl toluate, amyl toluate, ethyl anisate, ethyl ethoxybenzoate, ethyl P-butoxybenzoate, O - Monoesters such as ethyl chlorobenzoate and ethyl naphthoate, esters having 2 to 18 carbon atoms such as γ-valerolactone, coumarin, phthalide, and ethylene carbonate, organic acids such as benzoic acid and p-oxybenzoic acid, Acid anhydrides such as succinic anhydride, benzoic anhydride, and p-toluic anhydride; 3-carbon atoms such as acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, penzophenone, and benzoquinone;
~15 ketones, aldehydes with 2 to 15 carbon atoms such as acetaldehyde, octylaldehyde, benzaldehyde, tolualdehyde, naphthylaldehyde, acetyl chloride, penzyl chloride, toluic acid chloride,
Acid halides with a carbon number of 2 to 15 such as anisyl chloride; Ethers, acid amides such as acetic acid amide, benzoic acid ado, toluic acid ado, tributylamine, N,N'-
dimethylpiverazine, tosobenzylamine, aniline,
Examples include amines such as pyridine, picoline, and tetramethylethylenediamine, and nitriles such as acetonitrile, penzonitrile, and tolnitrile. Among these, esters, ethers, ketones and acid anhydrides are preferred, particularly di-n-butyl phthalate,
Suitable examples include aromatic dicarboxylic acid diesters such as diisobutyl phthalate, and alkyl esters having 1 to 4 carbon atoms of aromatic monocarboxylic acids such as benzoic acid, p-methoxybenzoic acid, P-ethoxybenzoic acid, and toluic acid. Aromatic dicarboxylic acid diesters are particularly preferred because they improve catalyst activity and activity persistence.
前記の固体触媒戊分(11)の調製は、公知の方法(特
開昭53−4:1094号公報、特開昭55−1351
02号公報、特開昭55−135103号公報,特開昭
56−18606号公報)で行なうことができる.例え
ば(1)マグネシウム化合物又はマグネシウム化合物と
電子供与体との錯化合物を、電子供与体及び所望に応じ
て用いられる粉砕助剤などの存在下に粉砕して、チタン
化合物と反応させる方法、(2)還元能を有しないマグ
ネシウム化合物の液状物と液状チタン化合物とを、電子
供与体の存在下において反応させて、固体状のチタン複
合体を析出させる方法、(3)前記(1)又は(2)で
得られたものにチタン化合物を反応させる方法、(4)
前記(1)又は(2)で得られたものに、さらに電子供
与体及びチタン化合物を反応させる方法、(5)マグネ
シウム化合物又はマグネシウム化合物と電子供与体との
錯化合物を,電子供与体、チタン化合物及び所望に応し
て用いられる粉砕助剤などの存在下て粉砕したのち、ハ
ロゲン又はハロゲン化合物で処理する方法,(6)前記
(1)〜(4)て得られた化合物をハロゲン又はハロゲ
ン化合物て処理する方法、などによって調製することが
できる。The solid catalyst fraction (11) is prepared by a known method (JP-A-53-4:1094, JP-A-55-1351).
02, JP-A-55-135103, and JP-A-56-18606). For example, (1) a method of pulverizing a magnesium compound or a complex compound of a magnesium compound and an electron donor in the presence of an electron donor and a grinding aid used as desired, and reacting it with a titanium compound; ) A method in which a liquid magnesium compound having no reducing ability and a liquid titanium compound are reacted in the presence of an electron donor to precipitate a solid titanium complex, (3) the above (1) or (2). ) A method of reacting a titanium compound with the material obtained in (4)
A method of further reacting an electron donor and a titanium compound with the material obtained in (1) or (2) above, (5) a method of reacting a magnesium compound or a complex compound of a magnesium compound and an electron donor with an electron donor, titanium (6) A method in which the compound obtained in (1) to (4) above is treated with a halogen or halogen compound after being crushed in the presence of a compound and a crushing aid used as desired. It can be prepared by a compound treatment method, etc.
さらに、これらの方法以外の方法(特開昭55−156
205号公報、特開昭57−53309号公報、特開昭
57−19QQQA号公報、特開昭57−3(lQ4G
7号公報、特開昭58−47003号公報)によっても
、前記固体触奴戊分(ii)を調製することができる.
また、周期表■〜■族に属する元素の酸化物、例えば、
酸化ケイ素、酸化マグネシウム、酸化アルミニウムなど
の酸化物又は周期表■〜■族に属する元素の酸化物の少
なくとも1種を含む複合酸化物,例えば,シリカアルミ
ナなどに前記マグネシウム化合物な担持させた固形物と
電子供与体とチタン化合物とを、溶媒中て、O〜200
゜C、好ましくは10〜150℃の範囲の温度によて2
分〜24昨間接触させることにより固体触媒戊分(ii
)を調製することかできる。Furthermore, methods other than these methods (Japanese Unexamined Patent Publication No. 55-156
205, JP 57-53309, JP 57-19QQQA, JP 57-3 (lQ4G
7, Japanese Unexamined Patent Publication No. 58-47003), the above-mentioned solid catalytic converter (ii) can also be prepared.
In addition, oxides of elements belonging to groups ■ to ■ of the periodic table, for example,
A composite oxide containing at least one oxide of an oxide such as silicon oxide, magnesium oxide, or aluminum oxide or an oxide of an element belonging to Groups ■ to ■ of the periodic table, such as a solid material in which the magnesium compound is supported on silica alumina, etc. , an electron donor, and a titanium compound in a solvent at O~200
2°C, preferably at a temperature in the range of 10-150°C.
By contacting the solid catalyst for ~24 minutes (ii
) can be prepared.
また、固体触媒戊分(ii)の調製に当たり、溶媒とし
てマグネシウム化合物、電子供与体及びチタン化合物に
対して不活性な有機溶媒,例えば、ヘキサン、ヘプタン
などの脂肪族炭化水素、ベンゼン,トルエンなどの芳香
族炭化水素、あるいは炭素数l〜12の飽和又は不飽和
の脂肪族、脂環式及び芳香族炭化水素のモノ及びポリハ
ロゲン化合物などのハロゲン化炭化水素などを使用する
ことがてきる.
このようにして調製された固体触媒戊分(ii)のMl
戒は、通常マグネシウム/チタン原子比が2〜100,
ハロゲン/チタン原子比が5〜200、電子供与体/チ
タンモル比が0.1〜10の範囲にある.
こうして得られた固体触奴戒分(ii)と、有機アルミ
ニウム化合物と場合により電子供与性化合物との存在下
に,オレフィンを予備重合させることによって、前記の
固体成分(I)を調製することができる.
ここて用いる有機アルミニウム化合物としては,一般式
A文R 3pX i−p( 1 )
(式中のRコは炭素数1〜IOのアルキル基、Xは塩素
、臭素などのハロゲン原子、pは1〜3の数である〉
て表される化合物を挙げることがてきる。このようなア
ルミニウム化合物としては、例えば、トリメチルアルミ
ニウム、トリエチルアルζニウム、トリイソプロビルア
ルミニウム,トリイソフチルアルミニウム、トリオクチ
ルアルミニウムなどのトリアルキルアルミニウム、ジエ
チルアルミニウムモノクロリト,ジイソブロビルアルミ
ニウムモノクロリド,シイソブチルアルミニウムモノク
ロリド、ジオクチルアルミニウムモノクロリ1〜などの
ジアルキルアルミニウムモノハライド、エチルアルミニ
ウムセスキクロソドなどのアルキルアルミニウムセスキ
ハライトなどを好適に使用することがてきる。これらの
アルミニウム化合物はl種を用いてもよいし、2種以上
を組み合せて用いてもよい。In preparing the solid catalyst fraction (ii), an organic solvent inert to the magnesium compound, electron donor and titanium compound, such as an aliphatic hydrocarbon such as hexane or heptane, benzene or toluene, may be used as a solvent. Aromatic hydrocarbons or halogenated hydrocarbons such as mono- and polyhalogen compounds of saturated or unsaturated aliphatic, alicyclic and aromatic hydrocarbons having 1 to 12 carbon atoms can be used. Ml of the solid catalyst fraction (ii) thus prepared
The precepts usually have a magnesium/titanium atomic ratio of 2 to 100,
The halogen/titanium atomic ratio is in the range of 5 to 200, and the electron donor/titanium molar ratio is in the range of 0.1 to 10. The above-mentioned solid component (I) can be prepared by prepolymerizing the solid component (ii) thus obtained, an olefin in the presence of an organoaluminum compound, and optionally an electron-donating compound. can. The organoaluminum compound used here has the general formula A R 3pX i-p (1) (R in the formula is an alkyl group having 1 to IO carbon atoms, X is a halogen atom such as chlorine or bromine, and p is 1 Examples of such aluminum compounds include trimethylaluminum, triethylaluminum, triisopropylaluminium, triisophthylaluminium, and trioctylaluminum. Trialkylaluminum such as, diethylaluminum monochloride, diisobrobylaluminium monochloride, diisobutylaluminum monochloride, dialkylaluminum monohalide such as dioctylaluminum monochloride 1~, alkylaluminum sesquihalite such as ethylaluminum sesquichloride, etc. One type of these aluminum compounds may be used, or two or more types may be used in combination.
更に、場合により存在させることのできる電子供与性化
合物としては、前記固体触媒戒分(ii)に関連して説
明した化合物を用いることができる。Further, as the electron-donating compound that may be present depending on the case, the compounds described in relation to the solid catalyst precept (ii) can be used.
固体戊分(I)の調製方法において,オレフインとして
、例えばエチレン、プロピレン、フテンー1、4−メチ
ルベンテン−1などの炭素数2〜10のα−オレフィン
を用い、通常30〜80゜C,好ましくは55〜70’
Cの範囲の温度において、予備重合を行ない、好ましく
は融点100゜C以上の結晶性ボソオレフィンを形戊さ
せる。この際、触媒系のアルミニウム/チタン原子比は
通常0.1〜100、好ましくは0.5〜5の範囲で選
ばれ、また電子供与性化合物/チタンモル比はO〜50
.好ましくは0.1〜2の範囲て選ばれる.
前記の固体戊分(I)は、粒径の揃った結晶性ボリブロ
ビレンやポリエチレンなどの結晶性パウダーに前記固体
触媒戊分(ii)とイ1機アルミニウム化合物と電子供
与性化合物(融点100″C以上のもの)とを分散させ
る方法(分散法)によって調製することもてきる。In the method for preparing solid bokubun (I), an α-olefin having 2 to 10 carbon atoms such as ethylene, propylene, phthene-1,4-methylbentene-1 is used as the olefin, and the temperature is usually 30 to 80°C, preferably is 55-70'
The prepolymerization is carried out at a temperature in the range of 100° C. to form a crystalline boso-olefin, preferably with a melting point of 100° C. or higher. At this time, the aluminum/titanium atomic ratio of the catalyst system is usually selected in the range of 0.1 to 100, preferably 0.5 to 5, and the electron donating compound/titanium molar ratio is selected in the range of 0 to 50.
.. It is preferably selected within the range of 0.1 to 2. The solid catalyst (I) is prepared by adding the solid catalyst (II), an aluminum compound, and an electron-donating compound (melting point 100"C) to a crystalline powder such as crystalline polypropylene or polyethylene with a uniform particle size. It can also be prepared by a method of dispersing (dispersion method).
更に,前記の予備重合法と分散法とを組合せて固体戊分
(I)を調製することもてきる。Furthermore, the solid fraction (I) can also be prepared by combining the prepolymerization method and the dispersion method described above.
気相1段重合法に用いる触媒系は、前記のとおり、固体
戊分(I)と有機アルミニウム化合物(II)とアルコ
キシ基含有芳香族化合物(m)と電子供与性化合物(r
V)とを接触させて調製するか,有機アルミニウム化合
物<II)及び電子供与性化合物(IV)としては,前
記で説明した化合物を各々用いることができる.
また、アルコキシ基含有芳香族化合物(m)は,例えば
,一般式
[式中のRlは炭素a1〜20のアルキル基、R2は炭
素数1〜10の炭化水素基、水酸基又はニトロ基、mは
1〜6の整数、nはO〜( 6 − m )の整数であ
る]
て表される化合物てあり、具体的には,例えばm−メト
キシトルエン、0−メトキシフェノール、m−メトキシ
フェノール、2−メトキシ−4−メチルフェノール、ビ
ニルアニンール、p一(1−プロベニル)アニソール、
p−アリルアニソール、1.3−ビス(p−メトキシフ
エニル)−1−ベンテン,5−アリルー2−メトキシフ
ェノール、4−アリルー2−メトキシフェノール、4−
ヒトロキシー3−メトキシベンジルアルコール、メトキ
シベンジルアルコール、ニトロアニソール、ニトロフェ
ネトールなどのモノアルコキシ化合物、0−ジメトキシ
ベンゼン、m−ジメトキシベンゼン,p−ジメトキシベ
ンゼン,3.4−ジメトキシトルエン、2.6−ジメト
キシフェノール、l−アリルー3,4−ジメトキシベン
ゼンなどめジアルコキシ化合物及び1,3.5−1−リ
メトキシベンゼン、5−アリル−l,2.3−トリメト
キシベンゼン、5−アリルー1,2.4−トリメトキシ
ベンゼン、1,2.3−トリメトキシ−5−(l−プロ
ベニル)ベンゼン、1,2.4−トリメトキシー5−(
1−プロベニル)ベンゼン、1,2.3−トリメトキシ
ベンゼン、1,2.4−}−リメトキシベンゼンなどの
トリアルコキシ化合物などが挙げられるか、これらの中
てジアルコキシ化合物及びトリアルコキシ化合物か好適
である.これらのアルコキシ基含有芳香族化合物は、そ
れぞれ単独て用いてもよいし、2種以上を組み合せて用
いてもよい.
前記の触媒系において、固体戊分(I)は、チタン原子
換算で反応容積1文当り0.0005〜1モルの量て使
用する.また、アルコキシ基含有芳香族化合物(m)の
使用量は、固体戊分(I)中のチタン原子1モルに対し
て、0.01〜500モル、好ましくは1〜300モル
である.この使用量が0.Olモル未満になると生戊ボ
リマーの物性が低下し、500モルを超えると触媒活性
が低下するのて好ましくない、この触媒系においてアル
ミニウムとチタンとの原子比は1:l〜3000 (好
ましくは1・40〜800)である.この原子比の範囲
外になると十分な触媒活性が得られない。更に,アルコ
キシ基含有芳香族化合物(m)と電子供与性化合物(I
V)とのモル比は、1:O.Ol〜100 (好ましく
は1:0.2〜100)てある。As mentioned above, the catalyst system used in the gas phase one-stage polymerization method consists of a solid fraction (I), an organoaluminum compound (II), an alkoxy group-containing aromatic compound (m), and an electron-donating compound (r).
The organic aluminum compound <II) and the electron-donating compound (IV) can be prepared by contacting them with V), or the compounds explained above can be used, respectively. Further, the alkoxy group-containing aromatic compound (m) can be prepared by, for example, the general formula [wherein Rl is an alkyl group having 1 to 20 carbon atoms, R2 is a hydrocarbon group having 1 to 10 carbon atoms, a hydroxyl group or a nitro group, and m is An integer of 1 to 6, n is an integer of O to (6-m)], and specifically, examples include m-methoxytoluene, 0-methoxyphenol, m-methoxyphenol, 2 -methoxy-4-methylphenol, vinylanineol, p-(1-probenyl)anisole,
p-allylanisole, 1,3-bis(p-methoxyphenyl)-1-bentene, 5-allyl-2-methoxyphenol, 4-allyl-2-methoxyphenol, 4-
Monoalkoxy compounds such as hydroxyloxy 3-methoxybenzyl alcohol, methoxybenzyl alcohol, nitroanisole, nitrophenethole, 0-dimethoxybenzene, m-dimethoxybenzene, p-dimethoxybenzene, 3.4-dimethoxytoluene, 2.6- Dialkoxy compounds such as dimethoxyphenol, l-allyl-3,4-dimethoxybenzene, and 1,3.5-1-rimethoxybenzene, 5-allyl-l,2,3-trimethoxybenzene, 5-allyl-1,2 .4-trimethoxybenzene, 1,2.3-trimethoxy-5-(l-probenyl)benzene, 1,2.4-trimethoxy-5-(
Examples include trialkoxy compounds such as 1-probenyl)benzene, 1,2.3-trimethoxybenzene, and 1,2.4-}-rimethoxybenzene, and among these, dialkoxy compounds and trialkoxy compounds. It is suitable. These alkoxy group-containing aromatic compounds may be used alone or in combination of two or more. In the above-mentioned catalyst system, the solid fraction (I) is used in an amount of 0.0005 to 1 mol per reaction volume in terms of titanium atoms. The amount of the alkoxy group-containing aromatic compound (m) to be used is 0.01 to 500 mol, preferably 1 to 300 mol, per 1 mol of titanium atoms in the solid fraction (I). This usage amount is 0. If the amount is less than 1 mol, the physical properties of the raw aluminum polymer will deteriorate, and if it exceeds 500 mol, the catalytic activity will be decreased, which is undesirable.・40-800). If the atomic ratio is outside this range, sufficient catalytic activity cannot be obtained. Furthermore, an alkoxy group-containing aromatic compound (m) and an electron-donating compound (I
The molar ratio with V) is 1:O. Ol~100 (preferably 1:0.2~100).
気相1段重合法では,プロピレンの単独重合を行なえば
前記のポリプロピレン系重合体(a)が得られ,プロピ
レンと炭素!4〜30のα−オレフィンとの共重合を行
なえば前記のランダム共重合体(b)か得られる.分子
量調節は公知の手段(例えば水素濃度の調節)によって
行なうことができる.重合温度は、一般に40〜90゜
C(好ましくは60〜75℃)てあり,重合圧力は10
〜4 5 Kg/c1(好ましくは2 0 〜3 0
Kg/cm2) .そして重合時間は5分〜lO時間で
ある.スラリ−1段r合法
スラリ−1段重合法においては、例えば、以下の2種領
の触媒系のいずれかを用いることができる.すなわち、
(1)〈イ)マグネシウム、チタン、ハロゲン原子およ
び電子供与体を必須戊分とする固体戊分と,(ロ)アル
コキシ基含有芳香族化合物と、(ハ)有機アルミニウム
化合物との組合せから或る触媒系、または
(2)(A)前記の(イ)固体或分と(ロ)アルコキシ
基含有芳香族化合物とを、(ハ)有機アルくニウム化合
物の存在下または不存在下に反応させて得られる固体触
奴戊分、および
(. B )有機アルミニウム化合物の組合せから威る
触媒系である.
まず、前記(1)の触媒系について説明すると、固体戊
分(イ)はマグネシウム、チタン、ハロゲン原子および
電子供与体を必須戊分とするものであり、マグネシウム
化合物とチタン化合物と電子供与体とを接触させること
により調製することができる.
また、この固体成分(イ)の調製に当たり、溶媒として
マグネシウム化合物、電子供与体およびチタン化合物に
対して不活性な*機溶媒,例えば、脂肪族炭化水素(ヘ
キサン,ヘブタンなど)、芳香族炭化水素(ベンゼン、
トルエンなど)、あるいはハロゲン化炭化水素(炭素数
l〜l2の飽和または不飽和の脂肪族,脂環式および芳
香族炭化水素のモノ及びポリハロゲン化合物など)を単
独でまた2種以上を組み合せて使用することかできる.
触媒系(1)の固体戊分(イ)を調製する際に用いるマ
グネシウム化合物、チタン化合物および電子供与性化合
物は、各々、前記の気相1段重合法の触媒系に関連して
述べた各化合物と同じものてあることができる.これら
の化合物から,公知の方法(例えば気相1段重合法で述
べた方法)で固体或分(イ)を調製することができる.
こうして得られた固体或分(イ)と接触させるアルコキ
シ基含有芳香族化合物(ロ)および有機アルミニウム化
合物(ハ)としても、前記気相1段重合法の触媒系に関
連して述べた各化合物を用いることができる.
触媒系(1)を構或する各戊分の使用量については、固
体戒分(イ)は、通常チタン原子に換算して反応容Ml
文当たり、0.0005〜1モルで使用し,アルコキシ
基含有芳香族化合物(ロ)は、固体成分(イ)のチタン
原子に対するモル比が、通常0.01〜500 (好ま
しくは1〜300)になる割合で用いられる.このモル
比が0.01未満になると生成ポリマーの物性か低下し
、500を超えると触媒活性が低下するのて好ましくな
い.また、有機アルミニウム化合物(ハ)は、アルミニ
ウム/チタン原子比か通常l〜3000 (好ましくは
40〜800)になるような量で使用する.この量が前
記範囲を逸脱すると触媒活性が不十分となる.
次に,前記の触媒系(2)について説明すると、この触
媒系(2)における固体触媒戊分(A)は、前記触媒系
(1)の固体戊分(イ)とアルコキシ基含有芳香族化合
物(ロ)とを、前記の有機アルミニウム化合物(ハ)の
存在下または不存在下に反応させることによって調製す
ることができる.この調製には、一般に炭化水素系溶媒
(例えば、前記触媒系(1)の調製に用いる炭化水素系
溶媒)を用いる。In the gas phase one-stage polymerization method, the above-mentioned polypropylene polymer (a) is obtained by homopolymerizing propylene, and propylene and carbon! By copolymerizing with 4 to 30 α-olefins, the above-mentioned random copolymer (b) can be obtained. Molecular weight adjustment can be carried out by known means (eg, adjustment of hydrogen concentration). The polymerization temperature is generally 40-90°C (preferably 60-75°C), and the polymerization pressure is 10°C.
~45 Kg/c1 (preferably 20 ~30
Kg/cm2). The polymerization time is 5 minutes to 10 hours. In the slurry one-stage polymerization method, for example, one of the following two types of catalyst systems can be used. That is, from the combination of (1) (a) a solid fraction whose essential components are magnesium, titanium, a halogen atom, and an electron donor, (b) an aromatic compound containing an alkoxy group, and (c) an organoaluminum compound. A certain catalyst system, or (2) (A) reacting the above (a) solid with (b) an alkoxy group-containing aromatic compound in the presence or absence of (c) an organic alkunium compound. This is a catalyst system that is effective from the combination of a solid catalytic fraction obtained by the above-mentioned method, and (.B) an organoaluminum compound. First, to explain the catalyst system in (1) above, the solid fraction (a) has magnesium, titanium, a halogen atom, and an electron donor as essential components, and a magnesium compound, a titanium compound, and an electron donor. It can be prepared by bringing them into contact with each other. In addition, when preparing this solid component (a), use a solvent that is inert to the magnesium compound, electron donor, and titanium compound, such as an aliphatic hydrocarbon (hexane, hebutane, etc.), an aromatic hydrocarbon, etc. (benzene,
toluene, etc.), or halogenated hydrocarbons (mono- and polyhalogen compounds of saturated or unsaturated aliphatic, alicyclic and aromatic hydrocarbons having 1 to 12 carbon atoms, etc.) alone or in combination of two or more. You can use it. The magnesium compound, titanium compound, and electron-donating compound used in preparing the solid fraction (a) of the catalyst system (1) are each of the above-mentioned catalyst systems for the gas phase one-stage polymerization method. It can be the same as a compound. Solid fraction (a) can be prepared from these compounds by known methods (for example, the method described in the gas phase one-stage polymerization method).
As the alkoxy group-containing aromatic compound (b) and organoaluminum compound (c) to be brought into contact with the solid part (a) thus obtained, each compound mentioned in relation to the catalyst system of the gas phase one-stage polymerization method may be used. can be used. Regarding the usage amount of each component constituting the catalyst system (1), the solid component (a) is usually equivalent to the reaction volume Ml in terms of titanium atoms.
The alkoxy group-containing aromatic compound (b) is used in an amount of 0.0005 to 1 mol per sentence, and the molar ratio of the alkoxy group-containing aromatic compound (b) to the titanium atoms in the solid component (a) is usually 0.01 to 500 (preferably 1 to 300). It is used at a rate of . If this molar ratio is less than 0.01, the physical properties of the resulting polymer will deteriorate, and if it exceeds 500, the catalytic activity will decrease, which is not preferable. The organoaluminum compound (c) is used in an amount such that the aluminum/titanium atomic ratio is usually 1 to 3,000 (preferably 40 to 800). If this amount exceeds the above range, the catalyst activity will be insufficient. Next, to explain the catalyst system (2), the solid catalyst fraction (A) in this catalyst system (2) is composed of the solid catalyst fraction (A) of the catalyst system (1) and the alkoxy group-containing aromatic compound. It can be prepared by reacting (b) with the organoaluminum compound (c) in the presence or absence of the organoaluminum compound (c). For this preparation, a hydrocarbon solvent (for example, the hydrocarbon solvent used in the preparation of the catalyst system (1)) is generally used.
反応温度は,通常O〜150゜C(好ましくはlO〜5
0″C)てあり、この温度が0℃未満になると反応か十
分に進行せず、150″Cを超えると副反応が起こり、
活性か低下する.
反応時間は、反応温噴によって変化するが、通常は1分
間〜20時間,好ましくは10〜60分間てある。The reaction temperature is usually 0 to 150°C (preferably 10 to 50°C).
0"C), and if this temperature is below 0℃, the reaction will not proceed sufficiently, and if it exceeds 150"C, side reactions will occur.
Activity decreases. The reaction time varies depending on the reaction temperature, but is usually 1 minute to 20 hours, preferably 10 to 60 minutes.
有機アルミニウム化合物(ハ)の存在下で固体触媒戊分
(A)を調製する場合に、このアルミニウム化合物(ハ
)の濃度は,通常0.05〜100ミリモル/又(好ま
しくは1−10ミリモル/文)である.この濃度か0.
05ミリモル/交未満になると、有機アルミニウム化合
物(ハ)を存在させて反応を行なう効果が十分に得られ
ず、lOOミリモル/文を超えると固体戊分(イ)中の
チタンの還元か進行して、触媒活性が低下する.
一方,有機アルミニウム化合物(ハ)の不存在下て、固
体戊分(イ)とアルコキシ基含有芳香族化合!IN(ロ
)とを反応させて固体触媒或分(A)を調製する場合に
、アルコキシ基含有化合物(ロ)は、固体戒分、(イ)
中のチタン原子に対するモル比か,通常0.1〜200
(好ましくは、l〜50)になるような割合で用いられ
、また、その化合物(ロ)の濃度は、通常0.01〜1
0ミリモル/文(好ましくは0.1〜2ミリモル/文)
の範囲で選ばれる。チタン原子に対する七゛ル比が前記
範囲を逸脱すると所望の活性を右する触媒が得られにく
い。また濃度か0、oBリモル/文未満では容積効率か
低くて実用的てないし、lOミリモル/文を超えると過
反応か起こりやすく、触媒活性が低下する.
触媒系(2)における有機アルミニウム化合物(B)と
しては、前記の気相1段法の触媒に関して例示した有機
アルミニウム化合物を用いることができる.
触媒系(2)における各戊分の使用量については.固体
触媒戊分(A)は,チタン原子に換算して、反応容積1
文当たり、通常o.ooos〜lミリモル/立の範囲に
なるような量で用い,そして有機アルミニウム化合物(
B)は、アルミニウム/チタン原子比が,通常1〜30
00 (好ましくは40〜800)の範囲になるような
量て用いられる。この原子比が前記範囲を逸脱すると触
媒活性か不十分になる.
本発明のスラリ−1段重合法において、プロピレンの単
独重合を行なうと、前記のボリプロビレン系重合体(a
)を得ることができ、プロピレンと炭素数4〜30のα
オレフィンとの共重合を行なうと前記のランダム共重合
体(b)を得ることができる.
スラリ−1段重合の場合、重合温度は通常O〜200℃
(好ましくは60〜100℃)の範囲,そしてプロピレ
ン圧は、通常1〜5 0 Kg/c+a”の範囲で選ば
れる.重合時間は5分〜10時間程度で十分てあり、ま
た重合体の分子量の調節は公知の手段,例えば重合器中
の水素濃度を調製することにより行なうことができる.
次に、本発明て用いる軟質ポリプロピレンのうち、プロ
ピレン系組戊物(d){前記ポリプロピレン系重合体(
a)とエチレンーブロビレン共重合体(c)又はエチレ
ンーブロビレンーボリエン共重合体(C“〉との組戊物
}及びプロピレン系組戊物(e){前記ランダム共重合
体(b)とエチレンープロピレン共重合体(c)又はエ
チレンープロピレンーボリエン共重合体(C′)との組
戊物}は、例えば、以下の気相多段法、スラリー多段法
又はブレンド法のいずれかによって調製することができ
る.
l艶±災里直丑
気相多段重合法で用いる触媒は、前記気相1段重合法で
用いた触媒と回しものである.気相多段瓜合法では最初
の重合(第1段重合)は前記の気相1段重合と同じであ
る.従って,分子量?A節は公知の手段(例えば水素濃
度の調節)によって行なうことができる.重合温度は、
一般に40〜90℃(好ましくは60〜75℃)てあり
,重合圧力は10〜4 5 Kg/c+a” (好まし
くは2 0 〜3 0 Kg/am2) .そして重合
峙間は5分〜10蒔間である。When preparing the solid catalyst fraction (A) in the presence of the organoaluminum compound (c), the concentration of the aluminum compound (c) is usually 0.05 to 100 mmol/or (preferably 1 to 10 mmol/ sentence). This concentration is 0.
If it is less than 0.5 mmol/cross, the effect of conducting the reaction in the presence of the organoaluminum compound (c) cannot be sufficiently obtained, and if it exceeds 100 mmol/cross, the reduction of titanium in the solid fraction (b) will proceed. As a result, the catalytic activity decreases. On the other hand, in the absence of the organoaluminum compound (c), a solid fraction (a) and an alkoxy group-containing aromatic compound! When preparing a solid catalyst (A) by reacting with IN (b), the alkoxy group-containing compound (b) is a solid catalyst, (a)
The molar ratio to the titanium atoms in the
(preferably 1 to 50), and the concentration of compound (2) is usually 0.01 to 1.
0 mmol/statement (preferably 0.1-2 mmol/statement)
selected within the range. If the ratio of titanium to titanium atoms is outside the above range, it will be difficult to obtain a catalyst with the desired activity. Also, if the concentration is less than 0 or 0 mmol/liter, the volumetric efficiency is low and not practical, and if it exceeds 10 mmol/liter, overreaction tends to occur and the catalytic activity decreases. As the organoaluminum compound (B) in the catalyst system (2), the organoaluminum compounds exemplified in connection with the catalyst for the one-stage gas phase method can be used. Regarding the amount of each component used in the catalyst system (2). The solid catalyst fraction (A) has a reaction volume of 1 in terms of titanium atoms.
per sentence, usually o. The organic aluminum compound (
B) has an aluminum/titanium atomic ratio of usually 1 to 30.
00 (preferably 40 to 800). If this atomic ratio exceeds the above range, the catalytic activity will be insufficient. In the slurry one-stage polymerization method of the present invention, when propylene is homopolymerized, the polypropylene polymer (a
) can be obtained, and propylene and α having 4 to 30 carbon atoms can be obtained.
When copolymerized with an olefin, the above-mentioned random copolymer (b) can be obtained. In the case of slurry one-stage polymerization, the polymerization temperature is usually O~200℃
(preferably 60 to 100°C), and the propylene pressure is usually selected in the range of 1 to 50 Kg/c+a''. Polymerization time of about 5 minutes to 10 hours is sufficient, and the molecular weight of the polymer can be adjusted by known means, for example, by adjusting the hydrogen concentration in the polymerization vessel.Next, among the flexible polypropylenes used in the present invention, propylene-based composite (d) (
a) and ethylene-brobylene copolymer (c) or ethylene-brobylene-boriene copolymer (C")} and propylene-based composition (e) {the random copolymer ( b) and the ethylene-propylene copolymer (c) or the ethylene-propylene-boriene copolymer (C')} can be produced, for example, by the following gas phase multi-stage method, slurry multi-stage method or blending method. The catalyst used in the gas-phase multi-stage polymerization method is the same as the catalyst used in the gas-phase one-stage polymerization method. The polymerization (first stage polymerization) is the same as the gas phase one stage polymerization described above.Therefore, the molecular weight ?A can be determined by known means (for example, adjusting the hydrogen concentration).The polymerization temperature is
Generally, the temperature is 40 to 90°C (preferably 60 to 75°C), the polymerization pressure is 10 to 45 Kg/c+a'' (preferably 20 to 30 Kg/am2), and the polymerization time is 5 minutes to 10 minutes. It is between.
第2回から最終回の重合(第n段重合)は、エチレンー
プロピレン共重合またはエチレンープロピレンーボリエ
ン共重合てある.
共重合体に用いることのできる非共役ボリエンとしては
、例えば、ジシクロベンタジェン、トリシクロへンタジ
エン,5−メチル−2,5−ノルボルナシエン、5−メ
チレンー2−ノルボルネン、5−エチリデン−2一ノル
ボルネン、5−インブロピリデン−2−ノルボルネン,
5−インブロベニル−2−ノルボルネン.5−(1−ブ
テニン)−2−ノルボルネン、シクロオクタシェン,ビ
ニルシクロヘキセン、1,5.9−シクロトデカトソエ
ン,6−メチル−4.7,8.9−テトラヒドロインデ
ン、2−2゛−ジシクロベンテニル、トランス−1,2
−ジビニルシクロブタン、1,4−ヘキサジエン、4−
メチル−1,4−へキサシエン、1.6−オクタジエン
、1.7−オクタジエン、1.8一ノナジエン、1.9
−デカシエン、3.6−ジメチル−1.7−オクタジェ
ン、4,5−シメチルー1,7−オクタジェン、1,4
.7−オクタトリエン、5−メチルーl,8−ノナシエ
ン、ノルボルナジエン、ビニルノルボルネン等を挙げる
ことかできる。これらの非共役ボリエンのうち、特にシ
シクロベンタジエン、5−エチリデン−2一ノルボルネ
ン、1,7−オクタジエンが好ましい.
各々の重合段階において,分子量調節は,公知の手段(
例えば水素濃度の調節〉によって行なうことができる.
エチレンープロピレン共重合体の場合に、エチレン単位
含有量の調節は、仕込みガス組戊により行なうことがで
きる.またエチレンープロピレンーボリエン共重合体の
場合にも、ボリエン単位含有arAmは,ボリエン化合
物の仕込量により行なうことができる.重合温度は20
〜90℃(好ましくは40〜50゜C)てあり、重合圧
力は5〜30Kg/c1(好ましくはlO〜20Kg/
am”) .そして重合時間は5分〜10昨間である。The second to final polymerization (nth stage polymerization) is ethylene-propylene copolymerization or ethylene-propylene-boriene copolymerization. Examples of non-conjugated polyenes that can be used in the copolymer include dicyclobentadiene, tricyclopentadiene, 5-methyl-2,5-norbornasiene, 5-methylene-2-norbornene, 5-ethylidene-2-norbornene, 5-imbropylidene-2-norbornene,
5-Imbrobenyl-2-norbornene. 5-(1-butenine)-2-norbornene, cyclooctashene, vinylcyclohexene, 1,5.9-cyclotodecatosoene, 6-methyl-4.7,8.9-tetrahydroindene, 2-2゛- Dicyclobentenyl, trans-1,2
-divinylcyclobutane, 1,4-hexadiene, 4-
Methyl-1,4-hexacyene, 1,6-octadiene, 1,7-octadiene, 1.8-nonadiene, 1.9
-decacyene, 3,6-dimethyl-1,7-octadiene, 4,5-dimethyl-1,7-octadiene, 1,4
.. Examples include 7-octatriene, 5-methyl-1,8-nonacyene, norbornadiene, and vinylnorbornene. Among these nonconjugated polyenes, cyclobentadiene, 5-ethylidene-2-norbornene, and 1,7-octadiene are particularly preferred. At each polymerization step, molecular weight adjustment is carried out by known means (
For example, this can be done by adjusting the hydrogen concentration.
In the case of ethylene-propylene copolymers, the ethylene unit content can be adjusted by adjusting the feed gas composition. Further, in the case of an ethylene-propylene-boriene copolymer, the amount of polyene unit containing arAm can be determined by changing the amount of the polyene compound charged. The polymerization temperature is 20
~90°C (preferably 40~50°C), and the polymerization pressure is 5~30Kg/c1 (preferably lO~20Kg/c1).
am”) and the polymerization time is 5 minutes to 10 minutes.
スラリー多段重合法
スラリー多段重合法においても、前記のスラリーl段重
合法で用いた触媒系(1)又は(2)のいずれかを用い
ることができる.
スラリー多段重合法における重合順序および重合段数は
特に制限されず、任意に選ぶことかできる.例えば、第
1段および第3段の重合でプロピレン単独重合又はプロ
ピレンと炭素数4〜30のα−オレフィンとの共重合を
行ない、第2段および第4段の重合でエチレンーブロビ
レン共重合またはエチレンープロピレンーボリエン重合
を行なうことがてきる.重合段数(nの数〉は前記気相
多段法と同様に、所望の生或物を得るために最適な段数
を選べばよく、重合形式としては、連続重合法または非
連続重合法のいずれも用いることがてきる.
プロピレン単独重合又はブロビレンと炭素数4〜30の
α一才レフィンとの共重合の場合,ff!合温度は通常
0〜200゜C(好ましくは60〜lOO″C)の範囲
、そしてプロピレン圧は,通常1〜5 0 Kg/cm
2の範囲で選ばれる。また、エチレンープロピレン共重
合またはエチレンープロピレンーボリエン共重合の場合
には、重合温度は通常O〜200℃(好ましくは40〜
80℃)の範囲、そしてオレフィン圧は通常1〜5 0
Kg/cs2の範囲で選ばれる.
前記重合においては、いずれも反応時間は5分〜10時
間程度で十分であり、また重合体の分子量の調節は公知
の手段,例えば重合器中の水素濃度を調製することによ
り行なうことかできる.
エチレンープロピレン共重合体の場合のエチレン単位含
有量調節は,仕込ガス組戒により行なうことができ、そ
してエチレンープロピレンーボリエン共重合体の場合の
ボリエン単位含有量の7A節は、仕込み量により行なう
ことができる.ポリエンモノマーとしては前記気相多段
法で述べたボリエンfノマーを用いることかできる.
L乞ヱ上丑
前記のブロビレン系組成物(d)及び(e)は、ポリプ
ロピレン系重合体(a)又はランダム共重合体(b)と
エチレンープロピレン共重合体(C)またはエチレンー
プロピレンーボリエン共重合体(C゜)とを公知の方法
(例えば、ドライブレンドまたは混練)により,ブレン
ドにすることにより調製することかできる。ポリプロピ
レン系重合体(a)及びランダム共重合体(b)は、前
記の気相1段重合法、またはスラリーl段重合法により
得ることができ、また、エチレンープロピレン共重合体
(c)またはエチレンープロピレンーボリエン共重合体
(C゜)は、各々公知の方法で得ることかできる.
なお、重合後の後処理は常法により行なうことができる
.すなわち,気相1段重合法又は気相多段重合法におい
ては、重合後、重合器から導出されるボリマー粉体に,
この中に含まれる未反応オレフィンなどを除くために、
窒素気流などを通過させてもよい.また、所望に応じて
押出機よりベレット化してもよくその際、触媒を完全に
失活させるために、少量の水、アルコールなどを添加す
ることもてきる。また,スラリ−1段重合法又はスラリ
〜多段重合法においては、重合後、重合器から導出させ
るボリマーから完全にモノマーを分敲したのち、ベレッ
ト化することかできる,(↓XV−余白)
本発明の積層体は、少なくとも一つの材料層に前記の軟
質ボリプロビレンを含んでいる.また、他の材料層は、
熱可塑性樹脂層あるいは熱硬化性樹脂層のうちいずれか
一つを少なくとも含むことが好ましい。一方、他の材料
層を,少なくとも金属、ゴム、布,紙、木、セロハン、
あるいは皮革のうちいずれか一って形成してもよい。こ
れらのうち何れの材料を「他の材料層」に使用するかは
、積層体の用途に応じて適宜選定すればよい.「他の材
料層」を構成する熱可塑性樹脂としては,製造すべき積
層体の用途により適宜選定すればよく、特に制限はない
。例えば、アタクチック構造のボリスチレン、アイソタ
クチック構造のボリスチレン、シンジオタクチック構造
のボリスチレン、AS樹脂,ABS樹脂などのスチレン
系重合体をはじめ、ポリエチレンテレフタレート(PE
T) .ポリブチレンテレフタレート(PBT)などの
ポリエステル樹脂、さらにボリカーボネート樹脂,ポリ
フエニレンスルフイド樹脂(pps) ,ボリアミド樹
脂などをあげることかできる.そのほか、ポリフェニレ
ンオキサイト,ボリスルホン.ポリエーテルスルホンな
どのポリエーテル樹脂、ポリアクリル酸,ポリアクリル
酸エステル,ポリメチルメタクリレートなどのアクリル
系樹脂、ポリエチレン,ボリプロビレン,ボリブテン,
ボリ4−メチルベンテン−1,エチレンープロピレン共
重合体,エチレンープロピレンーブテンー1などのエチ
レンーαオレフィン共重合体,エチレンーアクリル酸共
重合体,エチレンービニルアルコール共重合体,エチレ
ンー酢酸ビニル共重合体などのポリオレフィン樹脂、ポ
リ塩化ビニル,ポリ塩化ビニリデン,ボリ沸化ビニリデ
ンなどの含ハロゲンビニル化合物重合体、さらにはポリ
オキシメチレン,ポリビニルアルコール樹脂およびこれ
らの誘導体、エチレンー無水カルボン酸共重合体の金属
塩化合物であるアイオノマー等をあげることができる.
これらのうちで、得られる樹脂積層体に高い力学的強度
を要求する場合には、熱可塑性樹脂としてポリエステル
樹脂、ボリアミド樹脂、ポリカーボネート樹脂、ポリオ
レフィン樹脂あるいは含ハロゲンビニル化合物重合体な
どを選定すべきてあり、また、ガスバリア性を重視する
場合には、PET等のポリエステル樹脂,ボリアミド樹
脂,pps,ポリビニルアルコール樹脂およびその誘導
体あるいはエチレンビニルアセテート,ポリ塩化ビニリ
デンなどを選定すべきであり、その他低融点の熱可塑性
樹脂を選定すればヒートシール性の良好な積層体が得ら
れる.特に低温ヒートシール性を重視する場合には、ポ
リプロピレン(PP),PET,PBTなどを選定すべ
きである.また、十分な柔軟性を保持する観点からは、
ボリアミド,エチレンー酢酸ビニル共重合体(EVA)
,ポリエチレン(PE),ポリ塩化ビニル(pvc)
などを選定することが好ましい.
また、「他の材料層」を構戊する熱硬化性樹脂としては
、ポリウレタン,不飽和ポリエステル,エボキシ,ケイ
素,フェノール等をあげることができる.
「他の材料層」を構戊する金属としては、アルミニウム
(AI),鉄(Fe)を、布としては織物、編物、不織
布等をあげることかできる.そして、ヒートシール性を
重視する観点からは、アルミニウム、布、紙が好適であ
り、柔軟性を重視する場合には、ゴムか好適である.
第1図(a) , (b) . (c)は本発明の積層
体の構或例を示す断面図である.同図(a)は軟質ポリ
プロピレン層lOOと他の材料層200の二層で構威し
た例を示す.この応用例として、他の材料層200にさ
らに他の材料層を重ね合わせた構成とすることもできる
.同図(b)は他の材料層200の両面に軟質ボリブロ
ビレン層100を重ね合せた構成を示す.そして、この
応用例として、二つの軟質ポリプロピレン層の間に他の
材料層を複数段に設けた構戒とすることもできる.同図
(C)は軟質ポリプロピレン層100の両面に他の材料
層Zoo,300を重ね合わせた構戒を示す。この応用
例としては、軟質ボリブロビレン層lOOの両面にそれ
ぞれ他の材料層を複数段重ね合わせた構戊とすることも
できる.さらにまた、以上の構或例をーまたは二以上組
合わせた構威とすることもてきる.
積層体の厚さとしては、特に制限はないが、柔軟性を保
持するためにlO〜2000μmとすることか好ましい
。Slurry multi-stage polymerization method Also in the slurry multi-stage polymerization method, either catalyst system (1) or (2) used in the slurry one-stage polymerization method can be used. The polymerization order and the number of polymerization stages in the slurry multistage polymerization method are not particularly limited and can be arbitrarily selected. For example, in the first and third stage polymerization, propylene homopolymerization or copolymerization of propylene and an α-olefin having 4 to 30 carbon atoms is performed, and in the second and fourth stage polymerization, ethylene-brobylene copolymerization is performed. Alternatively, ethylene-propylene-boriene polymerization can be carried out. The number of polymerization stages (the number of n) may be selected as the optimal number to obtain the desired product, as in the gas phase multistage method, and the polymerization method may be either continuous polymerization method or discontinuous polymerization method. In the case of propylene homopolymerization or copolymerization of brobylene and alpha monoolefin having 4 to 30 carbon atoms, the ff! synthesis temperature is usually 0 to 200°C (preferably 60 to 100°C). range, and propylene pressure is usually 1-50 Kg/cm
Selected within the range of 2. In addition, in the case of ethylene-propylene copolymerization or ethylene-propylene-boriene copolymerization, the polymerization temperature is usually 0 to 200°C (preferably 40 to 200°C).
80°C) and the olefin pressure is usually between 1 and 50°C.
Selected within the range of Kg/cs2. In all of the above polymerizations, a reaction time of about 5 minutes to 10 hours is sufficient, and the molecular weight of the polymer can be adjusted by known means, for example, by adjusting the hydrogen concentration in the polymerization vessel. In the case of an ethylene-propylene copolymer, the ethylene unit content can be adjusted by adjusting the feed gas composition, and in the case of an ethylene-propylene-boriene copolymer, clause 7A of the polyene unit content is determined by adjusting the feed amount. This can be done by As the polyene monomer, the polyene f-nomer mentioned in the gas phase multi-stage method can be used. The above brobylene compositions (d) and (e) are composed of a polypropylene polymer (a) or a random copolymer (b) and an ethylene-propylene copolymer (C) or an ethylene-propylene copolymer (C). It can be prepared by blending a polyene copolymer (C°) using a known method (for example, dry blending or kneading). The polypropylene polymer (a) and the random copolymer (b) can be obtained by the gas phase one-stage polymerization method or the slurry one-stage polymerization method, and the ethylene-propylene copolymer (c) or Each of the ethylene-propylene-boriene copolymers (C°) can be obtained by known methods. Note that post-treatment after polymerization can be carried out by conventional methods. That is, in the gas-phase one-stage polymerization method or the gas-phase multi-stage polymerization method, after polymerization, the polymer powder extracted from the polymerization vessel contains
In order to remove unreacted olefins contained in this,
A stream of nitrogen or the like may be passed through. Further, if desired, it may be pelletized using an extruder, and at that time, a small amount of water, alcohol, etc. may be added to completely deactivate the catalyst. In addition, in the slurry one-stage polymerization method or slurry-multistage polymerization method, after polymerization, the monomer can be completely separated from the polymer derived from the polymerization vessel and then pelletized. (↓XV-Margin) The laminate of the invention contains the above-mentioned soft polypropylene in at least one material layer. In addition, other material layers are
It is preferable that at least one of a thermoplastic resin layer and a thermosetting resin layer is included. On the other hand, the other material layers are at least metal, rubber, cloth, paper, wood, cellophane, etc.
Alternatively, it may be formed from any one of leather. Which of these materials is used for the "other material layer" may be selected as appropriate depending on the use of the laminate. The thermoplastic resin constituting the "other material layer" may be appropriately selected depending on the use of the laminate to be manufactured, and is not particularly limited. Examples include styrenic polymers such as atactic structure boristyrene, isotactic structure boristyrene, syndiotactic structure boristyrene, AS resin, ABS resin, polyethylene terephthalate (PE), etc.
T). Examples include polyester resins such as polybutylene terephthalate (PBT), polycarbonate resins, polyphenylene sulfide resins (pps), and polyamide resins. In addition, polyphenylene oxide, boris sulfone. Polyether resins such as polyether sulfone, acrylic resins such as polyacrylic acid, polyacrylic acid ester, polymethyl methacrylate, polyethylene, polypropylene, polybutene,
Ethylene-alpha olefin copolymers such as poly-4-methylbentene-1, ethylene-propylene copolymer, ethylene-propylene-butene-1, ethylene-acrylic acid copolymer, ethylene-vinyl alcohol copolymer, ethylene-vinyl acetate Polyolefin resins such as copolymers, halogen-containing vinyl compound polymers such as polyvinyl chloride, polyvinylidene chloride, polyvinylidene, polyoxymethylene, polyvinyl alcohol resins and their derivatives, ethylene-carboxylic anhydride copolymers Examples include ionomers, which are metal salt compounds. Among these, if high mechanical strength is required for the resulting resin laminate, polyester resin, polyamide resin, polycarbonate resin, polyolefin resin, or halogen-containing vinyl compound polymer should be selected as the thermoplastic resin. In addition, if gas barrier properties are important, polyester resins such as PET, polyamide resins, pps, polyvinyl alcohol resins and their derivatives, ethylene vinyl acetate, polyvinylidene chloride, etc. should be selected, and other materials with low melting points should be selected. By selecting a thermoplastic resin, a laminate with good heat sealability can be obtained. In particular, if low-temperature heat sealability is important, polypropylene (PP), PET, PBT, etc. should be selected. Also, from the perspective of maintaining sufficient flexibility,
Polyamide, ethylene-vinyl acetate copolymer (EVA)
, polyethylene (PE), polyvinyl chloride (PVC)
It is preferable to select Further, examples of the thermosetting resin constituting the "other material layer" include polyurethane, unsaturated polyester, epoxy, silicon, and phenol. Examples of metals constituting the "other material layer" include aluminum (AI) and iron (Fe), and examples of fabrics include woven fabrics, knitted fabrics, and nonwoven fabrics. From the viewpoint of placing importance on heat sealability, aluminum, cloth, and paper are suitable; when placing importance on flexibility, rubber is suitable. Figure 1 (a), (b). (c) is a sectional view showing an example of the structure of the laminate of the present invention. Figure (a) shows an example of a structure consisting of two layers: a soft polypropylene layer lOO and another material layer 200. As an example of this application, it is also possible to have a structure in which another material layer is superimposed on the other material layer 200. Figure (b) shows a structure in which a soft polypropylene layer 100 is superimposed on both sides of another material layer 200. As an example of this application, it is also possible to create a structure in which multiple layers of other materials are provided between two soft polypropylene layers. The figure (C) shows a structure in which another material layer Zoo, 300 is superimposed on both sides of the soft polypropylene layer 100. As an example of this application, it is also possible to have a structure in which multiple layers of other materials are stacked on both sides of the soft polypropylene layer lOO. Furthermore, one or more of the above examples may be combined. The thickness of the laminate is not particularly limited, but it is preferably 10 to 2000 μm in order to maintain flexibility.
また、軟質ポリプロピレン層の厚さについても、特に制
限はないが、同層の材質を十分引出すために5〜loo
ogmの範囲で設定することか好ましい.
ところで、本発明の積層体を製造するにあたっては、そ
の積層体の形態や用途に応じて様々な手段か考えられる
が、状況に応じて常法を適宜組合わせればよい。具体的
には、次のような製造方法をあげることができる.
すなわち、軟質ボリブロビレン層と熱可塑性樹脂層とで
構威される積層体の製造方法としては、次の方法をあげ
ることができる.
第一の方法は,軟質ボリブロビレン(軟質PP)と熱可
塑性樹脂を、多層ダイを有する戒形機から多層共押出し
、多層キャスト威形フイルムを作威するか、あるいは多
層インフレーション或形を行なう方法である.このとき
、居間の接着力を高めるために、第三威分として軟質P
P、熱可塑性樹脂層のそれぞれの層と親和性のある接着
層を設けるか,あるいは軟質PPと熱可塑性樹脂のいず
れか一方または両方に接着材料を予め配合しておくこと
もてきる。なお、多層キャスト或形フィルムを作或する
場合Tタイ温度を190〜320°C好ましくは200
〜280℃程度とし、また冷却ロール温度を90゜C以
下とするとともに、引取速度を5〜130m/分好まし
くは30〜130m/分以下の範囲て設定することが好
ましい.特に冷却ロール温度を90゜C以下に設定すれ
ば、非品性のフイルムか得られ、また引取速度と押出速
度比、すなわちドラフト比を4以下にすれば無配向原反
シート(フイルム)を得ることかでき、延伸に好適てあ
る.
このようにして、あるいはその後必要に応して延伸処理
することによって、目的とする樹脂積層体を得ることか
できる.ここで延伸処理して延伸多層フィルムを作戒す
る場合、その延伸法としては一軸延伸,チューブラ一二
軸延伸,逐次二軸延伸,同時二輪延伸などの方法を適宜
選定使用すればよい。この延伸処理の条件は、状況によ
って異なり一義的に定められないか、通常は温度80℃
以上で融点以下とし延伸倍率を少なくとも一方に3倍以
上に設定すればよい。また、この延伸多層フィルムにつ
いては、後処理として加熱処理を行なうと十分な寸法安
定性か得られ好ましい、この際の熱処理温度は用いるフ
ィルムの融点やガラス転移温度により異なるか、通常は
80〜160℃に設定すればよく、処理時間は2秒〜2
0分程度である.
第二の方法は、予め軟質PPのフィルム(延伸あるいは
未延伸のもの)と熱可塑性樹脂のフィルム(延伸あるい
は未延伸のもの)を別々に作威しておき、これらをラミ
ネートする方法である。このラミネートにあたって、コ
ロナ処理あるいはオゾン処理などによって、それぞれの
フィルム表面を処理しておいてもよく、また層間接着剤
(例えば、硬化型,ウレタン系接着剤などのトライラミ
ネート用接着剤)を使用することもてきる。なお、ラミ
ネートの際のプレスロール温度は40〜100℃程度と
し、また加工速度は50〜150m/分か適当である。There is also no particular limit to the thickness of the soft polypropylene layer, but in order to bring out the material of the same layer sufficiently, it is
It is preferable to set it within the ogm range. By the way, in manufacturing the laminate of the present invention, various methods can be considered depending on the form and use of the laminate, and conventional methods may be combined as appropriate depending on the situation. Specifically, the following manufacturing methods can be cited. That is, the following method can be cited as a method for manufacturing a laminate consisting of a soft polypropylene layer and a thermoplastic resin layer. The first method is to coextrude soft polypropylene (soft PP) and thermoplastic resin in multiple layers from a forming machine with a multilayer die to create a multilayer cast shaped film, or to perform multilayer inflation or shaping. be. At this time, in order to increase the adhesive strength of the living room, soft P was used as the third component.
It is also possible to provide an adhesive layer having affinity with each of the P and thermoplastic resin layers, or to mix an adhesive material in advance with either or both of the soft PP and the thermoplastic resin. In addition, when producing a multilayer cast or shaped film, the T-tie temperature should be 190 to 320°C, preferably 200°C.
It is preferable to set the cooling roll temperature to 90°C or less, and to set the take-up speed in the range of 5 to 130 m/min, preferably 30 to 130 m/min. In particular, if the cooling roll temperature is set to 90°C or less, a non-quality film can be obtained, and if the take-up speed and extrusion speed ratio, that is, the draft ratio, is set to 4 or less, a non-oriented raw sheet (film) can be obtained. It is suitable for stretching. The desired resin laminate can be obtained in this way or by subsequently carrying out a stretching treatment if necessary. When stretching the stretched multilayer film, the stretching method may be appropriately selected from uniaxial stretching, tubular monobiaxial stretching, sequential biaxial stretching, simultaneous two-wheel stretching, and the like. The conditions for this stretching process vary depending on the situation and may not be unambiguously determined, or the temperature is usually 80°C.
It is sufficient to set the above melting point or lower and set the stretching ratio to at least 3 times or more on at least one side. In addition, for this stretched multilayer film, it is preferable to perform heat treatment as a post-treatment to obtain sufficient dimensional stability.The heat treatment temperature at this time varies depending on the melting point and glass transition temperature of the film used, and is usually 80 to You just need to set it to ℃, and the processing time is 2 seconds to 2
It takes about 0 minutes. The second method is to prepare a soft PP film (stretched or unstretched) and a thermoplastic resin film (stretched or unstretched) separately in advance, and then laminate them. In this lamination, the surface of each film may be treated by corona treatment or ozone treatment, and an interlayer adhesive (for example, a tri-laminate adhesive such as a hardening type or urethane adhesive) may be used. It can also happen. Note that the press roll temperature during lamination is approximately 40 to 100°C, and the processing speed is appropriately 50 to 150 m/min.
前記第一,第二の方法は,熱可塑性樹脂層以外の他の材
料層と軟質ポリプロピレン層とて構成される積層体の製
造方法としても応用てきる。ては、いかなる構或の場合
はどの製造方法か適しているか、例をあげて個別的に説
明する。まず、接着剤を用いない共押出し法は、軟質P
PとPP,エチレンーブロビレン共重合体,ボリブテン
l,エチレン酢酸ビニル共重合体等との積層に適してい
る.接着剤(カルボン酸変性ポリプロピレン等)を用い
た共押出し法は、軟賀PPとPE,ボリスチレン(PS
)等との積層に適している。The first and second methods can also be applied as a method for manufacturing a laminate comprising layers of materials other than the thermoplastic resin layer and a soft polypropylene layer. Now, we will individually explain which manufacturing method is suitable for which structure using examples. First, the coextrusion method that does not use adhesive
Suitable for laminating P and PP, ethylene-brobylene copolymer, polybutene l, ethylene-vinyl acetate copolymer, etc. Co-extrusion method using adhesive (carboxylic acid modified polypropylene etc.)
) etc. is suitable for lamination.
これらの材料からなる積層体の場合は、軟質PPて形成
したフィルムまたはシートに接着剤を塗布した他の材料
層を積層する方法も適する。この場合、接着剤としては
,ウレタン系接着剤を用いる.軟賀PPと接着剤とを共
押出し後、他の材料層を積層する方法は,他の材料層と
して熱硬化性樹脂,金属,紙,布,セロハン,ゴム,木
等を用いる場合に適している.以上の製造方法において
、押出し温度は材料層の種類により一義的に定まるもの
でないが、通常170〜320”C、好ましくは200
〜280℃に設定される.上述した本発明の積層体は、
軟質ポリプロピレン層の溶着温度か143゜C程度、曲
げ弾性率約3 0 0 0 Kg/c重”、耐熱温度か
140〜165℃と各特性ともに良好であるため、低温
ヒートシール性か良く、柔軟性に富み、しかも耐熱性に
優れた特性を示す.したかって、例えば次のような用途
に好適である.
すなわち、一般包装、根菜類の包装等に用いる包装材料
の外層あるいは中間層として本積層体を使用すれば、耐
震性(特にブロック)、柔軟性、耐熱性に優れた包装材
料を提供できる.具体的には,ホモポリプロピレン(H
PP)./軟WPP/ランダムポリプロピレン(RPP
)またはEVAの構成からなる積層体、RPP/軟質P
P/RPPの構或からなる積層体かこの包装材料に好適
である.また、包装材料の内層として使用すれば,低温
ヒートシール性、耐熱性に優れた包装材料を提供できる
.具体的には、ナイロン(NY)/軟質PPの構成から
なる積層体、エチレンービニルアルコール変重合体(E
VOH)/軟質PPの構或からなる積層体かこの包装材
料に好適であり、特にこれらはラップフィルム、ストレ
ッチフィルムとして使用することかできる.さらに、金
属と軟質PPとの積層体により鋼板又は鋼管の被覆、自
動車の内装に使用でき、布と軟賀PPとの積層体により
柔軟で風合いに優れたブックカバー等が製作でき、皮革
と軟質PPとの積層体により鞄等が製作できる.
[実施例]
X凰負ユ
下記の方法により製造したホモタイプの軟質PP(軟質
ホ七PP)を使用して積層体を製作した。In the case of a laminate made of these materials, a method in which a film or sheet made of soft PP is laminated with a layer of another material coated with an adhesive is also suitable. In this case, use a urethane adhesive as the adhesive. The method of laminating other material layers after coextruding Soga PP and adhesive is suitable when using thermosetting resin, metal, paper, cloth, cellophane, rubber, wood, etc. as the other material layer. There is. In the above manufacturing method, the extrusion temperature is not uniquely determined depending on the type of material layer, but is usually 170 to 320"C, preferably 200"C.
The temperature is set at ~280℃. The laminate of the present invention described above is
The soft polypropylene layer has a welding temperature of approximately 143°C, a flexural modulus of approximately 3000 kg/c weight, and a heat resistance temperature of 140 to 165°C, all of which have good properties, so it has good low-temperature heat sealability and is flexible. Therefore, it is suitable for the following uses. Namely, this laminated layer is used as an outer layer or an intermediate layer of packaging materials used for general packaging, packaging of root vegetables, etc. If we use the material, we can provide packaging materials with excellent earthquake resistance (especially blocks), flexibility, and heat resistance.Specifically, homopolypropylene (H
PP). /Soft WPP/Random polypropylene (RPP
) or a laminate consisting of EVA, RPP/soft P
A laminate having a P/RPP structure is suitable for this packaging material. Furthermore, when used as the inner layer of packaging materials, it is possible to provide packaging materials with excellent low-temperature heat sealability and heat resistance. Specifically, laminates consisting of nylon (NY)/soft PP, ethylene-vinyl alcohol modified polymers (E
A laminate having a structure of VOH)/soft PP is suitable for this packaging material, and in particular, these can be used as wrap films and stretch films. Furthermore, a laminate of metal and soft PP can be used to cover steel plates or steel pipes and for the interior of automobiles, a laminate of cloth and soft PP can be used to make book covers with excellent flexibility and texture, and a laminate of cloth and soft PP can be used to make book covers with excellent texture. Bags, etc. can be manufactured by laminating with PP. [Example] A laminate was manufactured using homotype soft PP (soft Hoshichi PP) manufactured by the method described below.
(A)軟質ホモボリプロピレンの製造例(1)固定触媒
戊分の調製
十分に窒素置換した内容積500m文のガラス製三ツ口
フラスコに、精製へブタン2 0 m l、M g (
O E t ) 2 ’4 gおよびフタル酸ジーn
−ブチル1.2gを加え,系内を90’Cに保ち、かき
まぜなからTiCl<4mlを滴下した後、さらにTi
c文4 111m文を追加投入して、110℃に昇温し
た。110”Cて2時間反応させた後、80℃の精製へ
ブタンで洗浄した。得られた固相部にT i C文.1
15m文を加え、110℃でさらに2時間反応させた。(A) Production example of soft homobolypropylene (1) Preparation of fixed catalyst 20 ml of purified hebutane, Mg (
O E t ) 2 '4 g and phthalate di n
- Add 1.2 g of butyl, keep the inside of the system at 90'C, drop TiCl<4 ml without stirring, and then add more TiCl.
c-bun 4 111 m-bun was added and the temperature was raised to 110°C. After reacting for 2 hours at 110"C, it was washed with purified butane at 80"C.
15 m of water was added, and the reaction was further carried out at 110°C for 2 hours.
反応終了後、生戒物を精製へプタンZoom文て数回洗
浄して固体触媒威分[気相法の固体触媒戒分(ii)に
相当]とした.
(2〉固体戊分の調製
十分に窒素置換した内容yi2.51のガラス製耐圧三
ツ口フラスコに精製へブタン1.7文、AJJEt3
0.07モル、シフェニルジメトキシシラン(DPDM
S)0.05ミリモルおよび前記(1)の触媒戊分12
0gを加えた。系内を30℃に保ち、攪拌しながらプロ
ピレンを連続的に供給し,内圧を0 . 5 Kg/c
m2に保った.この反応を1時間継続した後、精製へブ
タン1Mで5回洗浄し、固体或分[気相法の固体成分(
I)に相当]を得た.
(3)気相第1段重合
ポリプロピレンパウダー20gを含む5文のステンレス
製耐圧オートクレープに、A I E t :+3ミリ
モル、1−アリル−3,4−ジメトキシベンゼン(AD
MB)0.15ミリモル、ジフェニルジメトキシシラン
(DPDMS)0.23ミリモルおよび前記(2)の固
体戒分(1)100mg(Ti原子に換算して0.06
ミリモル)を含むヘプタン溶液2 0 m lを加えた
.系内を5分間排気後、水素ガスを0 . 7 K g
/ c m ”まで導入し、全圧が2 8 Kg/a
m”になるまでプロピレンガスを供給しながら70℃で
1.7時間気相重合を行なった.メルトインデックス(
MI)か10g/10分の軟質ポリプロピレン640g
を得た。この軟質ボリプロビレンの沸騰へブタン可溶分
(HSP分)は46.8重量%であり,固有粘度は1.
13dl/gてあった.また,沸騰へブタン不溶分(
HIP分)は53.2重量%であり,固有粘度は1.7
4d文/gであった.さらに”C−NMRによるベンタ
ット分率においてrr r r / 1 − m m
m mが34.5%であり、DSCにて測定した融解ピ
ーク温度( T m )が158℃.DSCにて測定し
た融解エンタルピー(△H)が58.2J/gであり、
そして透過型電子顕微鏡での観察においてドメイン構造
が観察された。After the reaction was completed, the raw material was washed several times with purified heptane (Zoom) to obtain a solid catalyst (corresponding to solid catalyst (ii) in the gas phase method). (2> Preparation of solid extract In a pressure-resistant glass three-necked flask with a content of yi 2.51, which was sufficiently purged with nitrogen, 1.7 g of purified hebutane was added, AJJEt3
0.07 mol, Cyphenyldimethoxysilane (DPDM
S) 0.05 mmol and the catalyst fraction 12 of (1) above
Added 0g. The inside of the system was maintained at 30°C, propylene was continuously supplied while stirring, and the internal pressure was reduced to 0. 5 kg/c
It was kept at m2. After continuing this reaction for 1 hour, it was washed 5 times with purified butane 1M, and the solid component [solid component of the gas phase method]
equivalent to I)] was obtained. (3) A pressure-resistant autoclave made of stainless steel containing 20 g of gas-phase first-stage polymerized polypropylene powder was charged with A I E t : +3 mmol, 1-allyl-3,4-dimethoxybenzene (AD
MB) 0.15 mmol, diphenyldimethoxysilane (DPDMS) 0.23 mmol, and solid fraction (1) of the above (2) 100 mg (0.06 in terms of Ti atoms)
20 ml of a heptane solution containing 1 mmol) was added. After evacuating the system for 5 minutes, the hydrogen gas was evacuated to 0. 7 kg
/ cm” and the total pressure is 28 Kg/a.
Gas phase polymerization was carried out at 70°C for 1.7 hours while supplying propylene gas until the melt index (
MI) or 10g/10min soft polypropylene 640g
I got it. The boiling hebutane soluble content (HSP content) of this soft polypropylene is 46.8% by weight, and the intrinsic viscosity is 1.
It was 13 dl/g. In addition, boiling butane insoluble matter (
HIP content) is 53.2% by weight, and the intrinsic viscosity is 1.7
It was 4d sentences/g. Furthermore, in the bentat fraction by C-NMR, rr r r / 1 - m m
m m is 34.5%, and the melting peak temperature (T m ) measured by DSC is 158°C. The enthalpy of fusion (ΔH) measured by DSC is 58.2 J/g,
A domain structure was observed under transmission electron microscopy.
(B)製造条件
積層体の製造条件は以下のとおりてある.なお、他の材
料層はホモPP(出光石油化学(株)製F−700N
(商品名))を使用した。(B) Manufacturing conditions The manufacturing conditions for the laminate are as follows. The other material layers are homo PP (F-700N manufactured by Idemitsu Petrochemical Co., Ltd.).
(product name)) was used.
・層構威:軟質ホモPP/ホモPP/
軟質ホモpp
(厚さ比1/8/1)
・フィルム厚: 30pm/240gm/30ルm
・共押出し法により製作
・使用成形機
軟質ホモpp用:スクリュー径2 0 m m押出機
ホモPP:スクリュー径30mm押出機マルチマニホー
ルド使用
・戒形条件:樹脂温度2 5 0 ”C・押出量
軟質ホモPP : 1. 1 〜1. 2Kg/Hrホ
モPP:9.5〜9 . 5 Kg/Hr・その他:チ
ルロール温度35℃、エアーナイフ使用、引取速度5〜
5.5m/分
製作した積層体は,ヒートシール温度
143゜C、耐熱温度145℃以上であり,低温ヒート
シール性および耐熱性に優れた特性を示した.
lLf生ヱ
実施例lの軟質ホモPPに変えて,下記の方法により製
造したブロックタイプの軟質PP(軟質ブロックPP)
を使用し、実施例lと同一の条件て積層体を製作した。・Layer structure: Soft homo PP/Homo PP/Soft homo PP (thickness ratio 1/8/1) ・Film thickness: 30 pm/240 gm/30 lm ・Produced and used molding machine by co-extrusion method For soft homo PP : Screw diameter 20 mm Extruder homo PP: Screw diameter 30 mm Extruder multi-manifold use/forming conditions: Resin temperature 250"C/Extrusion rate Soft homo PP: 1.1 to 1.2 Kg/Hr Homo PP :9.5~9.5 Kg/Hr・Others: Chill roll temperature 35℃, air knife used, take-up speed 5~
The laminate manufactured at a speed of 5.5 m/min had a heat sealing temperature of 143°C and a heat resistance temperature of 145°C or higher, showing excellent properties in low-temperature heat sealability and heat resistance. Instead of the soft homo-PP of Example 1, a block-type soft PP (soft block PP) was produced by the following method.
A laminate was produced under the same conditions as in Example 1.
軟質ブロックボリプロピレンの製造例
上記軟質ホモボリプロピレンと同様に、固体触媒成分の
調製と固体或分Aの調製を行なった後、次のようにした
.
(1)気相第1段重合
ポリプロピレンパウダー20gを含む5文のステンレス
製耐圧オートクレープに、AuEt.3ミリモル、1−
アリル−3.4−ジメトキシベンゼン(ADMB)0.
15ミリモル、ジフェニルジメトキシシラン(DPDM
S)0.23ミリモル、並びに前記製造例1 (1)お
よび(2)で調製した固体威分(I ) 1 00mg
(T i原子に換算して0.06ミリモル)を含むヘ
プタン溶液20mlを加えた.系内を5分間排気後、水
素ガスを0.7Kg/cm2まで導入し、さらに全圧が
2 8 Kg/c一になるまでブロビレンガスを供給し
ながら70℃で1.7時間気相重合を行なった.(2)
気相第2段重合
前記(1)の反応か終了した後、系内を脱圧し、排気し
た後、水素ガス0.5Kg/c■2、エチレンープロピ
レン混合ガス(モル比1/4)な1 0 Kg/cm”
まで供給し、50℃て1.4時間気相重合を行なった。Example of Production of Soft Block Polypropylene After preparing the solid catalyst component and solid fraction A in the same manner as the above-mentioned soft homopolypropylene, the following procedure was carried out. (1) AuEt. 3 mmol, 1-
Allyl-3,4-dimethoxybenzene (ADMB) 0.
15 mmol, diphenyldimethoxysilane (DPDM
S) 0.23 mmol, and 100 mg of the solid component (I) prepared in Production Example 1 (1) and (2) above.
20 ml of heptane solution containing (0.06 mmol in terms of Ti atoms) was added. After evacuating the system for 5 minutes, hydrogen gas was introduced to 0.7 Kg/cm2, and gas phase polymerization was carried out at 70°C for 1.7 hours while supplying brobylene gas until the total pressure reached 28 Kg/cm2. Ta. (2)
Gas-phase second-stage polymerization After the reaction in (1) above is completed, the system is depressurized and exhausted, and hydrogen gas (0.5 kg/c) and ethylene-propylene mixed gas (molar ratio 1/4) are added. 10 kg/cm”
The gas phase polymerization was carried out at 50° C. for 1.4 hours.
メルトインデックス(MI)4.4g710分の軟質ボ
リブロビレン810gか得られた。この軟質ポリプロピ
レンは,ポリプロピレンホモ重合体81重量%とエチレ
ンープロピレン共重合39重量%とからなり、ホモ重合
体は、固有粘度が1.13d文/gの沸騰へブタン可溶
分(HSP分)46.8重量%と固有粘度が1.74d
l / gの沸騰へブタン不溶分(HIP分)53.
2重量%とからなり、”C−NMRによるベンタッド分
率においてr r r r / 1 − m m m
mか34.5%、DSCにて測定した融解ピーク温度(
Tm)が158℃、DSCにて測定した融解エンタルピ
ー(△H)が58.2J/g、そして透過型電子m*鏡
での観察においてドメイン構造が観察された.一方、共
重合体のエチレン単位含有量は39モル%であり,固有
粘度は1.77dl/gてあった.
上記実施例の結果、実施例lと同様、ヒートシール温度
143゜C.#熱温度145℃以上の積層体を得ること
ができた。810 g of soft polypropylene with a melt index (MI) of 4.4 g and 710 min was obtained. This flexible polypropylene consists of 81% by weight of polypropylene homopolymer and 39% by weight of ethylene-propylene copolymer, and the homopolymer has a boiling hebutane soluble content (HSP content) with an intrinsic viscosity of 1.13 db/g. 46.8% by weight and intrinsic viscosity of 1.74d
l/g boiling butane insoluble content (HIP content) 53.
2% by weight, and the bentad fraction by C-NMR is r r r r / 1 - mm m m
m or 34.5%, melting peak temperature measured by DSC (
Tm) was 158°C, the enthalpy of fusion (ΔH) measured by DSC was 58.2 J/g, and a domain structure was observed when observed with a transmission electron m* mirror. On the other hand, the ethylene unit content of the copolymer was 39 mol%, and the intrinsic viscosity was 1.77 dl/g. As a result of the above example, the heat sealing temperature was 143°C, similar to Example 1. #A laminate with a thermal temperature of 145°C or higher was able to be obtained.
1眞亘ユ
軟質ホモPP(実施例lと同じ)層とナイロン屑とを接
着剤を使用して積層することにより積層体を製作した.
層構威は、軟質ホ七PP/接着剤/ナイロン/接着剤/
軟質ホモpp(厚さ比1/0.5/8/0.5/1)で
ある。なお、ナイロンは、ηr(相対精度)=3.75
6−ナイロン(宇部興産(株)製)を使用し、また
接着剤はカルボン酸変性ボリプロビレンを使用した.
使用戒形機は、実施例1と同一のもの(接着剤用押出機
を付設し、フィートブロックとマルチマニホールドを使
用した。或形温度は250℃,ナイロン押出量は1 1
. 5〜11. 8Kg/Hr .カルボン酸変性ポリ
プロピレン押出量は0 . 6 Kg/Hrとした.
上記戊形機でフィルム厚3 0 gm7 1 5 gm
/2 4 0 4 m / 3 0 g mの積層体フ
イルムを得、これをデーブルテンターで3×3に延伸し
、3ルm/1.5pLm/27gm/1.5pm/3u
Lmのフィルム厚とした.
この積層体フィルムも耐熱性,酸素非透過性に優れ、ラ
ップフィルムとして好適な特性を示した.
実通0生4
軟質ホモPP(実施例lと同じ)層とEVOH層とを、
接着剤を使用して積層することにより積層体を製作した
.
層構戒は、軟質ホモPP/接着剤/EVOH/接着剤/
軟質ホ七PPである.なお、EVOHは、エチレン含有
量32モル%EP−F((株)クラレ製)を使用し、そ
の他の条件は実施例3と同一とした.
延伸後のフィルムは、酸素非透過性,耐熱性に優れ、ラ
ップフイルムとして好適な特性を示した.
失』U生至
軟質ホモPP(実施例lと同じ)層とアルミニウム層と
を接着剤を使用して積層することにより積層体を製作し
た.層構戒は、軟質ホモPP/接着剤/アルミニウムで
ある.製作は、実施例1で使用した軟質PP押出機に接
着剤用押出機を付設し、軟質PP/接着剤=30gm/
15gmの共押出しを行ない、それに厚さ15μmのア
ルミニウム箔をラミネートした.
得られたフィルムの内層を軟質PPとしてヒートシール
することにより袋を形成した.このときのヒートシール
温度は143℃であり、耐熱温度は145℃以上であり
、低温ヒートシール性および耐熱性に優れ、例えばレト
ルトバウチ用として好適な特性を示した.
[発明の効果]
以上説明したように、本発明の積層体は、軟質ポリプロ
ピレンを主として使用することにより,溶着温度を従来
より低く、例えばl5℃低くすることができ、さらに柔
軟性および耐熱性にも優れ、その結果、様々な用途の包
装材料,フィルム材料、シート材料等に使用してその商
品価値の向上を図ることができるという効果がある.1. A laminate was produced by laminating a layer of soft homo-PP (same as in Example 1) and nylon scraps using an adhesive. The layer structure is soft H7 PP/adhesive/nylon/adhesive/
It is a soft homopp (thickness ratio 1/0.5/8/0.5/1). In addition, for nylon, ηr (relative accuracy) = 3.75
6-nylon (manufactured by Ube Industries, Ltd.) was used, and carboxylic acid-modified polypropylene was used as the adhesive. The molding machine used was the same as in Example 1 (an extruder for adhesive was attached, a foot block and a multi-manifold were used. The molding temperature was 250°C, and the amount of nylon extruded was 1.1
.. 5-11. 8Kg/Hr. The throughput of carboxylic acid-modified polypropylene was 0. 6 Kg/Hr. The film thickness is 30 gm with the above cutting machine 715 gm
A laminate film of /2404m/30gm was obtained, and this was stretched to 3x3 with a table tenter to form a laminate film of 3lm/1.5pLm/27gm/1.5pm/3u.
The film thickness was set to Lm. This laminate film also had excellent heat resistance and oxygen impermeability, and exhibited properties suitable for use as a wrap film. Actual 0 raw 4 Soft homo PP (same as Example 1) layer and EVOH layer,
A laminate was fabricated by laminating layers using adhesive. The layer structure is soft homo PP/adhesive/EVOH/adhesive/
It is soft H7PP. As EVOH, EP-F (manufactured by Kuraray Co., Ltd.) with an ethylene content of 32 mol % was used, and the other conditions were the same as in Example 3. The stretched film had excellent oxygen impermeability and heat resistance, and exhibited properties suitable for use as a wrap film. A laminate was produced by laminating a layer of soft homo-PP (same as in Example 1) and an aluminum layer using an adhesive. The layer structure is soft homo-PP/adhesive/aluminum. For production, an adhesive extruder was attached to the soft PP extruder used in Example 1, and soft PP/adhesive = 30gm/
A 15 gm coextrusion was carried out, and a 15 μm thick aluminum foil was laminated thereon. A bag was formed by heat-sealing the inner layer of the resulting film as soft PP. The heat-sealing temperature at this time was 143°C, and the heat-resistant temperature was 145°C or higher, showing excellent low-temperature heat-sealability and heat resistance, and suitable characteristics for use in retort pouches, for example. [Effects of the Invention] As explained above, by mainly using soft polypropylene, the laminate of the present invention can have a welding temperature lower than conventional ones, for example, by 15 degrees Celsius, and also has improved flexibility and heat resistance. As a result, it has the effect of being able to be used in packaging materials, film materials, sheet materials, etc. for various purposes to improve their commercial value.
第1図(a).(b),(c)はそれぞれ本発明の積層
体の構戒例を示す断面図である。
Zoo:軟質ポリプロピレン層
200:他の材料層Figure 1(a). (b) and (c) are cross-sectional views each showing an example of the structure of the laminate of the present invention. Zoo: Soft polypropylene layer 200: Other material layer
Claims (3)
も一つの材料層を軟質ポリプロピレンを主体として形成
したことを特徴とする積層体。(1) A laminate comprising a plurality of material layers, in which at least one material layer is mainly made of soft polypropylene.
塑性樹脂または熱硬化性樹脂のうちいずれか一つからな
る材料層を含むことを特徴とする積層体。(2) The laminate according to claim 1, characterized in that the laminate includes a material layer made of at least one of a thermoplastic resin and a thermosetting resin.
とも金属、ゴム、布、紙、木、セロハン、または皮革の
うちいずれか一つからなる材料層を含むことを特徴とす
る積層体。(3) The laminate according to claim 1 or 2, characterized in that the laminate includes a material layer made of at least one of metal, rubber, cloth, paper, wood, cellophane, or leather.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1308580A JP2534370B2 (en) | 1989-11-28 | 1989-11-28 | Laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1308580A JP2534370B2 (en) | 1989-11-28 | 1989-11-28 | Laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03169547A true JPH03169547A (en) | 1991-07-23 |
JP2534370B2 JP2534370B2 (en) | 1996-09-11 |
Family
ID=17982743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1308580A Expired - Fee Related JP2534370B2 (en) | 1989-11-28 | 1989-11-28 | Laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2534370B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000202960A (en) * | 1999-01-19 | 2000-07-25 | Hagihara Industries Inc | Laminated cloth and production thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4957085A (en) * | 1972-10-04 | 1974-06-03 | ||
JPS5681034U (en) * | 1979-11-22 | 1981-07-01 | ||
JPS59122506A (en) * | 1982-12-28 | 1984-07-16 | Sumitomo Chem Co Ltd | Flexible propylene polymer |
JPS62119215A (en) * | 1985-11-20 | 1987-05-30 | Mitsui Petrochem Ind Ltd | Propylene random copolymer and use thereof |
JPS63149149A (en) * | 1986-12-15 | 1988-06-21 | 東レ株式会社 | Thermal adhesive biaxial-oriented polypropylene film |
-
1989
- 1989-11-28 JP JP1308580A patent/JP2534370B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4957085A (en) * | 1972-10-04 | 1974-06-03 | ||
JPS5681034U (en) * | 1979-11-22 | 1981-07-01 | ||
JPS59122506A (en) * | 1982-12-28 | 1984-07-16 | Sumitomo Chem Co Ltd | Flexible propylene polymer |
JPS62119215A (en) * | 1985-11-20 | 1987-05-30 | Mitsui Petrochem Ind Ltd | Propylene random copolymer and use thereof |
JPS63149149A (en) * | 1986-12-15 | 1988-06-21 | 東レ株式会社 | Thermal adhesive biaxial-oriented polypropylene film |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000202960A (en) * | 1999-01-19 | 2000-07-25 | Hagihara Industries Inc | Laminated cloth and production thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2534370B2 (en) | 1996-09-11 |
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