JP2003032784A - Speaker - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem associated with speakers for use in various kinds of acoustic equipment, that needs for the enhancement of resistance to input should be met. SOLUTION: The frame 26 of the speaker is composed of a resin with alumina fine particles mixed therein. The frame 26 is thereby enhanced in thermal conductivity, properties of heat radiation, heat resistance, rigidity, and form stability for the enhancement of the resistance to input of the speaker.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a speaker used in various audio equipment.

[0002]

2. Description of the Related Art A conventional speaker will be described with reference to FIG.

FIG. 14 shows a sectional view of a conventional speaker. According to FIG. 14, the magnetized magnet 1
The frame 6 obtained by injection molding with a resin material is joined to the upper plate 2 of the magnetic circuit 4 which is formed by sandwiching between the upper plate 2 and the lower plate 3, and the diaphragm 7 is attached to the peripheral portion of the frame 6. Glued,
A voice coil 8 for driving this diaphragm 7
, The voice coil 8 is held in the center by the damper 9, and the voice coil 8 is fitted in the magnetic gap 5 so that the dust cap 10 is bonded to the front surface of the diaphragm 7.

[0004]

The above-mentioned speaker uses the injection type resin frame 6 in order to obtain a complicated frame shape by a simple process.
The thermal conductivity was poorer than that of a metal frame, and the heat dissipation and heat resistance were poor. Therefore, it is difficult to continuously apply a large input to the speaker. That is, there is a problem that the speaker cannot have high input resistance.

Therefore, in the future, it has been a challenge to improve the thermal conductivity, heat dissipation and heat resistance of the frame 6 to realize a high input resistance of the speaker.

The present invention solves the above problems and provides an excellent speaker that can realize high input resistance of the speaker.

[0007]

In order to solve the above problems, the present invention has the following constitution.

According to the first aspect of the present invention, the frame is made of a resin mixed with alumina powder. As a result, the heat conductivity, heat dissipation, heat resistance, rigidity, and shape stability of the frame are improved, and it is possible to obtain the operational effect of achieving high input resistance and stable quality of the speaker.

According to a second aspect of the present invention, the frame forming resin is molded to the extent that part or all of the outer peripheral side surface of the yoke of the magnetic circuit is covered. As a result, there is an effect that the productivity of the speaker can be improved while improving the thermal conductivity and heat dissipation from the yoke.

According to a third aspect of the present invention, the resin is used to form a frame to cover a part or all of the outer peripheral side surface of the upper plate of the magnetic circuit. As a result, there is an effect that the productivity of the speaker can be improved while improving the thermal conductivity and heat dissipation from the upper plate.

According to a fourth aspect of the present invention, the resin is used to form a frame so as to cover a part or all of the outer peripheral side surface of the magnet of the magnetic circuit. As a result, there is an effect that the productivity of the speaker can be improved while improving the thermal conductivity and heat dissipation from the magnet.

According to a fifth aspect of the present invention, the resin is used for molding to form a part or all of the outer peripheral side surface of the lower plate of the magnetic circuit. As a result, there is an effect that the productivity of the speaker can be improved while improving the thermal conductivity and heat dissipation from the lower plate.

According to a sixth aspect of the present invention, the frame forming resin is molded to the extent that a part of the outer peripheral back surface of the lower plate of the magnetic circuit is reached. Thereby, while improving the thermal conductivity and heat dissipation from the lower plate, the cancel magnet guide of the speaker for low magnetic leakage can be molded at the same time, and the productivity of the speaker can be improved.

According to a seventh aspect of the present invention, the entire magnetic circuit is molded with a frame forming resin. As a result, the heat conductivity and heat dissipation from the entire magnetic circuit can be improved, and at the same time, the holding property of the entire magnetic circuit can be improved, and the productivity of the speaker can be improved.

According to the eighth aspect of the present invention, the surface of the magnetic circuit mold portion is provided with an uneven shape.
Thus, the surface area of the magnetic circuit mold resin portion is enlarged by the uneven shape, so that the thermal conductivity and the heat dissipation are further improved.

According to a ninth aspect of the present invention, the frame is formed by mixing more alumina powder than the vibrating plate coupling portion in the vicinity of the magnetic circuit. As a result, the heat conductivity and heat dissipation in the vicinity of the magnetic circuit of the frame are improved, and a high input resistance of the speaker can be achieved by the structure in which heat is not transmitted to the vibration plate adhesive portion of the frame.

According to a tenth aspect of the present invention, the frame is constructed by mixing more alumina powder than the damper coupling portion in the vicinity of the magnetic circuit. As a result, the heat conductivity and heat dissipation in the vicinity of the magnetic circuit of the frame are improved, and a high input resistance of the speaker can be achieved by the structure in which heat is not transmitted to the damper bonding portion of the frame.

According to an eleventh aspect of the present invention, the frame is constructed by mixing more alumina powder than the vibrating plate coupling portion in the vicinity of the magnetic circuit and the outer peripheral surface. As a result, the thermal conductivity near the magnetic circuit of the frame and the outer peripheral surface,
In addition to improving the heat dissipation, the effect that the speaker has high input resistance can be obtained because the heat is not transmitted to the vibration plate adhesive portion of the frame.

According to a twelfth aspect of the present invention, the frame is constructed by mixing more alumina powder than the damper coupling portion in the vicinity of the magnetic circuit and the outer peripheral surface. As a result, the thermal conductivity and heat dissipation of the frame near the magnetic circuit and the outer peripheral surface are improved, and the effect that the speaker has high input resistance by not transmitting heat to the damper bonding portion of the frame can be obtained. .

According to a thirteenth aspect of the present invention, the outer peripheral surface of the frame has an uneven shape. As a result, by increasing the surface area of the outer peripheral surface of the frame by the uneven shape, it is possible to obtain the effect of further improving the thermal conductivity and heat dissipation.

According to a fourteenth aspect of the present invention, the resin frame is constructed by controlling the amount of the alumina powder and the mixing arrangement of the alumina powder by a two-color molding method of injection molding. As a result, the effect that the amount of alumina powder in the frame and the arrangement of the alumina powder can be freely controlled can be obtained.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment 1) In the following, the invention described in claim 1 of the present invention will be described with reference to Embodiment 1. FIG. 1 is a sectional view of a speaker according to an embodiment of the present invention.

According to FIG. 1, magnetized magnet 21
On the upper plate 22 of the magnetic circuit 24 configured by sandwiching between the upper plate 22 and the lower plate 23,
A frame 26 formed by injection molding with a resin mixed with alumina powder is joined to form a frame 2
A vibrating plate 27 is connected to the outer peripheral portion of 6, and a voice coil 28 for driving the vibrating plate 27 is connected to the vibrating plate 27. The voice coil 28 is centrally held by a damper 29 so as to fit into the magnetic gap 25. It was completed, and the dust cap 30 was adhered to the front surface of the diaphragm 27 to complete the process.

With this configuration, the thermal conductivity, heat dissipation, heat resistance, rigidity, and shape stability of the magnetic circuit 24 can be improved, and the speaker can have high input resistance and stable quality.

(Second Embodiment) The second embodiment of the present invention will be described below, particularly the invention described in claim 2. FIG. 2 shows a cross-sectional view of a speaker according to an embodiment of the present invention, which is an example of an embodiment of an inner magnet type magnetic circuit using a neodymium magnet.

As shown in FIG. 2, the outer peripheral side surface of the yoke 33 of the magnetic circuit 24 constituted by sandwiching the magnetized neodymium magnet 32 between the upper plate 31 and the yoke 33 is molded with a resin mixed with alumina powder. Form a frame 26. This frame 26
A vibrating plate 27 is connected to the outer peripheral portion of the vibrating plate 27, a voice coil 28 for driving the vibrating plate 27 is connected to the vibrating plate 27, and the voice coil 28 is centrally held by a damper 29 so as to fit into the magnetic gap 25. Then, the dust cap 30 was adhered to the front surface of the diaphragm 27 to complete the process.

With this configuration, the thermal conductivity, heat dissipation, heat resistance and productivity of the magnetic circuit 24 can be improved, and the sound pressure level of the speaker can be prevented from lowering due to thermal demagnetization of the neodymium magnet. Therefore, it is possible to increase the input resistance of the speaker.

(Third Embodiment) The third embodiment of the present invention will be described below with reference to the present invention. FIG. 3 shows a cross-sectional view of the speaker according to the embodiment of the present invention. The structure of the frame will be described with reference to FIG. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

According to FIG. 3, the frame 26 is formed by molding a resin mixed with alumina powder up to a range extending to the outer peripheral side surface of the upper plate 22 of the magnetic circuit 24. As a result, the frame 26 can be molded at the same time as the frame 26 is joined to the upper plate 22, so that the productivity can be improved, the contact area with the magnetic circuit 24 can be expanded, and the thermal conductivity and heat dissipation can be further enhanced. Further, the holdability of the magnetic circuit can be improved.

(Embodiment 4) The invention of claim 4 of the present invention will be described below with reference to Embodiment 4. FIG. 4 is a cross-sectional view of the speaker according to the embodiment of the present invention. The structure of the frame will be described with reference to FIG. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

According to FIG. 4, the frame 26 is formed by molding a resin mixed with alumina powder up to a range extending to the outer peripheral side surface of the magnet 21 of the magnetic circuit 24. As a result, the frame 26 is attached to the magnet 21.
Since it can be molded at the same time as it is coupled with, productivity can be improved, and the contact area with the magnetic circuit 24 can be expanded.
The thermal conductivity and heat dissipation are further enhanced, and the holdability of the magnetic circuit can be further improved.

(Fifth Embodiment) The fifth embodiment of the present invention will be described below with reference to the present invention. FIG. 5 shows a cross-sectional view of the speaker according to the embodiment of the present invention. The configuration of the frame will be described with reference to FIG. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

According to FIG. 5, the frame 26 is formed by molding a resin mixed with alumina powder up to a range extending to the outer peripheral side surface of the lower plate 23 of the magnetic circuit. As a result, the frame 26 is attached to the lower plate 23.
Since it can be molded at the same time as it is coupled with, productivity can be improved, and the contact area with the magnetic circuit 24 can be expanded.
The thermal conductivity and heat dissipation are further enhanced, and the holdability of the magnetic circuit can be further improved.

(Sixth Embodiment) The sixth embodiment of the present invention will be described below with reference to the present invention. FIG. 6 shows a cross-sectional view of the speaker according to the embodiment of the present invention. The configuration of the frame will be described with reference to FIG. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

According to FIG. 6, the frame 26 is formed by molding a resin mixed with alumina powder up to a range extending to the outer peripheral back surface of the lower plate 23 of the magnetic circuit 24. As a result, the frame 26 can be molded at the same time as the frame 26 is joined to the lower plate 23, so that the productivity can be improved, the contact area with the magnetic circuit 24 can be expanded, and the thermal conductivity and heat dissipation can be further enhanced. Further, the holding property of the magnetic circuit 24 can be improved. Furthermore, since the resin is molded even on the outer peripheral back surface of the lower plate 23, this resin molded portion can be used as an outer peripheral guide of the cancel magnet of the speaker for low magnetic leakage.

(Embodiment 7) Hereinafter, the invention of claim 7 of the present invention will be described with reference to Embodiment 7. FIG. 7 shows a cross-sectional view of the speaker according to the embodiment of the present invention. The structure of the frame will be described with reference to FIG. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

According to FIG. 7, the frame 26 is formed by molding the entire magnetic circuit 24 with a resin mixed with alumina powder. This allows frame 2
Since 6 can be molded at the same time as being combined with the magnetic circuit 24, productivity can be improved, the contact area with the magnetic circuit 24 can be expanded, and thermal conductivity and heat dissipation can be further enhanced. It is also possible to improve the holdability of the.

(Embodiment 8) Hereinafter, the invention of claim 8 of the present invention will be described with reference to the embodiment 8. FIG. 8 shows a cross-sectional view of the speaker according to the embodiment of the present invention. The structure of the frame will be described with reference to FIG. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

As shown in FIG. 8, the frame 26 is formed by molding the entire magnetic circuit 24 with a resin mixed with alumina powder, and unevenness 26a is provided on the surface of the magnetic circuit molding portion. This allows frame 2
Since 6 can be molded at the same time as being combined with the magnetic circuit 24, the productivity can be improved, and the surface area is expanded by the unevenness 26a shape of the surface of the magnetic circuit mold resin portion in addition to the expansion of the contact area with the magnetic circuit 24. The thermal conductivity and heat dissipation are further enhanced. Further, the holdability of the magnetic circuit can be improved.

(Ninth Embodiment) The ninth embodiment of the present invention will be described below with reference to the ninth embodiment. FIG. 9 is a cross-sectional view of the speaker according to the embodiment of the present invention. The structure of the frame will be described with reference to FIG. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

According to FIG. 9, the frame 26 is constructed by mixing a larger amount of alumina powder in the vicinity of the magnetic circuit 24 than in the coupling portion of the diaphragm 27. This allows the frame 26
In addition to improving the heat conductivity and heat dissipation in the vicinity of the magnetic circuit, the structure prevents the heat from being transmitted to the vibration plate adhesive portion of the frame 26, thereby preventing the vibration plate from coming off the adhesive and increasing the input resistance of the speaker. Can be achieved.

(Embodiment 10) Hereinafter, Embodiment 10 will be described.
The invention of claim 10 of the present invention will be described with reference to FIG. FIG. 10 shows a cross-sectional view of the speaker according to the embodiment of the present invention. The structure of the frame will be described with reference to FIG. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

According to FIG. 10, the frame 26 is constructed by mixing more alumina powder in the vicinity of the magnetic circuit 24 than in the damper 29 coupling portion. Thereby, the thermal conductivity and heat dissipation of the frame 26 near the magnetic circuit 24 are improved, and the damper 29 is prevented from being detached by not transmitting heat to the damper 29 adhesive portion of the frame 26. Higher input resistance of the speaker can be achieved.

(Eleventh Embodiment) The eleventh embodiment will be described below.
Will be used to explain the invention of claim 11 in particular. FIG. 11 shows a cross-sectional view of the speaker according to the embodiment of the present invention. With reference to FIG. 11, the configuration of the frame will be described. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

According to FIG. 11, the frame 26 is constructed by mixing a larger amount of alumina powder in the vicinity of the magnetic circuit 24 and the outer peripheral surface than in the coupling portion of the diaphragm 27. This allows
In addition to improving the thermal conductivity and heat dissipation in the vicinity of the magnetic circuit 24 of the frame 26, the structure is such that heat is not transmitted to the bonding portion of the vibration plate 27 of the frame 26, so that the vibration plate 27 is prevented from coming off the adhesion, and the speaker It is possible to achieve high input resistance.

(Embodiment 12) Hereinafter, Embodiment 12 will be described.
The invention according to claim 12 of the present invention will be described with reference to FIG. FIG. 12 is a cross-sectional view of the speaker according to the embodiment of the present invention. The configuration of the frame will be described with reference to FIG. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

According to FIG. 12, the frame 26 is constructed by mixing a larger amount of alumina powder in the vicinity of the magnetic circuit 24 and the outer peripheral surface than the damper 29 coupling portion. As a result, the thermal conductivity and heat dissipation of the frame 26 near the magnetic circuit 24 are improved, and the damper 29 of the frame 26 is improved.
Damper 29 is configured by not transmitting heat to the adhesive part.
It is possible to prevent the adhesive from being detached and to improve the input resistance of the speaker.

(Embodiment 13) Hereinafter, Embodiment 13 will be described.
Will be used to explain the invention of claim 13 in particular. FIG. 13 is a cross-sectional view of the speaker according to the embodiment of the present invention. The structure of the frame will be described with reference to FIG. The configuration of the speaker is the same as that of the first embodiment, so the description will be simplified.

According to FIG. 13, irregularities 26b are formed on the outer peripheral surface of the frame 26. As a result, the surface area of the outer peripheral surface of the frame 26 is increased by the unevenness 26b, so that the thermal conductivity and the heat dissipation can be improved and the speaker can have high input resistance.

(Embodiment 14) Hereinafter, Embodiment 14 will be described.
Will be used to explain the invention of claim 14 in particular. That is, the frame 26 of FIGS. 1 to 13 is configured by controlling the amount of alumina powder and the mixing and placement of alumina powder by a two-color molding method of injection molding. As a means for obtaining the frame 26, a gate port for injection molding is provided at a position near the magnetic circuit 24 and at a position apart from the magnetic circuit 24, and a resin containing a large amount of alumina powder mixed in from the gate port at a position near the magnetic circuit 24. It can be simply constructed by injecting a material, and on the other hand, by injecting a resin material containing no alumina powder or a little mixed in from a gate port provided at a position away from the magnetic circuit 24 to perform two-color molding.

As a result, it is possible to freely control the amount of alumina powder in the frame 26 and the mixing and placement of the alumina powder, and it is possible to improve the productivity.

[0052]

As described above, the speaker of the present invention is made of the resin in which the alumina powder is mixed in the frame, whereby the thermal conductivity, heat dissipation, heat resistance, rigidity and shape stability of the frame are stable. It is possible to improve the input performance of the speaker and stabilize the quality. Further, in the case of a neodymium magnet, it is possible to prevent the sound pressure level of the speaker from lowering due to thermal demagnetization.

Therefore, the present invention can provide an excellent speaker that can realize high input resistance, and its industrial value is extremely great.

[Brief description of drawings]

FIG. 1 is a sectional view of a speaker according to an embodiment of the present invention.

FIG. 2 is a sectional view of a speaker according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view of a speaker according to another embodiment of the present invention.

FIG. 4 is a sectional view of a speaker according to another embodiment of the present invention.

FIG. 5 is a sectional view of a speaker according to another embodiment of the present invention.

FIG. 6 is a cross-sectional view of a speaker according to another embodiment of the present invention.

FIG. 7 is a sectional view of a speaker according to another embodiment of the present invention.

FIG. 8 is a sectional view of a speaker according to another embodiment of the present invention.

FIG. 9 is a sectional view of a speaker according to another embodiment of the present invention.

FIG. 10 is a sectional view of a speaker according to another embodiment of the present invention.

FIG. 11 is a sectional view of a speaker according to another embodiment of the present invention.

FIG. 12 is a sectional view of a speaker according to another embodiment of the present invention.

FIG. 13 is a sectional view of a speaker according to another embodiment of the present invention.

FIG. 14 is a sectional view of a conventional speaker.

[Explanation of symbols]

21 magnet 22 Upper plate 23 Lower plate 24 Magnetic circuit 25 magnetic gap 26 frames 27 diaphragm 28 voice coils 29 damper 30 dust cap

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masahide Sumiyama             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5D012 AA02 BB01 BB04 CA09 DA01                       EA04 FA01 GA01

Claims (14)

[Claims] 1. A frame coupled to a magnetic circuit, a diaphragm coupled to an outer peripheral portion of the frame, a diaphragm coupled to the diaphragm, and a part of the diaphragm disposed in a magnetic gap of the magnetic circuit. A speaker comprising a voice coil, wherein the frame is made of resin mixed with alumina powder. 2. The speaker according to claim 1, wherein a part of or the entire outer peripheral side surface of the yoke of the magnetic circuit is molded with a frame forming resin. 3. The speaker according to claim 1, wherein a part of or the entire outer peripheral side surface of the upper plate of the magnetic circuit is molded with a frame forming resin. 4. The speaker according to claim 1, wherein the magnet of the magnetic circuit is molded with a frame-forming resin up to a part or all of the outer peripheral side surface of the magnet. 5. The speaker according to claim 1, wherein the lower plate of the magnetic circuit is molded with a resin for forming a frame up to a part or the whole of an outer peripheral side surface of the lower plate. 6. The speaker according to claim 1, which is molded with a resin for forming a frame up to a part of the outer peripheral back surface of the lower plate of the magnetic circuit. 7. The speaker according to claim 1, wherein the entire magnetic circuit is molded with a resin for forming a frame. 8. The speaker according to claim 1, 2 or 3, 4 or 5 or 6 or 7, wherein the surface of the magnetic circuit mold portion has an uneven shape. 9. A resin frame in which the amount of alumina powder in the vicinity of the magnetic circuit of the frame is mixed in more than that of the vibration plate coupling portion of the frame is used, claim 1 or claim 2 or claim 3 or claim 4 or Claim 5 or Claim 6
Alternatively, the speaker according to claim 7 or claim 8. 10. A resin frame formed by mixing a greater amount of alumina powder in the vicinity of the magnetic circuit of the frame than in the damper connecting portion of the frame, claim 1, claim 2, claim 3, claim 4, or claim 4. The speaker according to claim 5, claim 6, claim 7, or claim 8. 11. A resin frame in which the amount of alumina powder in the vicinity of the magnetic circuit of the frame and on the outer peripheral surface is mixed more than in the vibration plate coupling portion of the frame is used. The speaker according to claim 4, claim 5, claim 6, or claim 7. 12. A resin frame formed by mixing the amount of alumina powder in the vicinity of the magnetic circuit of the frame and on the outer peripheral surface in a larger amount than that of the damper coupling portion of the frame, claim 1, claim 2, claim 3, or claim 3. 4 or claim 5
Alternatively, the speaker according to claim 6 or claim 7. 13. The speaker according to claim 11, wherein the outer peripheral surface of the frame has an uneven shape. 14. A resin frame obtained by controlling the amount of alumina powder and the mixing and arrangement of alumina powder by a two-color molding method of injection molding, which is used in claim 1, claim 2, claim 3 or claim 4. Alternatively, the speaker according to claim 5 or claim 6 or claim 7 or claim 8 or claim 9 or claim 10 or claim 11 or claim 12 or claim 13.