JPH03165985A - Combined machine of laser beam and punch - Google Patents

Abstract

PURPOSE:To stabilize and simplify an optical path by always holding a laser beam oscillator in a buffered state by a frame of a punch press and guiding a laser beam to a laser beam machining head from the laser beam oscillator via a flexible beam guiding member. CONSTITUTION:Since the laser beam oscillator 47 is always supported in a buffered state via a buffer 51, it can be protected from vibration at the time of working by the punch press P and vibration of a different machine, etc., and it is not necessary to change over a supporting state and constitution can be more simplified. In addition, at the time of laser beam machining, since the laser beam is guided to the laser beam machining head 49 by the flexible beam guiding member 61, the relative vibration is absorbed at a part of the beam guiding member 61 and the vibration to the laser beam oscillator 47 can be cut off and the laser beam can be surely guided to the laser beam machining head 49.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention is a laser bunch press that is formed by adding a laser processing function to a punch press that punches a plate-shaped workpiece. Regarding processing machines.

(Prior Art) Conventionally, as a laser/punch combination processing machine that adds a laser processing function to a punch press, a configuration has been proposed in which a laser processing head is attached to the punch mounting hole of the frame or upper turret of a turret punch press, for example. 1
Department has been implemented.

As is well known, punch presses generate severe vibrations during punching, and on the other hand, it is necessary to provide vibration isolation to protect laser oscillators, laser processing heads, etc. from the vibrations. Therefore, conventionally, a laser oscillator is placed apart from the punch press, and a plurality of bend mirrors bend the laser beam to guide the laser beam to the position of the laser processing head. Also, a configuration has been developed in which a laser oscillator is attached to the frame of a punch press via a buffer device.

(Problems to be Solved by the Invention) In a configuration in which the punch press and the laser oscillator are separated from each other, it is necessary to transport the punch press and the laser oscillator separately, install them separately, and then guide the laser beam to the laser processing head. Optical path adjustment is necessary, but adjusting the optical path is extremely troublesome as multiple bend mirrors must be adjusted, and the problem is that the optical path becomes long and the optical path is easily distorted by the intense vibration of the punch press. be. Furthermore, since they are installed separately, a large area is required.

In the structure in which the laser oscillator is attached to the frame of the punch press via a buffer device, the problems caused by separately installing the punch press and the laser oscillator are solved. However, during punch press processing, it is necessary to support the laser oscillator in a floating state from the frame using a buffer device, and during laser processing, it is necessary to stably support the laser oscillator on the frame to stabilize the optical path of the laser beam. be.

That is, in the above configuration, it is necessary to switch the support state between supporting the laser oscillator in a suspended state relative to the frame of the punch press and supporting it in a stable state.
In addition, in the case of stable support, reproducibility is required, so there are problems such as the support structure is complicated and processing accuracy is required to improve positioning accuracy.

[Structure of the Invention] (Means for Solving the Problems) In order to solve the conventional problems as described above, the present invention includes a plurality of punches and dies, and a method for moving and positioning a workpiece processed by the punches and dies. A laser processing head comprising a punch press equipped with a workpiece positioning device for performing laser processing and a striker movable up and down for applying force to the punch, and a laser processing head for performing laser processing.
As a multi-purpose punch processing machine, the laser oscillator is always supported in a buffered state via a buffer device on the frame of the punch press.
This laser oscillator and the laser processing head are connected by a flexible light guide member, and the light guide member guides laser light from the laser oscillator to the laser processing head.

(Function) In the above configuration, the laser oscillator is always supported in a buffered state via the buffer device, so it can be protected from vibrations during processing by the punch press and vibrations of another processing machine, etc. No need to switch states,
Configuration becomes easier. In addition, during laser processing, since the laser beam is guided to the laser processing head by a flexible light guide member, relative vibrations are absorbed in the light guide member, blocking the transmission of vibrations to the laser oscillator. At the same time, it is possible to reliably guide the laser beam to the laser processing head.

(Example) Referring to FIG. 1, a laser/punch press combined processing machine 1 integrates a punch press P for punching a plate-shaped workpiece W and a laser processing machine L for laser processing. It is a combination.

As the punch press P, a turret punch press is illustrated in this embodiment. First, this punch press P
To explain the structure of the punch press, the frame body 3 of the punch press is composed of an annular first frame 5 and a second frame 7. More specifically, in this example, the second
Frame 7 is illustrated as an outer frame, and first frame 5 is illustrated as an inner frame.

The second frame 7 is formed by integrating a pair of plates spaced apart from each other by welding or the like, and the lower frame portion 7L is integrally attached to the base 9, and the left and right ends of the upper frame portion 7U are connected to the left and right ends of the upper frame portion 7U. It has an annular configuration supported by the side frame portion 7S.

The first frame 5 is arranged inside the second frame 7, and like the second frame 7, it is structured in an annular shape by a lower frame part 5L, an upper frame part 5U, and left and right side frame parts 5S. be. In this example,
The lower frame portion 5L is integrally attached to a portion of the second frame 7 that is less deformed, for example, at a neutral position of deformation or to the lower frame portion 7L, by suitable means such as welding. Note that the structure in which the lower frame portion 5L of the first frame 5 is integrated with the second frame 7 is not limited to the structure in which it is fixed to the second frame 7 as shown in FIGS. 1 and 2. For example, the first frame 5 may be integrally supported on the base 9.

As is already clear from the above configuration, the upper frame portion 5U of the first frame 5 and the upper frame portion 7 of the second frame 7
It is separated from U. Therefore, even if the upper frame portion 7U of the second frame 7 is deformed, the upper frame portion 5U of the first frame 5 is not directly affected.

The lower frame portion 5L of the first frame 5 includes:
A lower turret 13 as a mold holder that supports a large number of dies 11 as molds is rotatably supported. Further, an upper turret 17 supporting a large number of bunches 15 corresponding to the dies 11 is rotatably supported on the upper frame portion 5U.

Each chain or timing belt 23.25, which is wound around a sprocket 19.21 attached to the rotating shaft of each of the upper and lower turrets 13.17, is mounted on a rotating shaft 27 rotatably supported by the first frame 5. upper and lower sprockets 2
It is hung around. This rotating shaft 27 includes a sprocket,
The first frame 5 is connected via a rotation transmission mechanism 31 such as a chain.
It is interlocked and connected to a motor 33 attached to the motor.

Therefore, by appropriately controlling the motor 33,
The upper and lower turrets 17.13 can be rotated in the same direction at the same time,
Desired punches 15 and dies 11 can be indexed to predetermined positions.

The lower frame portion 5L of the first frame 5 is provided with a guide portion 35 extending in the left-right direction. 37 is movably guided and supported. A side table 36 for supporting a plate-shaped workpiece W is integrally attached to this carriage base 37, as in a general punch press.
A carriage 39 that is freely movable in the longitudinal direction of the base 37
is supported. A plurality of work lamps 41 for gripping a plate-shaped work W are attached to the carriage 39. The carriage base 37, the three carriages, the work lamp 41, etc. are used to move the work W supported on the fixed table 38 provided on the first frame 5 between the side table 36 and the guide parts 35 on both sides to the upper and lower turrets. 17. This constitutes a workpiece positioning device that moves back and forth, left and right with respect to 13, and positions the workpiece. Note that the configuration for reciprocating the carriage base 37 and the three carriages is similar to the configuration of a workpiece positioning device in a conventional punch press, so a detailed explanation will be omitted.

The upper frame portion 7U of the second frame 7 includes:
A pressing device 43 is provided for pressing the bunch 15 indexed and positioned at a predetermined position. The pressing device 43 is generally of a type in which a ram is moved up and down by a crank mechanism, but in this embodiment, a fluid pressure cylinder 45 is provided in the connecting member, and a piston rod 45P in this fluid pressure cylinder 45 is used. A mechanism for applying force to the punch 15 is illustrated. In other words, the configuration of the pressing device 43 is as follows:
It may be a crank mechanism, a hydraulic cylinder mechanism, or other configuration.

In the above configuration, the upper and lower turrets 17, 13
After appropriately positioning the work W in between, the fluid pressure cylinder 45 is operated and the punch 15 is moved by the piston rod 45P.
The workpiece W is processed by applying pressure to the workpiece W.

As described above, when processing the workpiece W by pressing the punch 15 with the piston rod 45P, the reaction force is applied to the upper frame portion 7 of the second frame 7 via the fluid pressure cylinder 45.
I will take it at U. Therefore, the upper frame portion 7
U is elastically deformed so that the central portion thereof moves upward.

By the way, the first frame 5 is attached to a portion of the second frame 7 that is less deformed, and the upper frame portion 5U of the first frame 5 and the 10 upper frame portion 7U of the second frame 7 are separated. As described above, even if the upper frame 17U of the second frame 7 is deformed, it does not directly affect the upper frame portion 5U of the first frame 5, etc. Therefore, the first frame 5
There is no misalignment of the axes of the upper and lower turrets 17 and 13 supported by the turrets 17 and 13, and the axes of the bunch 15 and the die 11 are always aligned. Therefore, the lifespan of the bunch 15 and the die 11 is extended, and the processing accuracy is further improved.

Next, to explain the structure of the laser processing machine L, the laser processing machine L includes a laser oscillator 47 and a laser processing head 4.
It is more structured as 9. The laser oscillator 47 is supported by the frame of the punch press P (in this embodiment, the base 9) in a vibration-isolated buffered state through a shock absorber 51. Although we will explain the case where the laser oscillator 47 is installed, if the laser oscillator 47 is relatively small and lightweight,
As shown by the imaginary line 47- in FIG.
It is also possible to attach it via '.

As the shock absorbing device 51 (51'), an ordinary spring or an air cushion can be used, but it is preferable to have a structure as shown in FIG. 4, for example. That is, an air spring 55 that supports the laser oscillator 47 within a cylindrical guide column 53 provided upright on the base 9.
will be established. Then, the guide column 53 and the laser oscillator 47
A cylindrical member 57 provided at the lower part of the guide column 53 and the cylindrical member 57 are fitted with each other with an appropriate gap, and an elastic member 59 such as an air tube is interposed between the guide column 53 and the cylindrical member 57.

With the above configuration, by supplying air to the air spring 55 and the elastic member 59 to support the laser oscillator 47, the laser oscillator 47 is supported in a vibration-isolated state,
In addition, movement in the horizontal direction is restricted. In addition,
At the time of maintenance and inspection, by removing air from the air spring 55 and the five elastic members, the laser oscillator 1 2 generator 47 can be directly supported by the guide column 53, and maintenance and inspection can be performed in a stable supported state.

The laser processing head 49 is equipped with a condenser lens, a nozzle, etc., and is supported so as to be vertically adjustable, like a normal laser processing head used in a laser/punch compound processing machine. In this embodiment, it is supported by the internal frame 5. One end of a light guide member 61 made of, for example, an optical fiber or a flexible waveguide (waveguide) with a high reflectance on the inner wall of a small diameter metal tube is connected to the upper part of the laser processing head 49. . The other end of the light guiding member 6 is connected to the laser oscillator 47.

The light guide member 61 functions to guide the laser beam oscillated by the laser oscillator 47 to the laser processing head 49, and the connection at both ends is the same as a normal connection configuration.

As is clear from the above configuration, the laser oscillator 47 is always supported in a vibration-isolated state via the buffer device 51, so that vibrations during processing in the punch press P or vibrations in other machine tools are not transmitted. This means that you will be protected from vibration without having to worry about it.

Furthermore, since the laser oscillator 47 and the laser processing head 49 are connected by a flexible light guide member 61, there is no need to adjust the optical path, and even if the laser oscillator 47 is always in a floating state, the laser beam can be transmitted. It can be reliably guided to the laser processing head 49.

[Effects of the Invention] As can be understood from the above description of the embodiments, according to the present invention, the laser oscillator can be maintained in a floating state at all times, and the laser oscillator is mounted on the frame of the punch press. Even so, the support structure can be simplified. In addition, the optical path is stable even when the laser oscillator is constantly floating, so there is no need to adjust the optical path.
The optical path configuration is simpler than the conventional one.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, and FIG. 1 is a front view schematically showing a laser punch multi-tasking machine, and FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1.
Figure 3 is a cross-sectional view along the ■-curve in Figure 1;
The figure is an enlarged sectional view taken along the line IV-IV in FIG. 1. P...Punch press L...Laser processing machine 47...Laser oscillator

Claims (1)

[Claims] Laser processing for a punch press comprising a plurality of punches and dies, a workpiece positioning device for moving and positioning a workpiece processed by the punches and dies, and a striker movable up and down for pressing the punches. A laser/punch compound processing machine is equipped with a processing head, and a laser oscillator is always supported in a buffered state on the frame of the punch press via a buffer device, and the laser oscillator and the laser processing head are connected to a flexible 1. A laser/punch compound processing machine, characterized in that the laser punch is connected to a laser beam by a light guide member, and the light guide member guides a laser beam from a laser oscillator to a laser processing head.