JPH081371U - Metal substrate - Google Patents

Abstract

(57) Abstract: A metal substrate that simplifies the mounting structure of a metal substrate to a mounting plate and the mounting structure of other parts to the metal substrate, simplifies the structure realization process, and reduces the number of parts. I will provide a. An insulating layer (2) is formed on a metal base (1), and a circuit pattern (3) is formed on the insulating layer (2). The metal substrate 4 is provided with a hole 16 penetrating at least the metal base 1 and the insulating layer 2. The lower end of the spacer 6 is fixed in the hole 16 of the metal substrate 4, and the main body of the spacer 6 is fixed to the circuit pattern 3 of the metal substrate 4.
Stand on the side. Attach the metal board 4 to the upper end of the spacer 6
2 is provided, and a screw hole 9 is provided at the lower end so that other members such as the heat dissipation plate 18 can be attached.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a metal substrate in which an insulating layer is formed on a metal base and a circuit pattern is formed on the insulating layer, and more particularly to a mounting structure for a mounting plate and a mounting structure for other components.

[0002]

[Prior art]

 FIG. 2 shows a conventional metal substrate. The metal substrate 4 is formed by adhering an insulating layer 2 on a base 1 made of a metal plate, and a circuit pattern 3 is formed on the insulating layer 2. In the frame ground structure, the base 1 and the circuit (earth) pattern 3 are connected by the bolts 5 screwed to the metal base 1, and the bolts 5 and the circuit pattern 3 or the substrate base are made of a conductive and adhesive material. It is realized by connecting 1 and 1 (Japanese Patent Laid-Open No. 63-77188).

[0003]

[Problems to be solved by the device]

 However, in the above conventional structure, since the frame ground structure is realized by the bolt 5, when the metal board is mounted on the mother board or other mounting plate of the apparatus, another mounting means must be added. Therefore, the mounting structure of the metal substrate becomes complicated and the number of parts increases.

Further, when mounting a heat sink or other members, another mounting means must be provided, which further complicates the component mounting structure, complicates the structure realizing process, and reduces the number of parts. Increase.

In view of the above problems, the present invention simplifies the mounting structure of the metal substrate to the mounting plate and the mounting structure of other components to the metal substrate, and simplifies the structure realizing process, It is an object of the present invention to provide a metal substrate whose number of points can be reduced.

[0006]

[Means for Solving the Problems]

 According to the present invention, in a metal substrate in which an insulating layer is formed on a metal base and a circuit pattern is formed on the insulating layer, the metal substrate is provided with a hole penetrating at least the metal base and the insulating layer, By fixing the lower end of the spacer to the hole of the metal substrate, the main body of the spacer can be erected on the circuit pattern side of the metal substrate, and the metal substrate can be attached to the mounting plate at the upper end of the spacer. In addition, a screw hole that allows other members to be attached is also provided at the lower end.

[0007]

[Action]

 In this way, by providing mounting boards on both the top and bottom of the spacer and screw holes for mounting other parts, it is possible to mount the metal substrate to the mother board and other mounting plates using the spacer. In addition to this, it becomes possible to attach other members such as a heat sink to the metal base.

[0008]

【Example】

 FIG. 1A is a sectional view showing an embodiment of the present invention, and FIG. 1B is a sectional view showing a concrete application example thereof. In the figure, 1 is a base of the metal substrate 4, 2 is an insulating layer, 3 is a circuit pattern, and 6 is a spacer. The spacer 6 is formed by fitting the lower end portion into the holes formed in the metal base 1 and the insulating layer 2 and the circuit pattern 3 which constitute the metal substrate 4 by press fitting, or as shown in the drawing. A male screw groove 15 is provided on the outer periphery of the lower end side of 6, and the main body of the spacer 6 is erected on the circuit pattern 3 side by screwing the male screw groove 15 into a screw hole 16 provided in the metal base 1. In addition, the spacer 6 is fixed to the metal substrate 4. Further, by soldering the circuit (ground) pattern 3 formed around the spacer 6 on the insulating layer 2 and the spacer 6, the frame ground between the circuit pattern 3 and the metal base 1 can be more reliably obtained. Can be taken. Further, if the inner diameter of the circuit pattern 3 formed around the spacer 6 is made larger than the outer diameter of the contact portion of the spacer 6 which contacts the spacer receiving portion of the metal substrate 4, the spacer It is possible to avoid the risk of the circuit pattern 3 peeling off due to the contact pressure of 6.

A threaded hole 9 is formed at the center of the spacer 6 so as to penetrate therethrough. In this example, the female screw hole 10 at the upper end of which the metal substrate 4 can be attached to the mounting plate and the screw hole 17 at the lower end of which another member can be attached have different diameters. The connection of the spacer 6 to the circuit pattern 3 with the solder 8 can be performed simultaneously with the soldering of the other component to the circuit pattern on the substrate 4.

Further, in the present embodiment, since the groove 11 is provided in the circumferential direction in the circumference of the portion of the spacer 6 to which the solder 8 is attached in the vicinity of the side opposite to the substrate side, the solder of the spacer 6 is soldered during soldering. The heat transfer resistance from the soldered part to other parts is large, and soldering can be performed reliably.

FIG. 1B is a cross-sectional view showing a state in which the metal substrate 4 is attached to the mounting plate 12, and a screw (or a bolt) inserted into a hole 13 provided in the mounting plate 12 with respect to the spacer 6. The metal substrate 4 can be attached to the attaching plate 12 by screwing the g) 14 into the female screw hole 10.

Further, for example, a screw (or bolt) 20 inserted into a hole 19 provided in the heat dissipation plate 18 can be screwed into the female screw hole 17 to attach the heat dissipation plate 18 or the like. In this case, since the spacer 6 does not project to the mounting side of the radiator plate 18, it is possible to mount the radiator plate 18 in close contact with the metal base 1 without making the mounting hole 19 of the radiator plate 18 so large. The heat transfer resistance can be reduced.

[0013]

[Effect of device]

 According to claim 1, in a metal substrate having an insulating layer formed on a metal base and a circuit pattern formed on the insulating layer, a spacer fixed to the metal base has a metal substrate at its upper end. Since a screw hole is provided so that it can be attached to the attachment plate and other members can be attached to the lower end, it is possible to attach the metal substrate to the attachment plate by using the spacers. It is possible to attach other components such as a heat sink to the base surface. This simplifies the mounting structure of the metal substrate to the mounting plate, reduces the number of parts, and simplifies the structure realizing process.

[Brief description of drawings]

FIG. 1A is a sectional view showing an embodiment of the present invention;
(B) is a sectional view showing an application example of the embodiment.

FIG. 2 is a cross-sectional view showing a conventional metal substrate.

[Explanation of symbols]

1: metal base, 2: insulating layer, 3: circuit pattern, 4:
Metal substrate, 6: spacer, 9: screw hole, 11: groove, 12: mounting plate, 14, 20: screw, 15: male screw groove, 16: screw hole, 18: heat sink

Claims (1)

[Scope of utility model registration request] 1. A metal substrate in which an insulating layer is formed on a metal base and a circuit pattern is formed on the insulating layer, wherein the metal substrate is provided with a hole penetrating at least the metal base and the insulating layer, The lower end of the spacer is fixed to the hole of the metal board, the main body of the spacer is erected on the circuit pattern side of the metal board, and the metal board can be attached to the mounting plate at the upper end of the spacer. A metal substrate having a screw hole at the lower end to which another member can be attached.