JPH0315822B2 - - Google Patents

Info

Publication number
JPH0315822B2
JPH0315822B2 JP59109473A JP10947384A JPH0315822B2 JP H0315822 B2 JPH0315822 B2 JP H0315822B2 JP 59109473 A JP59109473 A JP 59109473A JP 10947384 A JP10947384 A JP 10947384A JP H0315822 B2 JPH0315822 B2 JP H0315822B2
Authority
JP
Japan
Prior art keywords
circuit board
groove
semiconductor chips
semiconductor chip
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59109473A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60254644A (ja
Inventor
Kishio Yokochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10947384A priority Critical patent/JPS60254644A/ja
Publication of JPS60254644A publication Critical patent/JPS60254644A/ja
Publication of JPH0315822B2 publication Critical patent/JPH0315822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP10947384A 1984-05-31 1984-05-31 沸騰冷却用回路基板の実装構造 Granted JPS60254644A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10947384A JPS60254644A (ja) 1984-05-31 1984-05-31 沸騰冷却用回路基板の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10947384A JPS60254644A (ja) 1984-05-31 1984-05-31 沸騰冷却用回路基板の実装構造

Publications (2)

Publication Number Publication Date
JPS60254644A JPS60254644A (ja) 1985-12-16
JPH0315822B2 true JPH0315822B2 (enrdf_load_html_response) 1991-03-04

Family

ID=14511123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10947384A Granted JPS60254644A (ja) 1984-05-31 1984-05-31 沸騰冷却用回路基板の実装構造

Country Status (1)

Country Link
JP (1) JPS60254644A (enrdf_load_html_response)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51141462U (enrdf_load_html_response) * 1975-05-07 1976-11-15
JPS52114271A (en) * 1976-03-22 1977-09-24 Hitachi Ltd Semiconductor pellet mounting structure for substrate
JPS5887836A (ja) * 1981-11-20 1983-05-25 Hitachi Ltd 基板およびそれを用いたペレツトボンデイング方法

Also Published As

Publication number Publication date
JPS60254644A (ja) 1985-12-16

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