JPH0315819B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Scope of Industrial Application] The present invention relates to a tape bonding device with an improved adjustment mechanism for a bonding tool.

[Conventional technology]

A tape bonding device, that is, an inner lead bonding device that connects a semiconductor device to a tape carrier in which semiconductor device connection leads are arranged at regular intervals by automatically detecting and correcting the positional relationship between the two, and the inner lead bonding device The thus constructed tape carrier is cut together with the semiconductor element at the lead portion around it, and the positional relationship between the two is automatically detected on the printed circuit board in the same way as the inner lead bonding device described above.
An outer lead bonding device that performs correction and connection (hereinafter, the inner lead bonding device and the outer lead bonding device are collectively referred to as a tape bonding device in this specification).
has been widely used in the past.

Conventional tape bonding equipment is equipped with a bonding head placed on an XY table, a bonding stage placed on an XY table and a θ table, and a bonding tool installed at the tip of the bonding head. The head could be adjusted only in the X and Y directions.

Regarding the bonding work, for example, in the case of outer lead bonding, in FIGS. 2 and 4, the semiconductor element 10, the lead holding plate 24, and the leads 25 are cut out from the tape carrier as one piece, and the leads 25 and the circuit pattern 2 are cut out from the tape carrier.
7 is detected, the semiconductor element 10 is displaced in the X, Y, and θ directions, and the lead 25 is aligned so that it overlaps the circuit pattern 27 printed on the printed circuit board 8. At least overlap.

Thereafter, the overlapping portion 28 is heated and pressed by the bonding tool 6 as shown in FIG. 3 to perform bonding.

At this time, if the position of the circuit pattern 27 on the printed circuit board 8 in the θ direction is correct, the semiconductor element 10
The θ direction is also correctly aligned accordingly, and the fourth
The X and Y axes of the semiconductor device 10 shown in the figure coincide in the correct direction.

Conventionally, the bonding tool 6 cannot be adjusted in the θ direction, but can be moved in the X and Y directions.
If the bonding tool 6 is in the correct direction, the bonding tool 6 can be heated and pressed at an accurate relative position as shown in FIG. 5 by simply moving in the X and Y directions, and presses the hatched portion of the overlapped portion 28.
In this case, the length B of the pressing portion is approximately the same for all leads 25, and uniform and good bonding can be obtained.

[Problem that the invention seeks to solve]

However, the circuit pattern 27 of the printed circuit board 8
is rotated and deviated from the reference position in the θ direction, the directions of the semiconductor element 10 and the leads 25 are also deviated accordingly, and as shown in FIG. 6, the _X1 axis and _Y1 axis of the semiconductor element 10 are It deviates by θ with respect to the reference X-axis and Y-axis. Since the conventional bonding tool 6 cannot be adjusted in the θ direction, if bonding is performed as is, the bonding tool 6 will be
Since it is held in the Y direction, there is a deviation of θ from the lead 25 and the circuit pattern 27 in the X ₁ and Y ₁ directions, and the length of the pressing part in the overlapping part 28 is as shown by the hatching, B ₁ and B It becomes uneven as shown in ₂ ,
There was a problem in that poor bonding occurred in the short pressed portion.

The present invention solves the above-mentioned problems of the conventional tape bonding apparatus, and provides a tape bonding apparatus that can correct the position of a bonding tool in XYθ for each semiconductor element and in succession to match the position of the semiconductor element. The purpose is to

[Means for solving problems]

As a means for solving the above problems, the present invention provides a tape bonding apparatus in which a bonding head placed on an XY table and a bonding stage placed on an XY table and a θ table are provided on a frame. It is an object of the present invention to provide a tape bonding apparatus in which the bonding head is provided with a bonding tool installed in a θ rotation mechanism.

〔Example〕

Embodiments of the outer lead bonder of the present invention shown in the drawings will be described below.

FIG. 1 is a side view of the device. On the frame 1, there is a bonding head 2 placed on an XY table 3, an XY table 14, and a θ table 1.
5 and a bonding stage 13 placed on a Z table 16 are provided.

The bonding head 2 includes a Z-direction moving mechanism 4.
A bonding tool 6 that presses and heats the leads 25 to fuse them is installed in the θ rotation mechanism 5 installed in the θ rotation mechanism 5. The bonding tool 6 presses and heats the leads 25 to fuse them. A camera 7 is provided to detect displacement of the substrate 8.

Bonding stage 13 is XY table 1
4. It consists of a θ table 15 that performs a rotation operation, a Z table 16 that performs an elevating operation, and a suction table 17 for the semiconductor device 10 having an opening for vacuum suction on its upper surface.

The positional deviation signal obtained by the detection of the camera 7 is input to the camera control unit CCU 18 to display an image on the monitor 19, and then to the pattern recognition device PRU 20, enters the interface control system 21, and passes through the stage driver 22.
Signals are transmitted to the XY table 3, Z direction movement mechanism 4, θ rotation mechanism 5, XY table 14, θ table 15, and Z table 16 to control their movements.

Next, the operation of the above embodiment will be explained.

The printed circuit board 8 is fed on a guide rail 9. On the other hand, the semiconductor element 10 is transferred onto the suction table 17 by means not shown.

Here, pattern recognition is performed from above the camera 72. For pattern recognition, a reference pattern in which alignment marks are at accurate reference positions at two suitable points on a diagonal line of the semiconductor element 10 is stored in advance, and the actual semiconductor held on the suction table 17 is The deviation between the alignment mark of the element 10 and the alignment mark of the reference pattern is optically and electrically detected while moving the XY table 3 to obtain the amount of deviation. On the other hand, the positional deviation of the circuit pattern 27 on the printed circuit board 8 with respect to the reference position is similarly detected optically and electrically while moving the XY table 3 to obtain the amount of deviation. In this case, the printed circuit board 8 is on the fixed side, and the X, Y, and θ positions of the semiconductor element 10 and the bonding tool 6 are determined accordingly.

From this detection signal of the amount of deviation, the relative deviation in the XY direction and the θ direction of the lead 25 of the semiconductor element 10 with respect to the circuit pattern 27 on the printed circuit board 8 side is calculated, and the output signal from the interface control system 21 is calculated. Therefore, move the XY table 14 and theta table 15, and connect the leads 25 and circuit pattern 2.
Then, by operating the Z table 16, the semiconductor element 10 is lowered, and the lead 2 is aligned with the lead 2.
5 and the circuit pattern 27 are overlapped.

In parallel with this movement, the bonding tool 6 is moved by the XY table 3 and reaches directly above the semiconductor element 10, and is further moved by a signal corresponding to the value of the deviation of the lead 25 from the reference position in the θ direction.
After the θ rotation mechanism 5 rotates and the bonding tool 6 is angularly aligned with the overlapping leads 25 and circuit pattern 27,
The lead 25 is lowered and heated and pressed to join it to the circuit pattern 27.

In this way, the lead 25 and the circuit pattern 2
Although the bodying tool 7 and the bodying tool 6 are deviated from the reference position in the θ direction, they are in relatively coincident positions with each other, resulting in the state shown in FIG. 5, and a good joining can be performed.

Although the above embodiment relates to an outer lead bonding device, it goes without saying that the same can be applied to an inner lead bonding device. In this case, alignment will be done with a tape carrier instead of a printed circuit board.

[Effects of the Invention] According to the present invention, the position of the bonding tool can be aligned with the semiconductor element and the tape carrier or the printed circuit board. The pressure contact area between the parts will be sufficient, making it possible to achieve reliable automation of work, and the product will also be stable in terms of mechanical strength and electrical properties, and a significant improvement in quality is expected.

[Brief explanation of the drawing]

FIG. 1 is a side view of an embodiment of the present invention, FIG.
Figure 3 is a sectional view showing the process of bonding work,
FIG. 4 is a plan view showing the state of bonding between the leads and the circuit pattern, and FIGS. 5 and 6 are plan views showing the relative positions of the semiconductor element and the bonding tool. 1...Frame, 2...Bonding head,
3...XY table, 4...Z direction movement mechanism, 5
...θ rotation mechanism, 6... Bonding tool, 7
... Camera, 8 ... Printed circuit board, 9 ... Guide rail, 10 ... Semiconductor element, 13 ... Bonding stage, 14 ... XY table, 15 ...
θ table, 16... Z table, 17... Suction table, 18... Camera control unit, 19
...Monitor, 20...Pattern recognition device, 21...
...Interface control system, 22...Stage driver, 24...Lead holding plate, 25...Lead, 27...Circuit pattern, 28...Overlapping portion.

Claims (1)

[Claims] 1. In a tape bonding device that has a bonding head placed on an XY table and a bonding stage placed on an XY table, a Z table, and a θ table on a frame,
A tape bonding apparatus characterized in that the bonding head includes a bonding tool installed on a θ rotation mechanism.