JPH031596A - Thick film multilayer circuit board - Google Patents

Abstract

PURPOSE:To check circuit characteristic of a product without wastefully using the product by forming a circuit check pattern capable of measuring an insulation resistance value between inner layer conductors, an insulation resistance value between outer layer conductors, an insulation resistance value between the inner and outer layer conductors, and the resistance value of a resistor. CONSTITUTION:A circuit check pattern formed of an inner layer conductor check pattern 1, an insulating layer check pattern 2, an outer layer conductor check pattern 3, a resistor check pattern 4, and an overcoating material check pattern 5 formed simultaneously with the same material as that used to form a circuit and made of a pattern capable of measuring an insulation resistance value between inner layer conductors, an insulation resistance value between outer layer conductors, an insulation resistance value between the inner and outer layer conductors, and a resistance value of a resistor is formed on a peripheral margin 6 of an alumina board. Since the forming position of the check pattern is on the margin 6 of the board, it does not affect any influence of forming a circuit and a product, but it can be executed only alteration of the pattern of a printing screen.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is a thick film multilayer circuit board that can be used for mounting electronic components.

2. Description of the Related Art In general, circuit characteristics of thick film multilayer circuit boards are checked by sampling inspection of completed products.

However, since the problem that the invention seeks to solve is the inspection of finished products, everything used for inspection is wasted, resulting in a large loss.

The present invention solves the above-mentioned conventional problems, and makes it possible to check the circuit characteristics of a product without wasting it.

Means for Solving the Problems The thick film multilayer circuit board of the present invention can be used for mounting electronic components, and the peripheral margin of the alumina board is made of the same material used for circuit formation. It consists of check patterns for each of the formed inner layer conductor, insulating layer, resistor, outer layer conductor, and overcoat material, and the insulation resistance value between the inner layer conductor, the insulation resistance value between the outer layer conductor, and the insulation resistance between the inner layer conductor and the outer layer conductor. It has a circuit check pattern consisting of a pattern that can measure the resistance value of a resistor.

Function: The thick film multilayer circuit board of the present invention is designed to check the inner layer conductor, insulating layer, resistor, outer layer conductor, and overcoat material that are simultaneously formed with the same material used for circuit formation on the peripheral margin of the alumina substrate. A circuit check pattern consisting of a pattern that can measure the insulation resistance value between the inner layer conductors, the insulation resistance value between the outer layer conductors, the insulation resistance value between the inner layer conductor and the outer layer conductor, and the resistance value of the resistor. It is.

In addition, since the circuit check pattern is formed in the peripheral margin of the alumina substrate, it does not affect the circuit formation or the product in any way (it can be implemented by simply changing the pattern of the printing screen).

EXAMPLE Hereinafter, a thick film multilayer circuit board according to an example of the present invention will be described with reference to the drawings.

As shown in FIG. 1, an inner layer conductor check pattern 1, an insulating layer check pattern 2, and an insulating layer check pattern 2, which are simultaneously formed with the same material as that used for circuit formation, are formed on the peripheral margin 6 of the alumina substrate, as shown in FIG.
It consists of an outer layer conductor check pattern 3, a resistor check pattern 4, an overcoat material check pattern 5, and an insulation resistance value between the inner layer conductors, an insulation resistance value between the outer layer conductors,
A circuit check pattern consisting of a pattern capable of measuring the insulation resistance value between the inner layer conductor and the outer layer conductor and the resistance value of the resistor is formed.

Furthermore, in this example, since the circuit check pattern is formed in the peripheral margin 6 of the alumina substrate, there is no effect on the circuit formation or its product, and it can be implemented by simply changing the pattern of the printing screen. It is advantageous.

Effects of the Invention As described above, the thick film multilayer circuit board of the present invention has an inner layer conductor check pattern, an insulating layer check pattern, and an outer layer conductor formed simultaneously on the peripheral margin of the alumina substrate using the same material as that used for forming the circuit. It consists of a check pattern, a resistor check pattern, and an overcoat material check pattern, and also measures the insulation resistance between the inner layer conductors, the insulation resistance between the outer layer conductors, the insulation resistance between the inner and outer conductors, and the resistance of the resistor. A circuit check pattern consisting of a measurable pattern is formed, and in this way, the circuit characteristics of the product can be checked without wasting the product, which is very useful for cost reduction.In particular, the present invention According to , since the peripheral margin of the alumina substrate is simultaneously formed with the same material used for circuit formation, there is no effect on circuit formation or the product, and the only change is to change the pattern of the printing screen. This is very advantageous in practice.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a thick film multilayer circuit board according to an embodiment of the present invention, FIG. 2a is a sectional view taken along line A-8, and FIG.
-D is a sectional view. ■・・・Inner layer conductor check pattern, 2...
... Insulating layer check pattern, 3 ... Outer layer conductor check pattern, 4 ... Resistor check pattern, 5 ... Overcoat material check pattern, 6 ... - Margin area around the alumina substrate. Name of agent: Patent attorney Shigetaka Awano (1 person) Funeral diagram hanging diagram C (1)

Claims (1)

[Claims] A thick film multilayer circuit is formed on an alumina substrate, and an inner layer conductor check pattern of the same material is formed at the same time as the inner layer conductor, and an insulating layer is formed at the same time on the peripheral margin of the alumina substrate. An insulating layer check pattern made of the same material as the resistor, a resistor check pattern made of the same material formed at the same time as the resistor, an outer layer conductor check pattern made of the same material formed simultaneously with the outer layer conductor, and an overcoat material formed simultaneously. A pattern consisting of an overcoat material check pattern made of the same material and capable of measuring the insulation resistance value between the inner layer conductors, the insulation resistance value between the outer layer conductors, the insulation resistance value between the inner layer conductor and the outer layer conductor, and the resistance value of the resistor. A thick film multilayer circuit board characterized by having a circuit check pattern consisting of the following.