JPH03159189A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JPH03159189A JPH03159189A JP29860989A JP29860989A JPH03159189A JP H03159189 A JPH03159189 A JP H03159189A JP 29860989 A JP29860989 A JP 29860989A JP 29860989 A JP29860989 A JP 29860989A JP H03159189 A JPH03159189 A JP H03159189A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- connector
- fpc
- copper foil
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 38
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 238000003780 insertion Methods 0.000 abstract description 16
- 230000037431 insertion Effects 0.000 abstract description 16
- 229920001169 thermoplastic Polymers 0.000 abstract description 6
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 6
- 239000004642 Polyimide Substances 0.000 abstract description 4
- 229920001721 polyimide Polymers 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 229920000728 polyester Polymers 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はコネクタへの挿入部を有するフレキシブルプ
リント基板（Ｆｌｅｘｊｂｌｅ Ｐｒ＋ｎｔｅｄ Ｃ１
ｒｃｕｉｔ：以下ＦＰＣと称す〕に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a flexible printed circuit board (Flexible Pr+nted C1) having an insertion portion into a connector.
rcuit (hereinafter referred to as FPC)].
第３図は１例えばソニー・ケミカル株式会社発行のフレ
キシブルプリント回路材料１ソニーフレツクス”の設計
ガイドブック（カタログ査号Ｃ−０３０１５（８０６０
３０ｊ））にｆｆ１４ｇされた従来のＦＰＣのコネクタ
挿入部の構成を示す断面図であシ、第３図ＩＡＩはその
縦断面図、第３図（Ｂ）はその横断面図である。第３図
において、（１）は農打ち材、（２）は農打ち材貼シ合
わせ材、（３１はベース材、（４）は接着剤。Figure 3 shows 1, for example, the flexible printed circuit material 1 "Sony Flex" design guidebook (catalog number C-03015 (8060) published by Sony Chemical Corporation).
30j)) is a cross-sectional view showing the configuration of a connector insertion portion of a conventional FPC with f14g, FIG. 3 IAI is a longitudinal cross-sectional view thereof, and FIG. 3(B) is a cross-sectional view thereof. In Fig. 3, (1) is an agricultural lumber, (2) is an agricultural lumber adhesive, (31 is a base material, and (4) is an adhesive.
＋５１は銅箔、（６）はカバー材。+51 is copper foil, (6) is cover material.
次に動作について説明する。第３図＋Ａｌ、 ＩＢＩに
示すようにＦＰＣはポリイミドやポリエステルフィルム
などで作らｎたベース材１３１上に、熱可塑性等の接層
剤【４１を塗布し、その上に銅箔（−膜面には電解銅、
圧延鋼）＋５１ｔ−接着させ、さらに熱可塑性等の接着
剤（４）が塗布された。カバー材１６１ｔ″回路面に熱
圧着により貼り合わせて得られる。Next, the operation will be explained. As shown in Figure 3 +Al, IBI, FPC is made by coating a thermoplastic adhesive [41] on a base material 131 made of polyimide or polyester film, etc. is electrolytic copper,
Rolled steel)+51t- was bonded, and an adhesive (4) such as thermoplastic was further applied. The cover material 161t'' is obtained by bonding it to the circuit surface by thermocompression bonding.
またＦＰＣのコネクタ挿入部は、熱可塑性寺の接着剤（
４）が塗布されたカバー材１６１がなく、そのかわシ、
コネクタと安定した償触ｔ−株つためにプラスチックの
裏打ち材ｉｌｌが接着剤や粘着剤などの晟打ち材貼り合
わせ材（２１によシ＃、看され補強されている。晟打ち
材＋１１は一般的にポリエステル、ポリイミド、ガラエ
ボ等の材質で厚さ１２５μｍ、１１１１３μｍのものが
用いられている。In addition, the connector insertion part of the FPC is made of thermoplastic adhesive (
4) There is no cover material 161 coated with it,
In order to ensure stable contact with the connector, the plastic backing material will be bonded with glue or adhesive (21), which is reinforced and reinforced. Generally, materials such as polyester, polyimide, and Garaebo with a thickness of 125 μm and 11113 μm are used.
なお、ＦＰＣについては、最近、熱可塑性等の接層剤（
４）を必要とせず、ベース材（３１やカバー材（６）に
直接銅箔を接合するＦＰＣも市販されている。Regarding FPC, recently, adhesive agents such as thermoplastics (
There are also commercially available FPCs in which copper foil is directly bonded to the base material (31 or cover material (6)) without requiring step 4).
従来のＦＰＣは以上のように構成されておシ、コネクタ
の挿入部に熱ＯＪφ性接Ｎ剤や畏打ち材貼９合わせ材、
又は農打ち材等のプラスチックが使用されているのでプ
ラスチック材の柔軟性から接触部が動きやすく、また高
温エージングによる劣化等によシコネクタの接触子との
安定した接触が十分得られず、接触子の形状によっては
、接触ぶ抗がかな９上昇するという問題点がめった。Conventional FPCs are constructed as described above, and the connector insertion part is coated with a thermal OJφ adhesive, a bonding material, and a bonding material.
Or, since plastic such as agricultural timber is used, the contact part tends to move due to the flexibility of the plastic material, and due to deterioration due to high temperature aging, etc., stable contact with the contact of the connector cannot be obtained, and the contact Depending on the shape, the contact resistance often increases by 9 points.
この発明は上記のような問題点を解消するためになされ
たもので、コネクタの接触子と安定したｆｔｃ后が得ら
れるコネクタ挿入部上ＭするＦＰＣを得ることを目的と
している。、
〔課題を解決するための手段〕
この発明に係るＦＰＣは、コネクタへの挿入部の農打ち
材を金属板により形成し丸ものである。The present invention has been made to solve the above-mentioned problems, and aims to provide an FPC that fits over the connector insertion part and provides stable ftc with the contacts of the connector. , [Means for Solving the Problems] The FPC according to the present invention is a round FPC in which the part to be inserted into the connector is made of a metal plate.
この発明においては、ＦＰＣのコネクタ挿入部の表打ち
材を金属板にしたので、コネクタの接触子と安定した接
触が可能となる。In this invention, since the facing material of the connector insertion portion of the FPC is made of a metal plate, stable contact with the contacts of the connector is possible.
〔発明の実施例］
以下、この発明の一実施例を図について説明する。第１
図はこの発明の一実２Ｐ！ｉ例によるＦＰＣのコネクタ
挿入部の構成を示す断面図でらシ、第１図囚はコネクタ
挿入部の縦Ｍ面図１図田）はその横断面図である。第１
図において１３１〜（６）は上記従来のものと同様のも
のである。（７）はｍＭ板の表打ち材でアルミニウム、
鋼、ステンレス、Ｑん宵鋼。[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a fruit of this invention 2P! FIG. 1 is a cross-sectional view showing the configuration of the connector insertion portion of the FPC according to example i, and FIG. 1 is a longitudinal sectional view of the connector insertion portion. 1st
In the figure, 131 to (6) are the same as the conventional ones. (7) is the facing material of the mm board, which is made of aluminum.
Steel, stainless steel, Qnyo steel.
黄銅等の金属板である。特に、金属でも、ステンレス、
りんｆ、ｆｌ、ｌの工うなばｎ材でろると、コネクタの
接触子とより艮好な依后が得られる。また。It is a metal plate such as brass. Especially metal, stainless steel,
If the material is made of phosphorus f, fl, l, it will be possible to obtain a connector contact with a more beautiful shape. Also.
金属板の厚さについては１２５μｍや１８８μｍｙｚど
従来のグラスチック・改の厚さと同一でよく、これ以外
でも８０〜２５０μｍ８度のものであれはよい）。Regarding the thickness of the metal plate, it may be the same as the thickness of conventional glass sheets such as 125 μm or 188 μm, or it may be 80 to 250 μm (8 degrees).
（８１は良打ち材貼り合わせ材で、従来のプラスチック
の壺打ち材用の接層剤や積層剤ではなく、並属の鏡打ち
材（７）が接層できる用の接層剤や積層剤となる。(No. 81 is a laminated material for laminated wood. It is not a bonding agent or laminating agent for conventional plastic potting materials, but a bonding agent or laminating agent that can be used to bond similar mirror-laminated materials (7). becomes.
なお、金属板ｔ’ＩＩｋ打ち材にしたＦＰＣはあるが。In addition, there are FPCs made of metal plate t'IIk.
コネクタ挿入部の補強としてではなく９部品装着やシー
ルド効実用として用いられ、その厚さも０．５ｕ以上の
ものである。It is used not as a reinforcement for the connector insertion part, but as a shielding effect and for mounting 9 parts, and its thickness is 0.5u or more.
この実Ｓ例におけるＦＰＣは、第１図囚、（ＢＩＫ示す
ようにポリイミドやポリエステルフィルムなどで作られ
たベース材：３１上に、ｐｐＪ町塑性等の接着剤（４１
ｔ−塗布し、その上に銅箔【５１を接層させ、さらに熱
可塑性の接層剤１４＋が塗布されたカバー材（６）を回
路面〔銅箔〕に熱圧層により貼シ合ゎせて得られる。The FPC in this actual S example is shown in Figure 1 (as shown in BIK), on a base material made of polyimide or polyester film (31
t-coated, then a copper foil [51] is attached thereto, and a cover material (6) coated with a thermoplastic adhesive 14+ is laminated onto the circuit surface [copper foil] using a thermopressure layer. can be obtained by
また、ＦＰＣのコネクタ挿入部は、熱司盟性等の接着剤
＋４１が塗布されたカバー材（６）がカットされて−る
。そしてコネクタと安定した接触力を保つために金属板
の農打ち材（７１が長打ち材貼ジ合ゎせ材＋８１により
貼り合わされている。このようにすることによシ、従来
のプラスチック材に比べ、硬度が高く変形しにぐぐなる
と共に、高温エージングによる劣化がなくなって楼触部
が動きＫ＜＜な先安定した接触が得られるようになる。Further, a cover material (6) coated with a thermally conductive adhesive +41 is cut into the connector insertion portion of the FPC. In order to maintain stable contact force with the connector, the metal plates made of agricultural wood (71) are bonded together using a long wood bonding material +81. In comparison, the hardness is high and it does not deform easily, and there is no deterioration due to high-temperature aging, so that the contact part moves and stable contact can be obtained.
この発明の他の実施例ｔ−第２図に示す。ＦＰＣのコネ
クタ挿入部の先端部においては、銅箔（５）と金属板の
表打ち材が、接層剤＋４１とベース材１３１と農打ち材
貼シ合わせ材（２１のトータルの厚さ分の高さ１００μ
ｍａ度しか離れていないため、これらが短絡する場合が
考えられるため、第２図に示すように金属板の農打ち材
（７）をコネクタ挿入部の先？＆部より短くして接触し
ないようにしている。Another embodiment of the invention is shown in FIG. At the tip of the connector insertion part of the FPC, the copper foil (5) and the metal plate facing material are coated with adhesive +41, base material 131, and agricultural lumber lamination material (total thickness of 21). height 100μ
Since they are only 100 degrees apart, there is a possibility of a short circuit between them, so as shown in Figure 2, insert the metal plate (7) into the tip of the connector insertion part. It is made shorter than the & part so that it does not touch.
〔発明の効果］
以上のように、この発明によればＦＰＣコネクタ挿入部
の裂打ち材を金属板により形成したことによシ、コネク
タの接触子と安定した接触が得られる。[Effects of the Invention] As described above, according to the present invention, by forming the torn material of the FPC connector insertion portion from a metal plate, stable contact with the contacts of the connector can be obtained.
第１図囚、（Ｂ）はこの発明の一実施例によるＦＰＣの
コネクタ挿入部を示す断面図、第２図囚、（Ｂ）はこの
発明の他の実施列を示す断面図、第３図囚。
ＩＢ）は従来のＦＰＣのコネクタ挿入部を示す断面図で
ある。
図において、（３Ｉはベース材、Ｃ４２は接層剤、（５
）は銅箔、１６）はカバー材、（７１は裏打ち材、（８
１は表打ち材貼シ合わせ材である。
なお、各図中同一符号は同一または相当部分を示す。FIG. 1(B) is a cross-sectional view showing a connector insertion part of an FPC according to an embodiment of the present invention, FIG. 2(B) is a cross-sectional view showing another embodiment of the present invention, and FIG. Prisoner. IB) is a sectional view showing a connector insertion portion of a conventional FPC. In the figure, (3I is the base material, C42 is the adhesive, (5
) is copper foil, 16) is cover material, (71 is lining material, (8)
1 is a facing material laminating material. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
せ，さらに接着剤が塗布されたカバー材を上記銅箔に熱
圧着により貼り合わせて得られるフレキシブルプリント
基板において，コネクタに挿入する部分の裏打ち材とし
て金属板を用いたことを特徴とするフレキシブルプリン
ト基板。A flexible printed circuit board is obtained by applying an adhesive on a base material, adhering a copper foil on top of it, and then bonding a cover material coated with the adhesive to the copper foil using thermocompression bonding, and inserting it into a connector. A flexible printed circuit board characterized by using a metal plate as a backing material for the exposed portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29860989A JPH03159189A (en) | 1989-11-16 | 1989-11-16 | Flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29860989A JPH03159189A (en) | 1989-11-16 | 1989-11-16 | Flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03159189A true JPH03159189A (en) | 1991-07-09 |
Family
ID=17861943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29860989A Pending JPH03159189A (en) | 1989-11-16 | 1989-11-16 | Flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03159189A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003069164A (en) * | 2001-08-22 | 2003-03-07 | Nitto Denko Corp | Flexible wiring circuit board for flat panel display |
| JP2010010277A (en) * | 2008-06-25 | 2010-01-14 | Nippon Mektron Ltd | Flexible circuit board and method of manufacturing the same |
| JP2010287595A (en) * | 2009-06-09 | 2010-12-24 | Fujikura Ltd | Flexible printed board, and method of manufacturing the same |
| JP2011009272A (en) * | 2009-06-23 | 2011-01-13 | Fujikura Ltd | Printed circuit board |
-
1989
- 1989-11-16 JP JP29860989A patent/JPH03159189A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003069164A (en) * | 2001-08-22 | 2003-03-07 | Nitto Denko Corp | Flexible wiring circuit board for flat panel display |
| JP2010010277A (en) * | 2008-06-25 | 2010-01-14 | Nippon Mektron Ltd | Flexible circuit board and method of manufacturing the same |
| JP2010287595A (en) * | 2009-06-09 | 2010-12-24 | Fujikura Ltd | Flexible printed board, and method of manufacturing the same |
| US9247651B2 (en) | 2009-06-09 | 2016-01-26 | Fujikura Ltd. | Flexible printed circuit and method of manufacturing same |
| JP2011009272A (en) * | 2009-06-23 | 2011-01-13 | Fujikura Ltd | Printed circuit board |
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