JPH03161187A - Laser beam machining method - Google Patents
Laser beam machining methodInfo
- Publication number
- JPH03161187A JPH03161187A JP1297597A JP29759789A JPH03161187A JP H03161187 A JPH03161187 A JP H03161187A JP 1297597 A JP1297597 A JP 1297597A JP 29759789 A JP29759789 A JP 29759789A JP H03161187 A JPH03161187 A JP H03161187A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- machining
- processing
- work
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 title abstract description 10
- 238000000034 method Methods 0.000 title abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 238000003672 processing method Methods 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 12
- 239000007788 liquid Substances 0.000 abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 5
- 230000003746 surface roughness Effects 0.000 abstract description 4
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 12
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 9
- 229910001882 dioxygen Inorganic materials 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000007779 soft material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
く産業上の利用分野〉
本発明は、レーザビームによる被加工物の加工に際し、
加工面の表面粗さを向上し得ると共に加工面の割れを防
止し得るレーザ加工法。[Detailed Description of the Invention] Industrial Application Fields The present invention provides a method for processing a workpiece using a laser beam.
A laser processing method that can improve the surface roughness of a machined surface and prevent cracks on the machined surface.
く従来の技術〉
近年、高出力のレーザ発振器が目ざましく開発されて来
たため、これに伴い、レーザビームによる切断加工等の
レーザ加工の利用分野も薄板材から厚板材の加工まで拡
大しつつあり、加工装置や、加工法も種々のものが開発
されている。In recent years, high-output laser oscillators have been developed at a rapid rate, and as a result, the field of application of laser processing, such as cutting using laser beams, is expanding from processing thin plates to thick plates. , various processing devices and processing methods have been developed.
この加工の一例として、レーザ加エヘッドを用いたもの
が知られており、例えば、硬くて脆い材質及び歌い材質
などの被加工材でもレーザ加エヘッドで切断などの加工
が可能となっている。これら、硬くて脆い材質の材料の
加工を第３図に示すと共に、歌い材料の加工を第４図に
示し、これらの図に基づき説明する。As an example of this processing, a method using a laser processing head is known, and for example, it is possible to perform processing such as cutting even on hard and brittle materials and materials to be processed, such as singling materials. The processing of these hard and brittle materials is shown in FIG. 3, and the processing of the singing material is shown in FIG. 4, and will be explained based on these figures.
第３図（ａ）及び第４図ｔａ）に示すように、レーザ加
エヘッドは図示しないレーザ発振器からのレーザビーム
がレーザ加エヘッド１５内のミラー１３により図面上，
下方に反射され、その後、収束レンズ１を通過して被加
工物であるワーク３０表面にレーザ光が集光されるよう
に構成されている。また、この加工を外気からシールド
するために酸素ガスが供給管１７から供給されている。As shown in FIG. 3(a) and FIG.
The laser beam is configured so that it is reflected downward, and then passes through the converging lens 1 and is focused on the surface of the workpiece 30, which is the object to be processed. Further, oxygen gas is supplied from a supply pipe 17 in order to shield this processing from the outside air.
従って、ワーク３は、酸素ガスにより外気からシールド
されつつ、酸素ガスで瞬間的な燃焼が促進されると共に
、レーザビームのエネルギにより溶融されて、切断等の
加工がされる。Therefore, the workpiece 3 is shielded from the outside air by the oxygen gas, instantaneous combustion is promoted by the oxygen gas, and the workpiece 3 is melted by the energy of the laser beam and processed such as cutting.
く発明が解決しようとする課題〉
第３図（ａｌに示すように、セラミック材などの硬くて
脆い材質であって板厚の厚いワーク３は、板厚が厚いた
め、加工時に寓温となり、この結果熱的影響により、残
留応力が発生し易い。従って、加工の際にワーク３に第
３図（ｂｌに示すような、割れ５が発生し易い課題を有
していた。Problems to be Solved by the Invention> As shown in Figure 3 (al), the workpiece 3, which is made of a hard and brittle material such as a ceramic material and is thick, becomes cold during processing due to its thick thickness. As a result, residual stress is likely to occur due to thermal effects.Therefore, during machining, cracks 5 as shown in FIG. 3 (bl) are likely to occur in the workpiece 3.
一方、第４図１ａｌに示すように、軟い材質であって板
厚の厚いワーク３は、通常、融点が低く、溶融し易いた
め、加工される部分の周辺まで高温となり溶融され、こ
の溶融した部分が加工後、自然に冷却されて加工面の表
面を形成することとなる。On the other hand, as shown in Fig. 4 1al, the workpiece 3, which is made of a soft material and has a thick plate, usually has a low melting point and is easily melted. After processing, the part cools naturally and forms the surface of the processed surface.
従って、第３図（ｂ）に示すように、加工表面に、一度
、溶融した材料による凹凸部８が形威され、表面粗さを
悪化させる課題を有していた。Therefore, as shown in FIG. 3(b), irregularities 8 formed by the melted material are formed on the machined surface, resulting in a problem of worsening the surface roughness.
く課題を解決するための手段〉
本発明によるレーザ加工法は、被加工物の予め加工が予
定されている加工部を冷却した後、レーザビームにより
この加工部を加工することを特徴とするものである。Means for Solving the Problems〉 The laser processing method according to the present invention is characterized in that a processing portion of a workpiece that is scheduled to be processed is cooled in advance, and then this processing portion is processed with a laser beam. It is.
く作 用〉
被加工物の予め加工が予定されている加工部が冷却され
た後、レーザビームが照射されてこの加工部が加工され
る。Function> After the processing portion of the workpiece that is scheduled to be processed in advance is cooled, the laser beam is irradiated to process this processing portion.
く実 施 例〉
本発明方法の一夾施例が実施されるための冷却機器及び
レーザ加エヘッドを第１図及び第２図に図示し、説明す
る。Embodiments A cooling device and a laser processing head for carrying out one embodiment of the method of the present invention are shown in FIGS. 1 and 2, and will be described.
なお、本実施例は、軟い材質の材料を被加工物であるワ
ークとして、切断加工に応用したものである。Note that this embodiment is applied to a cutting process using a soft material as a workpiece.
第１図に示すように、冷却媒体である液体窒素を収容す
るタンク１０には開閉弁１０ａを介して送通官１１が連
結されており、送通管１１の端部にはワーク３に対向す
るように位置したノズルｌｌａが形成されている。As shown in FIG. 1, a transport pipe 11 is connected to a tank 10 containing liquid nitrogen, which is a cooling medium, via an on-off valve 10a. A nozzle lla is formed.
一方、第２図に示すように、レーザ加工ヘッド１５は図
示しないレーザ発振器及び、このレーザ発振器に接続し
て、レーザビームを送通するための伝送管１６などから
形或されている。伝送管１６内には、レーザビームをヮ
ーク３に照射するようにレーザビームの送還方向を変え
るミラー１３及び、レーザビームをワーク３上の一点に
収束する収束レンズ１が取付けられている。また、伝送
管１６には、酸素ガスを図示しない供給タンクから供給
して、ワーク３の切断箇所を外気とシールドするための
供給管１７．２０が取付けられている。伝送’ＩＩ′１
６の端部にはレーザビームをワーク３に照射し、また、
供給官２０を通過した酸素ガスを放出するノズルチップ
１６ａが取付けられている。On the other hand, as shown in FIG. 2, the laser processing head 15 is formed from a laser oscillator (not shown), a transmission tube 16 connected to the laser oscillator, and for transmitting a laser beam. A mirror 13 that changes the sending direction of the laser beam so as to irradiate the workpiece 3 with the laser beam, and a converging lens 1 that converges the laser beam onto a single point on the workpiece 3 are installed in the transmission tube 16 . Furthermore, supply pipes 17 and 20 are attached to the transmission pipe 16 for supplying oxygen gas from a supply tank (not shown) and shielding the cut portion of the workpiece 3 from the outside air. Transmission 'II'1
At the end of 6, a laser beam is irradiated onto the workpiece 3, and
A nozzle tip 16a is attached to discharge the oxygen gas that has passed through the supply tube 20.
以上の冷却機器及びレーザ加エヘッドを用いた本発明の
実施例を以下に説明する。Embodiments of the present invention using the above cooling equipment and laser processing head will be described below.
第１図に示す冷却機器１８を用いると、液体窒素あるい
は液体窒素からの窒素ガスが送通管１１を通ると共にワ
ーク３に放出され、予め切断を予定した箇所及びその周
辺部が冷却されることとなる。When the cooling device 18 shown in FIG. 1 is used, liquid nitrogen or nitrogen gas from the liquid nitrogen passes through the feed pipe 11 and is discharged to the workpiece 3, thereby cooling the area scheduled to be cut in advance and the surrounding area. becomes.
この後、この冷却されたワーク３の冷却部９は、第２図
に示すように、レーザ加エヘッド１５のレーザビームに
より切断加工される。Thereafter, the cooled part 9 of the cooled workpiece 3 is cut by a laser beam from a laser processing head 15, as shown in FIG.
すなわち、第２図に示す、レーザ加エヘッドｌ５のレー
ザ発振器から発生したレーザビームは、伝送官１６内を
送通すると共に、ミラー１３により反射して送還角度を
変えられた後、収束レンズ１により集光されつつ、ノズ
ルチップｌｅａよ咋射出される。また、この射出に伴い
、シールドのための酸素ガスも供給管１７及び伝送管１
６の外周に取付けられた供給官２０を通り、ノズルチッ
プ１６ａから放出されろ。That is, the laser beam generated from the laser oscillator of the laser processing head 15 shown in FIG. The light is focused and ejected from the nozzle chip LEA. Along with this injection, oxygen gas for shielding is also supplied to the supply pipe 17 and the transmission pipe 1.
6 and is discharged from the nozzle tip 16a.
従って、ノズルチップ１６ｍより射出されたレーザビー
ムは、ワーク３上の予め冷却された冷却部９上の一点に
収束され、この収束された箇所がレーザビームのエネル
ギにより、高温となり、溶融して溶融部４を形成しつつ
、ワーク３が切断される。但し、冷却部９は、予め冷却
されているため、切断されて除去されろ部分以外の部分
は溶融されない。このため除去されろ部分以外の部分が
溶融されず、加工後の切断面１３の表面粗さが良好なも
のとなる。Therefore, the laser beam emitted from the nozzle tip 16m is focused on one point on the pre-cooled cooling part 9 on the workpiece 3, and this focused point becomes high temperature due to the energy of the laser beam and melts. The workpiece 3 is cut while forming the portion 4. However, since the cooling part 9 has been cooled in advance, the parts other than the parts to be cut and removed are not melted. Therefore, the portion other than the portion to be removed is not melted, and the surface roughness of the cut surface 13 after processing is improved.
また、セラミック材などの硬い材質の材料も同様の方法
により冷却し、その後レーザ加工すると、切断されて除
去される部分以外の部分は高温とならず、熱的影響によ
るワーク３の割れが発生しないこととなる。In addition, if hard materials such as ceramic materials are cooled in the same way and then laser processed, the parts other than the parts to be cut and removed will not reach high temperatures, and cracks in the workpiece 3 will not occur due to thermal effects. It happens.
尚、本発明はレーザ加工する前に冷却するため、岩石や
土、あるいは、常温状態で軟い材質及び液状となってい
る物質などのレーザ加工困難な他の物質にも応用可能で
ある。Since the present invention is cooled before laser processing, it can also be applied to other materials that are difficult to laser process, such as rocks, soil, or materials that are soft or liquid at room temperature.
冷却するための媒体も、本実施例の液体窒素だけでなく
、液体ヘリウム、液体アルゴン、液体酸素等の他の周知
な媒体を用いることが可能である。The cooling medium is not limited to the liquid nitrogen used in this embodiment, but other well-known media such as liquid helium, liquid argon, and liquid oxygen can also be used.
さらに、伝送管１６に冷却のためのノズル１１ａを取付
けると、冷却と同時にレーザ加工が行え、また、冷却の
ための媒体を液体酸素とすることにより、酸素ガス供給
のための供給ｗｌ７，２０から供給でき、冷却とシール
ドが同時に可能となる。Furthermore, by attaching the nozzle 11a for cooling to the transmission pipe 16, laser processing can be performed at the same time as cooling, and by using liquid oxygen as the cooling medium, from the supply wl7, 20 for oxygen gas supply. It is possible to provide cooling and shielding at the same time.
く発明の効果〉
本発明のレーザ加工法によれば、加工前に予め被加工材
を冷却することとした為、硬質材料の加工においては、
加工面に割れを発生させることなく加工を可能とし、ま
た、軟質材料の加工においても、加工面に凹凸を生じさ
せることなく加工を可能とした。Effects of the Invention According to the laser processing method of the present invention, since the workpiece is cooled in advance before processing, in the processing of hard materials,
This enables machining without creating cracks on the machined surface, and also enables machining of soft materials without creating irregularities on the machined surface.
従って、従来、レーザ加工が難しかった材料の加工にお
いても、高密度エネルギ源で集中熱源という特長を有す
るレーザ加工を高精度且つ高品質で行えることとなった
。Therefore, even in the processing of materials that have conventionally been difficult to laser-process, it is now possible to perform laser processing with high precision and quality using a high-density energy source and a concentrated heat source.
第１図は本発明の一実施例に係るレーザ加工法による冷
却を表す概念の断面図、第２図は本発明の一実施例に係
るレーザ加工法による加工を表す概念の断面図、第３図
及び第４図は従来技術に係るレーザ加工法を表す概念の
断面図である。
図 中、
１は収束レンズ、３はワーク、４は溶融部、５は削れ、
８は凹凸部、１０はタンク、１１は送通官である。
特許出願
三菱重工業
代 理FIG. 1 is a cross-sectional view of a concept representing cooling by a laser processing method according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a concept representing processing by a laser processing method according to an embodiment of the present invention, and FIG. 4 and 4 are conceptual cross-sectional views representing a laser processing method according to the prior art. In the figure, 1 is the converging lens, 3 is the workpiece, 4 is the melted part, 5 is the scraped part,
8 is an uneven portion, 10 is a tank, and 11 is a transporter. Patent application Mitsubishi Heavy Industries agent
Claims (1)
後、レーザビームによりこの加工部を加工することを特
徴とするレーザ加工法。A laser processing method characterized by cooling a processing portion of a workpiece that is scheduled to be processed in advance, and then processing this processing portion with a laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1297597A JPH03161187A (en) | 1989-11-17 | 1989-11-17 | Laser beam machining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1297597A JPH03161187A (en) | 1989-11-17 | 1989-11-17 | Laser beam machining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03161187A true JPH03161187A (en) | 1991-07-11 |
Family
ID=17848621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1297597A Pending JPH03161187A (en) | 1989-11-17 | 1989-11-17 | Laser beam machining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03161187A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5968382A (en) * | 1995-07-14 | 1999-10-19 | Hitachi, Ltd. | Laser cleavage cutting method and system |
| US7055072B2 (en) | 2000-11-16 | 2006-05-30 | Niigata Seimitsu Co., Ltd. | Memory system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4856991A (en) * | 1971-11-24 | 1973-08-10 | ||
| JPS6383221A (en) * | 1986-09-29 | 1988-04-13 | Toshiba Corp | Cutting method by laser light |
| JPS63174793A (en) * | 1987-01-14 | 1988-07-19 | Daihen Corp | Method for cutting alloy steel by laser beam |
-
1989
- 1989-11-17 JP JP1297597A patent/JPH03161187A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4856991A (en) * | 1971-11-24 | 1973-08-10 | ||
| JPS6383221A (en) * | 1986-09-29 | 1988-04-13 | Toshiba Corp | Cutting method by laser light |
| JPS63174793A (en) * | 1987-01-14 | 1988-07-19 | Daihen Corp | Method for cutting alloy steel by laser beam |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5968382A (en) * | 1995-07-14 | 1999-10-19 | Hitachi, Ltd. | Laser cleavage cutting method and system |
| US7055072B2 (en) | 2000-11-16 | 2006-05-30 | Niigata Seimitsu Co., Ltd. | Memory system |
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