JPH0316290Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Field of Application) The present invention relates to a heat sink used in a heat generating component, such as a transistor forming an electronic circuit.

(Prior art) Figure 2 shows the American standard JEDEC (Joint Electron
This figure shows an example of a typical attachment of a TO-220 type transistor (Device Engineering Concil) to a heat sink. In the figure, reference numeral 1 denotes a heating element, which in this case is the aforementioned TO-220 type transistor. A heat sink 2 is formed in an L shape using a plate made of aluminum or the like, and radiates heat from the heating element 1. The heating element 1 is attached to the heat sink 2 by interposing the circon 3 to improve thermal conductivity and maintain insulation, and by tightening the washer 5 and spring washer 6 with the screw 4, and the nut 7. It is being done. The insulating bushing 8 ensures insulation between the screw 4 and the heat sink 1. The heat sink 1 to which the heating element 1 is attached has a substrate 9
It is attached via the L-shaped bent portion with screws 10, nuts 11, washers 12, and spring washers 13.

FIG. 3 shows another conventional example, and shows an example of attaching the heating element 2 shown in FIG. 2 to the heat sink 31. Here, instead of the screws and washers used in the example of FIG. 2, a spring 34 as shown is used, and the heat generating element 2 is brought into close contact with the heat sink 31 by the spring pressure. This attachment allows the heat of the heating element 2 to be transmitted to the heat sink 31. Further, the heat sink 31 is attached to the substrate using screws 10, nuts 11, etc., as in the example shown in FIG.

(Problems to be solved by the invention) However, in the first mounting structure,
The number of parts required to attach the transistor, which is a heating element, to the heat sink increases, and therefore, there are problems in that the attachment is time-consuming, complicated, and difficult to automate. In addition, although the second mounting structure has fewer parts than the first one, it is difficult to automate, and moreover, the spring that tightly connects the heating element 2 and the heat sink 31 may come off when strong vibrations are applied. Because of the danger involved, it was not necessarily technically satisfactory.

This invention takes the above problems into account, reduces the number of parts, shortens installation time, and facilitates work, making it possible to move from manual work to automation. It is also resistant to vibration and maintains maintainability. The aim is to provide a low-cost heat sink with improved heat dissipation performance.

(Means for solving the problem) In order to solve the above-mentioned problem, the present invention forms a heat sink using an elastic plate as a material, and has a flat part that comes into close contact with the heating surface of the heating element. At the same time, both sides are bent inwards so that they face each other, and then these opposing sides are bent toward each other in a dogleg shape to form wing parts and fins.

(Function) According to the present invention, since the heat sink is formed as described above, the wing portions press the heat generating element to be attached against the flat portion by elastic force, and work to bring the two into close contact. Furthermore, the heating element can be easily attached by applying pressure to the fins. Therefore, the above-mentioned problem can be eliminated.

(Example) Fig. 1 is a structural diagram showing a first embodiment of a heat sink according to the present invention, in which Fig. 1a is a front view of the heat sink mounting a transistor as a heat generating element, and Fig. 1b is a top view. It is. In the figure, the heat sink 21 is made of an elastic metal plate,
A flat part 21a that comes into close contact with the heat dissipation surface of the heating element 2, in this case a transistor, and wing parts 2 that are slightly thinner than the thickness of the heating element 2 and bent inward on both sides of the flat part 21a.
1b, and a fin 21c that is bent outward and opened as an extension of the wing portion 21b. 22
a and 22c are terminals for soldering, and are connected to the heating element 2.
The fins 21c are formed on one of the fins 21c and a flat portion 21a forming a contact surface with the fins 21c. Further, 2a is a connection terminal for the heating element.

FIG. 4 is a diagram illustrating changes in the shape of the heat sink 21, and shows the state before (dotted line) and after (solid line) the heat sink 2 is attached. The heat sink 21 has elasticity, so when the heating element 2 is attached, the wing portion 21b
Therefore, elasticity in the direction of arrow f acts. As a result, the heating element 2 is pressed toward the center of the flat part 21a of the heat sink 21, and its heat radiation surface comes into close contact, making it possible to efficiently conduct the generated heat to the heat sink 21, or in other words, to release it. Become.

From the above, it is understood that it is necessary to maintain sufficient flatness of the contact surface of the heat sink 21 with the heating element 2. If the angle α is set too small, the pressing force in the direction of arrow f will increase when the heating element 2 is inserted, but the heating element 2 will tend to shift left and right, and
Flatness is no longer maintained and sufficient contact area cannot be secured. Therefore, it is necessary to select appropriate values for the pressing force in the direction of the arrow f and the angle α depending on the strength, thickness, and area of the metal plate.

FIG. 5 is a diagram illustrating the procedure for attaching the heating element 2 to the heat sink 21. Figure a shows a case where the fin 21c is pushed from above as shown by arrow A to widen the opening of the fin 21c, and in this state the heating element 2 is inserted from the direction of arrow B. Thereafter, by removing the pressure applied to the fins 21c in the direction of arrow A, the heating element 2 can be brought into close contact with the flat portion 21b of the heat sink 21. In addition, in the same figure b, the heating element 2 is connected to the fin 21c.
Press the fin 21 from above in the direction of arrow C.
An example is shown in which the heat sink 21 is opened and placed in the heat sink 21 while being opened in the direction of arrow D.

The above is the heat sink 21 with the heating element 2 attached.
will then be attached to the board. At that time, the terminals 22a, 2 formed on the heat sink 21
Each terminal is inserted into the terminal hole 2c corresponding to the terminal hole 2c, for example, the terminal hole 23 arranged as shown by the circle in FIG. At this time, the heat sink 21
A force g is applied to the fins 21c inward from the terminal holes 23 on the board. Therefore, the heat sink 21 is temporarily fixed on the substrate by its elastic force until dipping, and then fixed to the substrate by soldering. Here, Finn 21c
Since one of the fins 21c has no terminal and is not soldered, the elastic force of the unfixed fin 21c remains effective even after the heat sink 21 is soldered. Therefore, even after the heat sink is attached to the board, the elastic force of the fins 21c in the free state causes the heating element 2 to be moved to the flat portion 21a with a constant force.
This allows them to be pressed against each other, thereby maintaining the close contact between them.

FIG. 6 shows a second embodiment of the present invention.
An example is shown in which the heating element 2, for example a transistor, is mounted horizontally. Figure a is its front view, and figure b
is its side view. In this example, the heating element 2 is attached to the heat sink 61 in the same manner as in the first embodiment. Thereafter, attachment to the board is performed by soldering the soldering terminals 62a formed on the heat sink 61.

(Effects of the Invention) As described above in detail, when the heat sink according to the present invention is used, screw fastening is unnecessary, so installation can be easily performed with one touch, and assembly time can be shortened. In addition, since the number of parts is only one, manufacturing is easy, and production management is also easy. Automation is extremely easy, and there is no risk of it coming off due to vibrations, etc., resulting in manufacturing and quality effects. You can expect it. Furthermore, by changing the width and length of the heat sink fins as necessary, a design effect can be expected in that the design can be easily made in accordance with the heat generation amount of the heating element and the mounting space.

[Brief explanation of the drawing]

Fig. 1 is a structural diagram showing the first embodiment of the heat sink according to the present invention, Fig. 1a is a front view thereof, Fig. 1b is a top view thereof, and Figs. 2 and 3 are conventional heat sink installations. A side view showing an example, FIG. 4 is a diagram explaining the shape change of the heat sink according to the present invention,
Figures 5a and 5b are diagrams explaining the procedure for attaching the heating element to the heat sink, and Figure 6 is a structural diagram showing a second embodiment of the heat sink according to the present invention.
is its front view, and figure b is its side view. 2 is a heating element, 21, 61 is a heat sink, 21
a is a flat portion, 21b is a wing portion, and 21c is a fin.

Claims (1)

[Scope of Claim for Utility Model Registration] A heat sink that promotes heat radiation from a heating element having a flat heat radiation surface, which is made of an elastic plate material, and includes a flat portion 16a that contacts the heat radiation surface of the heating element, and a flat portion 16a on both sides of the flat portion. a wing portion 16b bent inward so as to approach each other; and a wing portion 16b bent outward as an extension of the wing portion;
A heat sink characterized in that it is formed of a fin 16c with a wide opening at its tip, and the heating element is attached by pressing the heat dissipation surface of the heating element against the bottom part with the wing part.