JPH03155299A - Loud speaker - Google Patents
Loud speakerInfo
- Publication number
- JPH03155299A JPH03155299A JP29388989A JP29388989A JPH03155299A JP H03155299 A JPH03155299 A JP H03155299A JP 29388989 A JP29388989 A JP 29388989A JP 29388989 A JP29388989 A JP 29388989A JP H03155299 A JPH03155299 A JP H03155299A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- upper plate
- frame
- resin frame
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 238000000465 moulding Methods 0.000 claims abstract 3
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000004793 Polystyrene Substances 0.000 abstract description 3
- -1 polybutylene terephthalate Polymers 0.000 abstract description 3
- 229920002223 polystyrene Polymers 0.000 abstract description 2
- 239000004698 Polyethylene Substances 0.000 abstract 1
- 229920001707 polybutylene terephthalate Polymers 0.000 abstract 1
- 229920000573 polyethylene Polymers 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
- 238000001746 injection moulding Methods 0.000 description 4
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical compound O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、各種音響機器に使用されるスピーカに関する
ものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to speakers used in various types of audio equipment.
（従来の技術）
従来のこの種のスピーカについて、第２図によす説明す
る。同図は従来のスピーカの断面図で、磁石１を上部プ
レート２と下部プレート３の間にはさんで形成した磁気
回路４の上部プレート２に。(Prior Art) A conventional speaker of this kind will be explained with reference to FIG. The figure is a cross-sectional view of a conventional speaker, showing a magnetic circuit 4 formed by sandwiching a magnet 1 between an upper plate 2 and a lower plate 3 on the upper plate 2.
剛性に富む１種類の樹脂で成形した樹脂フレーム５を接
着し、さらに、この樹脂フレーム５の周縁部に接着した
振動板６と、中間部をダンパ７を介して上記の樹脂フレ
ーム５に保持し、上記の磁気回路４で形成された磁気ギ
ャップ８にはまり込んだ上記の振動板６を駆動させるた
めのボイスコイル９とをその内縁部で結合し、さらに、
振動板６のボイスコイル９との結合部の上面をダストキ
ャップｌＯを覆うように構成されている。A resin frame 5 molded from one type of highly rigid resin is bonded, and a diaphragm 6 bonded to the peripheral edge of this resin frame 5 and an intermediate portion are held to the resin frame 5 via a damper 7. , coupled with the voice coil 9 for driving the diaphragm 6, which is fitted into the magnetic gap 8 formed by the magnetic circuit 4, at its inner edge;
The upper surface of the connecting portion of the diaphragm 6 and the voice coil 9 is configured to cover the dust cap IO.
（発明が解決しようとする課題）
しかしながら、上記の構成では、樹脂フレーム５は、音
質を向上するために使用している剛性に富む樹脂は、一
般に接着性が悪いため、上部プレート２と接着する場合
に、生産工程の歩留りが悪かったり、また時には完成検
査で接着はずれが発見されるという問題があった。(Problem to be Solved by the Invention) However, in the above configuration, the resin frame 5 is bonded to the upper plate 2 because the highly rigid resin used to improve sound quality generally has poor adhesive properties. In some cases, there were problems in that the yield in the production process was poor, and in some cases, adhesive failure was discovered during final inspection.
本発明は、上記の問題を解決するもので、樹脂フレーム
５と上部プレート２の接着に優れた信頼性を有するスピ
ーカを提供するものである。The present invention solves the above-mentioned problems, and provides a speaker with excellent adhesion reliability between the resin frame 5 and the upper plate 2.
（課題を解決するための手段）
上記の課題を解決するため、本発明は、樹脂フレームを
射出成形する時、上部プレートとの接着面には接着性に
富む樹脂材料を、また、上部プレートとの接着面を除く
部分には、スピーカの音質を向上する剛性に富む樹脂材
料をそれぞれ使用するものである。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides that when injection molding a resin frame, a highly adhesive resin material is applied to the adhesive surface to which the upper plate is bonded. The parts other than the adhesive surfaces are made of highly rigid resin material that improves the sound quality of the speaker.
（作 用）
上記の１′？を成により、音質を低下させることなく、
上部プレートとの接着性を向上し、生産工程の歩留りを
好転するとともに、完成検査時の接着はずれをなくシ、
接着信頼性を向上させることができる。(Effect) 1' above? without degrading the sound quality.
Improves adhesion with the upper plate, improves yield in the production process, and eliminates adhesion during final inspection.
Adhesion reliability can be improved.
（実施例） 本発明の一実施例を第１図により説明する。(Example) An embodiment of the present invention will be described with reference to FIG.
同図において、本実施例が、第２図に示した従来例と異
なる点は、樹脂フレーム５を一体２色成形とし、フレー
ム本体５ａは、熱可塑性の剛性の高い樹脂材料、例えば
ＰＢＴ （ポリブチレンテレフタレート）やＰＥＴ （
ポリエチレンテレフタレート）、あるいは、熱硬化性の
高剛性樹脂により。In the same figure, the difference between this embodiment and the conventional example shown in FIG. butylene terephthalate) and PET (
Polyethylene terephthalate) or thermosetting high rigidity resin.
また、上部プレート２との接着部５ｂは接着性に富む樹
脂材料、例えばＰＳ（ポリスチレン）やＡＢＳ（アクリ
ロニトリルブタジェンスチレン）により一体２色成形し
たことである。その他は従来例と変わらないので、同じ
構成部品には同一符号を付して、その説明を省略する。Furthermore, the adhesive portion 5b with the upper plate 2 is integrally molded in two colors from a highly adhesive resin material such as PS (polystyrene) or ABS (acrylonitrile butadiene styrene). Since the rest is the same as the conventional example, the same components are given the same reference numerals and their explanations will be omitted.
このような構成により、上部プレート２と樹脂フレーム
５は、樹脂フレーム５の接着部５ｂが接着性に富む樹脂
材料で形成されているため、両者の接着性は良好であり
、生産工程の歩留りは向上し、完成検査時の接着はずれ
も発生しなくなる。With this configuration, the adhesive part 5b of the resin frame 5 is made of a highly adhesive resin material, so the adhesiveness between the upper plate 2 and the resin frame 5 is good, and the yield of the production process is low. This improves the bonding quality and eliminates the possibility of adhesive failure during final inspection.
（発明の効果）
以上説明したように、本発明によれば、樹脂フレームの
射出成形時に、その本体は、剛性に富む樹脂により、ま
た上部プレートとの接着部は接着性に富む樹脂により一
体２色成形するので、剛性の高いフレーム本体により高
音質、低歪の特性を維持したまま、上部プレートとの接
着性を向上することが可能となり、製造工程の歩留りが
向上し。(Effects of the Invention) As explained above, according to the present invention, during injection molding of a resin frame, the main body is made of a resin with high rigidity, and the adhesive part with the upper plate is made of a resin with a high adhesive property. Because it is colored molded, it is possible to improve the adhesion with the upper plate while maintaining the characteristics of high sound quality and low distortion due to the highly rigid frame body, which improves the yield of the manufacturing process.
完成時の不良率が低下し音質が良く信頼性の高いスピー
カが得られる。The defective rate at the time of completion is reduced, and a speaker with good sound quality and high reliability can be obtained.
また、樹脂フレームは一体２色射出成形により１種類の
樹脂による射出成形とほとんど変わらない工程で、高音
質化と良好な接着性を両立させた樹脂フレームを得るこ
とができる。Further, the resin frame can be produced by integral two-color injection molding, which is a process that is almost the same as injection molding using one type of resin, and can provide a resin frame that achieves both high sound quality and good adhesion.
第１図は本発明によるスピーカの断面図、第２図は従来
のスピーカの断面図である。
１・・・磁石、 ２・・・上部プレート、 ３・・・下
部プレート、 ４・・・磁気回路、 ５・・・樹脂フレ
ーム、 ５ａ・・・フレーム本体、 ５ｂ・・・
接着部、 ６・・・振動板、 ７・・・ダンパ、８・・
・磁気ギャップ、 ９・・・ボイスコイル。
１０・・・ダストキャップ。
第１図FIG. 1 is a sectional view of a speaker according to the present invention, and FIG. 2 is a sectional view of a conventional speaker. DESCRIPTION OF SYMBOLS 1... Magnet, 2... Upper plate, 3... Lower plate, 4... Magnetic circuit, 5... Resin frame, 5a... Frame body, 5b...
Adhesive part, 6... Vibration plate, 7... Damper, 8...
・Magnetic gap, 9...Voice coil. 10...Dust cap. Figure 1
Claims (1)
形成した磁気回路の上部プレートに、剛性に富む樹脂で
成形した樹脂フレームを接着し、さらに、上記の樹脂フ
レームの周縁部に、上記の磁気回路で形成される磁気ギ
ャップに挿入したボイスコイルに結合した振動板を接着
してなるスピーカにおいて、上記の樹脂フレームを、そ
のフレーム本体は剛性に富む樹脂で、また、上記の上部
プレートとの接着部は接着性の良い樹脂で、一体２色成
形したことを特徴とするスピーカ。A resin frame made of highly rigid resin is adhered to the upper plate of the magnetic circuit formed by sandwiching the magnet between the upper plate and the lower plate, and the magnetic circuit formed with the above magnetic circuit is attached to the periphery of the resin frame. In a speaker made of a diaphragm bonded to a voice coil inserted into a magnetic gap, the resin frame is made of a highly rigid resin, and the bonded part to the top plate is adhesive. This speaker features a two-color integral molding made of high-quality resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29388989A JP2838721B2 (en) | 1989-11-14 | 1989-11-14 | Speaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29388989A JP2838721B2 (en) | 1989-11-14 | 1989-11-14 | Speaker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03155299A true JPH03155299A (en) | 1991-07-03 |
| JP2838721B2 JP2838721B2 (en) | 1998-12-16 |
Family
ID=17800464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29388989A Expired - Fee Related JP2838721B2 (en) | 1989-11-14 | 1989-11-14 | Speaker |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2838721B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003032784A (en) * | 2001-07-19 | 2003-01-31 | Matsushita Electric Ind Co Ltd | Speaker |
| WO2013190824A1 (en) * | 2012-06-22 | 2013-12-27 | パナソニック株式会社 | Speaker, electronic device and mobile device that uses speaker, and speaker manufacturing method |
-
1989
- 1989-11-14 JP JP29388989A patent/JP2838721B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003032784A (en) * | 2001-07-19 | 2003-01-31 | Matsushita Electric Ind Co Ltd | Speaker |
| JP4572490B2 (en) * | 2001-07-19 | 2010-11-04 | パナソニック株式会社 | Speaker |
| WO2013190824A1 (en) * | 2012-06-22 | 2013-12-27 | パナソニック株式会社 | Speaker, electronic device and mobile device that uses speaker, and speaker manufacturing method |
| JP5494901B1 (en) * | 2012-06-22 | 2014-05-21 | パナソニック株式会社 | Speaker, electronic apparatus using the speaker, mobile device, and speaker manufacturing method |
| US9008350B2 (en) | 2012-06-22 | 2015-04-14 | Panasonic Intellectual Property Management Co., Ltd. | Loudspeaker, electronic device and mobile device both including the same, and method of producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2838721B2 (en) | 1998-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |