JPH03160710A - Manufacture of lc composite component - Google Patents

Abstract

PURPOSE:To eliminate complicated works and reduce the number of manufacturing processes; besides, obtain LC composite components at a low cost by performing multiple treatment just before a final process is over in a state that a substrate is equipped with a plurality of coils and capacitors. CONSTITUTION:LC composite components are treated with multiple treatment just before a final process is over in a state that a substrate 1 is equipped with a plurality of coils and capacitors 5-7. In this way, complicated works are eliminated and the number of manufacturing processes is reduced. As the capacitors 5-7 that are composed of basic materials of ceramics 4a-4c are burnt in advance and handled as burnt substrates, handling processes increase in number with the completion of burning and then, the LC composite components are manufactured easily. Besides, the burnt substrates are superior in mechanical strength and any damage, e. g. chips and flaws in the LC composite components are hard to occur on the occasion of handling during the manufacturing process.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a chip-type LC composite component used, for example, in a noise filter. There are two methods for producing this type of chip-type LC composite component: a sheet stacking method and an LC bonding method. In the sheet stacking method, a capacitor part made of a dielectric matrix and a coil part made of a magnetic matrix are laminated in an unfired substrate state, and then divided into the desired finished product shape. After integrally sintering, external electrodes are added and manufactured. However, since the sintering shrinkage rates of each base material are significantly different, when the capacitor part and the coil part are joined by integral sintering, peeling may occur between the capacitor part and the coil part, or warping or warping may occur in the capacitor part and the coil part. I was worried that it would crack. Therefore, complex manufacturing management was required.

In the LC bonding method, the capacitor part and the coil part are sintered separately in advance, then joined by brazing or soldering, and then molded. This method requires more manufacturing steps than the sheet stacking method, which increases costs. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for easily manufacturing LC composite parts that requires fewer manufacturing steps and is inexpensive. Means for Solving the Problems In order to solve the above problems, the method for manufacturing an LC composite component according to the present invention includes: (a) laminating ceramic layers and capacitor electrode layers alternately to form a plurality of capacitors; (b) firing the board; (c) forming a plurality of coiled spiral patterns on the surface of the fired board to provide the coil part; (d) cutting the substrate in which the capacitor part and the coil part have a laminated structure into desired LC composite parts; (e) cutting the capacitor electrode layer and coil spiral of the LC composite part; It is characterized by comprising the steps of: connecting the patterns by electrical connection means; Function: With the above configuration, the LC composite component is multi-processed in the form of a board with a plurality of coils and capacitors up to just before the final process, so complicated operations are eliminated and the number of manufacturing steps is reduced.

Furthermore, since the capacitor section made of the ceramic matrix is fired in advance and handled as a fired substrate, the number of small handling steps after firing is increased, making it easier to manufacture LC composite parts. Moreover, the fired substrate has high mechanical strength, and the LC composite component is less likely to be chipped or scratched when handled during the manufacturing process.

Furthermore, since the coil part is formed on the surface of the capacitor part that has already been fired, if a photo-etching method is used to form the coil, the coil can be formed without being exposed to high temperatures, and there will be no peeling between the capacitor part and the coil part. occurs, or
The coil part and the capacitor part are joined without warping or cracking in the capacitor part and the coil part.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a method for manufacturing an LC composite component according to the present invention will be described with reference to the accompanying drawings.

[First Example, FIGS. 1 to 10] The first example shows the case of a π-type noise filter having one spiral coil and two laminated capacitors. A substrate 1 shown in FIG. 1 is provided with multilayer capacitors for six π-type noise filters. A capacitor section 2.3 is superimposed on the substrate 1, and an insulating sheet 1 5a. 15b is the capacitor part 2
One layer is stacked on the upper side and one layer is stacked on the lower side of the capacitor section 3.

The capacitor sections 2.3 each consist of six laminated capacitors, and include ceramic sheets 4a. 4b. 4c and capacitor electrodes 5 formed on their upper surfaces, respectively.
It consists of 6.7. Ceramic sheet 4a.
4b and 4c are sheets made by kneading dielectric powder such as BaTiO with a resin binder. The capacitor electrodes 5, 6, and 7 are formed using Ag-Pd conductive paste or the like by a method such as printing. The capacitor electrode 6 becomes a common electrode, and in the stacked state, a capacitance C1 is formed between the capacitor electrodes 5 and 6, and a capacitance O is formed between the capacitor electrodes 6 and 7. As shown in FIG. 2, the above capacitor section 2.3 is connected to the insulating sheet 15a. After being laminated together with 15b, it is fired at a predetermined temperature. At this time, marks 8 are formed on the upper surface of the insulating sheet 15a for positioning the coil spiral pattern to be formed in a later process.

Next, as shown in FIG. 3, six coil spiral patterns 16a are formed on the upper surface of the substrate 1 using the marks 8 formed on the fired substrate 1.

In this embodiment, a photo-etching method was employed to form the coil spiral pattern 16a. First, τi. Ti-Ag. Sputtering is performed in the order of Ag to form a three-layer conductor film. At this time, the surface of the substrate 1 may be coated with a low dielectric constant resin, such as a polyimide resin, before the conductor film is formed. Thereby, stray capacitance generated between the spiral pattern 16a and the capacitor electrode 5 can be suppressed, and the surface smoothness of the substrate 1 can be improved. Now, a photosensitive resist film is applied to the surface of this three-layer conductor film, and through the steps of exposure, development, etching, and resist film removal, a spiral pattern 16a, a rectangular connection electrode 17a, and a rectangular connection electrode 17a are formed as shown in FIG. Extraction electrode 18
form a. Here, both ends of the spiral pattern 16a are connected to a connection electrode 17a and an extraction electrode 18a, respectively. Substrate 1 on which this spiral pattern 16a etc. are formed
Coat the entire top surface with photosensitive polyimide resin for insulation. Thereafter, through the steps of exposure, development, and etching, as shown in FIG. 4, the connection electrode 17a and the lead-out electrode I!
A polyimide resin film 20 is formed to cover the entire upper surface of the substrate 1, leaving a portion i18a.

Further, a coil spiral pattern 16b, a connection electrode 17b, and an extraction electrode 18b shown in FIG. 5 are formed thereon through the same steps as those for forming the spiral pattern 16a and the like. The spiral pattern 16b is connected to the connection electrodes 17b, 17
is connected to the spiral pattern 16a through a, forming an inductance L1. Furthermore, through a process similar to that in which the photosensitive polyimide resin film 20 was formed on this,
Extracting electrode 18a shown in FIG. A polyimide resin film 21 for insulation is formed leaving 18b. Then the 6th
The substrate 1 is divided into six parts by slicing, laser cutting, hydraulic cutting, etc. along the dashed line shown in the figure to obtain the monolayer structure 24 of the desired LC composite component (seventh
(see figure). The one-layer structure 24 shown in FIG. 7 is cut out from position X on the left side of the substrate 1 in FIG. 6. Next, the laminated structure 24 is coated with external electrodes (A) by printing, transfer, vapor deposition, plating, etc. on its surface. (B). (C) is formed to obtain the π-type noise filter 25 shown in FIG. External electrode (A). (B) shows coil spiral pattern 1.
6a. 16b drawer section 18g. 18b is connected,
An inductance L1 is formed between the external electrodes (A) and (B). Furthermore, since the capacitor electrode 5 is connected to the external electrode (A), the capacitor electrode 7 is connected to the external electrode (B), and the capacitor electrode 6 is connected to the external electrode (C), the electrical equivalent shown in FIG. A π-type noise filter 25 having the circuit is obtained. Note that, depending on the value of the required inductance L1, the line pattern 19 shown in FIG. 10 may be formed instead of the spiral pattern 16b shown in FIG. 5. Further, in order to further increase the value of the inductance L1 between the external electrodes (A) and (B) or the current capacity, a coil spiral pattern may be formed on the lower surface of the substrate 1 as well. Further, the coil spiral pattern may be stacked in multiple stages. Similarly, capacitance C1
．． Ceramic sheet 4a to increase the value of C2
and 4b, or between ceramic sheet 4b and 4
A ceramic sheet having a capacitor electrode formed thereon may be further inserted between the capacitor electrode and the capacitor electrode.

[Second Embodiment, FIGS. 11 to 17] The second embodiment shows the case of an L-shaped noise filter having one spiral coil and one multilayer capacitor. For convenience of explanation, only one noise filter is shown here, but in mass production, the board will be equipped with multiple noise filters. In the substrate 30 shown in FIG. 11, insulating sheets 15c and 15d are laminated on the upper and lower sides of a capacitor section 31. The capacitor section 31 is made of ceramic sheet 4d.
4e and capacitor electrodes 32a. 32b. In the stacked state, a capacitance C1 is formed between the capacitor electrodes 32a and 32b. As shown in FIG. 12, the capacitor section 31 is formed by an insulating sheet 15c. After being laminated together with 15d, it is fired at a predetermined temperature. Next, as shown in FIG. 13, a coil spiral pattern 16C, a connection electrode 17c, and an extraction electrode 18c are formed on the upper surface of the fired substrate 30. Furthermore, a photosensitive polyimide resin film 33 for insulation is formed on this, leaving the connection electrode 17c and the extraction electrode 18c (see FIG. 14). Furthermore, a coil spiral pattern 16d, a connection electrode 17d, and an extraction electrode 18d shown in FIG. 15 are formed on this. The spiral pattern 16d is connected to the connecting electrode 17d. 17
c to the spiral pattern 16c, forming an inductance L1. Furthermore, a photosensitive polyimide resin film 34 for insulation is formed on this. Next, external electrodes (A), (B) . (C) is formed to obtain the L-shaped noise filter 35 shown in FIG. A capacitor electrode 32b is connected to the external electrode (B), a capacitor electrode 32a is connected to the external electrode (C), and a capacitance c1 is formed between the external electrodes (B) and (C). Furthermore, the external electrode (A) has a spiral pattern 16c.
The extraction electrode 18c of the spiral pattern 16d is connected to the external electrode (B), and an inductance L1 is formed between the external electrodes (A) and (B). Therefore, an L-shaped noise filter 35 having the electrical equivalent circuit shown in FIG. 17 is obtained.

[Other Embodiments] The LC composite component according to the present invention is not limited to the embodiments described above, and can be modified in various ways within the scope of the gist.

In the embodiment, a method was adopted in which sheets were stacked to stack the capacitor portion, but the ceramic material and the capacitor electrode material may be alternately printed and stacked. Similarly, in the embodiment, a photo-etching method was used to form the coil portion, but the coil portion may be formed by a sheet stacking method or a printing method.

Further, in the embodiment, the capacitor electrode layer of the LC composite component and the coil spiral pattern are electrically connected via the external electrode, but the connection may be made via a through hole.

As is clear from the above explanation, according to the present invention, the LC composite component is multi-processed in the state of a board equipped with a plurality of coils and capacitors until just before the final process. LC reduces the number of manufacturing steps and is cheaper compared to the sheet stacking method or LC bonding method.
A method for manufacturing composite parts is obtained.

Furthermore, since the capacitor section made of the ceramic matrix is fired in advance and handled as a fired substrate, the number of handling steps after firing is increased, and the manufacturing work of the LC composite component is facilitated. Moreover, the fired substrate has strong mechanical strength,
When handled during the manufacturing process, LC composite parts are less prone to chips and scratches, and the incidence of appearance defects is reduced compared to manufacturing methods using sheet stacking, which requires many handling steps before firing, resulting in an excellent yield of LC. A method for manufacturing composite parts is obtained.

Furthermore, since the coil part is formed on the surface of the capacitor part which has already been fired, if a photo-etching method is used to form the coil, the coil can be formed with high precision and a narrow deviation can be obtained, and it can be exposed to high temperatures. Compared to the sheet stacking method, this method prevents peeling between the capacitor and fill parts, as well as cracks and cracks in the capacitor and coil parts, increasing adhesive strength. can be achieved.

[Brief explanation of the drawing]

1 to 10 show an LC according to a first embodiment of the present invention.
Fig. 1 is an exploded perspective view of the board, Fig. 2 is a perspective view showing its external appearance, Fig. 3, Fig. 4, Fig. 5, Fig. 6 shows the composite part.
7 is a perspective view showing the appearance of the LC composite part after being cut from the substrate; FIG. 8 is a perspective view showing the appearance of the LC composite part after completion; 9
FIG. 10 is a perspective view showing a modified example of the coil spiral pattern of the first embodiment. FIG. 11 to FIG. 17 show a second embodiment of the present invention.
C shows a composite part, and FIG. 11 is an exploded perspective view of the board.
Figure 2 is a perspective view showing its appearance, Figures 13, 14, and 15 are perspective views showing the coil part forming process, Figure 16 is a perspective view showing the appearance of the LC composite part after completion, and Figure 17 The figure is its electrical equivalent circuit diagram. DESCRIPTION OF SYMBOLS 1... Board, 2.3... Capacitor part, 4a.
4b, 4c. 4d, 4e... Ceramic layer (ceramic sheet), 5.6.7-...-1 capacitor electrode, 16a. 16b, 16c. 16d - spiral pattern for coil, 25... LC composite component (π-type noise filter), 30... substrate, 32a, 32b... capacitor electrode, 35... LC composite component (L-type noise filter).

Claims (1)

[Claims] 1. forming a substrate consisting of a capacitor section including a plurality of capacitors by alternately laminating ceramic layers and capacitor electrode layers; firing the substrate; and depositing a plurality of capacitors on the surface of the fired substrate. a step of forming a spiral pattern for a coil to provide a coil portion; a step of cutting a substrate in which the capacitor portion and the coil portion have a laminated structure into desired LC composite parts; A method for manufacturing an LC composite component, comprising the steps of: connecting a capacitor electrode layer and a spiral pattern for a coil by an electrical connection means.