JPH031595A - Multilayer board containing thick film resistor - Google Patents
Multilayer board containing thick film resistorInfo
- Publication number
- JPH031595A JPH031595A JP13497989A JP13497989A JPH031595A JP H031595 A JPH031595 A JP H031595A JP 13497989 A JP13497989 A JP 13497989A JP 13497989 A JP13497989 A JP 13497989A JP H031595 A JPH031595 A JP H031595A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- cermet
- resistor
- dielectric
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011195 cermet Substances 0.000 claims abstract description 35
- 229920000642 polymer Polymers 0.000 claims abstract description 23
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 abstract description 13
- 239000000463 material Substances 0.000 abstract description 7
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品実装用として用いることができる厚膜
抵抗体内蔵多層基板である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is a multilayer substrate with a built-in thick film resistor that can be used for mounting electronic components.
従来の技術
従来のサーメット厚膜材料のみによる多層基板では、第
２図に示す様に、抵抗体は最外層導体と接続され且つ最
外層誘電体上に形成されていた。2. Description of the Related Art In a conventional multilayer board made only of cermet thick film material, the resistor is connected to the outermost conductor and formed on the outermost dielectric layer, as shown in FIG.
発明が解決しようとする課題
ところが、この様な多層基板では、搭載できる厚膜抵抗
体の数に制限があり、その結果、基板の実装密度を高め
ることができないという課題があった。Problems to be Solved by the Invention However, in such a multilayer board, there is a limit to the number of thick film resistors that can be mounted, and as a result, there is a problem that the mounting density of the board cannot be increased.
本発明はこの様な従来の課題を改善するものであり、多
層基板に搭載する厚膜抵抗体の数を増やすことができ、
基板の実装密度を高めることができるものである。The present invention improves these conventional problems, and makes it possible to increase the number of thick film resistors mounted on a multilayer board.
This allows the mounting density of the board to be increased.
課題を解決するための手段
本発明の多層基板は、電子部品実装用として用いること
ができる厚膜抵抗体内蔵多層基板であって、アルミナ基
板上もしくはサーメット厚膜誘電体上に形成したサーメ
ット厚膜抵抗体上に、ポリマー厚膜誘電体を形成した後
にポリマー厚膜抵抗体を形成したものである。Means for Solving the Problems The multilayer board of the present invention is a multilayer board with a built-in thick film resistor that can be used for mounting electronic components, and includes a cermet thick film formed on an alumina substrate or a cermet thick film dielectric. A polymer thick film resistor is formed after a polymer thick film dielectric is formed on a resistor.
作用
本発明の多層基板はアルミナ基板上もしくはサーメット
厚膜誘電体上に形成したサーメット厚膜抵抗体上に、ポ
リマー厚膜誘電体を形成した後にポリマー厚膜抵抗体を
形成することによって、基板の実装密度を高めることが
できる多層基板である。Function: The multilayer substrate of the present invention is formed by forming a polymer thick film dielectric on a cermet thick film resistor formed on an alumina substrate or a cermet thick film dielectric, and then forming a polymer thick film resistor. This is a multilayer board that can increase packaging density.
またここで使用するポリマー厚膜誘電体は、サーメット
厚膜抵抗体及びサーメット厚膜外層導体のオーバーコー
ト材として用いることができる為に、別箇にサーメット
厚膜抵抗体及びサーメット厚膜外層導体のオーバーコー
ト材を形成する工程を設ける必要がない。In addition, the polymer thick film dielectric used here can be used as an overcoat material for cermet thick film resistors and cermet thick film outer layer conductors, so it is separately used for cermet thick film resistors and cermet thick film outer layer conductors. There is no need to provide a step of forming an overcoat material.
実施例 以下本発明の一実施例を図面を参照しながら説明する。Example An embodiment of the present invention will be described below with reference to the drawings.
第１図に示す様に、アルミナ基板１上もしくはサーメッ
ト厚膜誘電体２上に形成したサーメット厚膜抵抗体５上
に、ポリマー厚膜誘電体６を形成した後にポリマー厚膜
抵抗体８を形成する。本実施例では、ポリマー厚膜誘電
体６をサーメット厚膜抵抗体５及びサーメット厚膜外層
導体４のオーバーコートとして用いている。この様にす
れば、多層基板に搭載する厚膜抵抗体の数を増やすこと
ができ、基板の実装密度を高めることができる。As shown in FIG. 1, a polymer thick film dielectric 6 is formed on a cermet thick film resistor 5 formed on an alumina substrate 1 or a cermet thick film dielectric 2, and then a polymer thick film resistor 8 is formed. do. In this embodiment, a polymer thick film dielectric 6 is used as an overcoat for the cermet thick film resistor 5 and the cermet thick film outer layer conductor 4. In this way, the number of thick film resistors mounted on the multilayer board can be increased, and the mounting density of the board can be increased.
また本実施例の様に、サーメット厚膜抵抗体５及びサー
メット厚膜外層導体４のオーバーコートとしてポリマー
厚膜誘電体６をそのまま用いれば、別箇にサーメット厚
膜抵抗体５及びサーメット厚膜外層導体４のオーバーコ
ート材（第２図、１０）を形成する工程を設ける必要が
なく有利である。Furthermore, as in this embodiment, if the polymer thick film dielectric 6 is used as it is as an overcoat for the cermet thick film resistor 5 and the cermet thick film outer layer conductor 4, the cermet thick film resistor 5 and the cermet thick film outer layer can be separately coated. Advantageously, there is no need to provide a step for forming an overcoat material (FIG. 2, 10) for the conductor 4.
発明の効果
以上の様に本発明は、アルミナ基板上もしくはサーメッ
ト厚膜誘電体上に形成したサーメット厚膜抵抗体上に、
ポリマー厚膜誘電体を形成した後にポリマー、ｇＭ抵抗
体を形成したものであり、従って、多層基板に搭載する
厚膜抵抗体の数を増やすことができ、基板の実装密度を
高めることができ、最終的には商品の小型化に大いに役
立つものである。Effects of the Invention As described above, the present invention provides a cermet thick film resistor formed on an alumina substrate or a cermet thick film dielectric.
After forming a polymer thick film dielectric, a polymer gM resistor is formed. Therefore, the number of thick film resistors mounted on a multilayer board can be increased, and the mounting density of the board can be increased. Ultimately, this will be of great help in downsizing products.
特に本発明によれば、ポリマー厚膜誘電体をそのままサ
ーメット厚膜抵抗体及びサーメット厚膜外層導体のオー
バーコートとして用いている為に、別箇にサーメット厚
膜抵抗体及びサーメット厚膜外層導体のオーバーコート
材を形成する工程を設ける必要がなく、実用上非常に有
利なものである。In particular, according to the present invention, since the polymer thick film dielectric is directly used as an overcoat for the cermet thick film resistor and the cermet thick film outer layer conductor, the cermet thick film resistor and the cermet thick film outer layer conductor are separately coated. There is no need to provide a process for forming an overcoat material, which is very advantageous in practice.
第１図は本発明の一実施例における多層基板の断面図、
第２図は従来の多層基板の断面図である。
１・・・・・・アルミナ基板、２・・・・・・サーメッ
ト厚膜誘電体、３・・・・・・サーメット厚膜内層導体
、４・・・・・・サーメット厚膜外層導体、５・・・・
・・サーメット厚膜抵抗体、６・・・・・・ポリマー厚
膜誘電体、７・・・・・・ポリマー厚膜導体、８・・・
・・・ポリマー厚膜抵抗体、９，１０・・・・・・オー
バーコート材。
代理人の氏名 弁理士 粟野重孝 ほか１名第１図
／−アｉ／ξｆＸ敷FIG. 1 is a cross-sectional view of a multilayer board in one embodiment of the present invention;
FIG. 2 is a cross-sectional view of a conventional multilayer board. DESCRIPTION OF SYMBOLS 1... Alumina substrate, 2... Cermet thick film dielectric, 3... Cermet thick film inner layer conductor, 4... Cermet thick film outer layer conductor, 5・・・・・・
... Cermet thick film resistor, 6 ... Polymer thick film dielectric, 7 ... Polymer thick film conductor, 8 ...
...Polymer thick film resistor, 9,10...Overcoat material. Name of agent: Patent attorney Shigetaka Awano and one other person Figure 1/-i/ξfX
Claims (1)
成されたサーメット厚膜抵抗体と、該サーメット厚膜抵
抗体上に形成されたポリマー厚膜誘電体と、該ポリマー
厚膜誘電体上に形成されたポリマー厚膜抵抗体からなる
厚膜抵抗体内蔵多層基板。A cermet thick film resistor formed on an alumina substrate or a cermet thick film dielectric, a polymer thick film dielectric formed on the cermet thick film resistor, and a polymer thick film dielectric formed on the polymer thick film dielectric. Multilayer board with built-in thick film resistor made of polymer thick film resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13497989A JPH031595A (en) | 1989-05-29 | 1989-05-29 | Multilayer board containing thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13497989A JPH031595A (en) | 1989-05-29 | 1989-05-29 | Multilayer board containing thick film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031595A true JPH031595A (en) | 1991-01-08 |
Family
ID=15141082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13497989A Pending JPH031595A (en) | 1989-05-29 | 1989-05-29 | Multilayer board containing thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031595A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1250031A3 (en) * | 2001-04-11 | 2005-06-15 | Ngk Insulators, Ltd. | Wiring board and method of manufacturing same |
-
1989
- 1989-05-29 JP JP13497989A patent/JPH031595A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1250031A3 (en) * | 2001-04-11 | 2005-06-15 | Ngk Insulators, Ltd. | Wiring board and method of manufacturing same |
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