JPH03154398A - Framed shield member - Google Patents
Framed shield memberInfo
- Publication number
- JPH03154398A JPH03154398A JP29351589A JP29351589A JPH03154398A JP H03154398 A JPH03154398 A JP H03154398A JP 29351589 A JP29351589 A JP 29351589A JP 29351589 A JP29351589 A JP 29351589A JP H03154398 A JPH03154398 A JP H03154398A
- Authority
- JP
- Japan
- Prior art keywords
- shield
- frame
- bottom plate
- aluminum
- framed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 32
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005476 soldering Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 238000005219 brazing Methods 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 229910001369 Brass Inorganic materials 0.000 claims description 4
- 239000010951 brass Substances 0.000 claims description 4
- 238000001192 hot extrusion Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 8
- 239000003990 capacitor Substances 0.000 abstract description 5
- 229910052742 iron Inorganic materials 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 238000004512 die casting Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、超高周波回路ユニットの筐体を形成するフレ
ーム・シールド体に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a frame/shield body forming a casing of an ultra-high frequency circuit unit.
従来の技・看
従来のフレーム−シールド体は、高周波回路のプリント
配線基板を収納するフレームと底板及びシールドが一体
で形成された構成であった。Conventional Techniques and Views A conventional frame-shield body has a structure in which a frame for accommodating a printed wiring board of a high-frequency circuit, a bottom plate, and a shield are integrally formed.
以下図面にもとづいて説明する。The following will be explained based on the drawings.
第３図に高周波回路ユニットの構成を組立見取図で示す
。図において、１は高周波回路ユニットの国体を形成す
るフレーム、２はフレーム内部に区画を形成し、電気的
シールドを行なうシールド、３は国体としての底部並び
に機器への取付の為の取付部を有した底板であり、これ
ら１〜３は接合部での電気的シールドの重要性からアル
ばもしくは亜鉛を用いたグイキャストによる一体形成で
つくられ、且つ高周波回路ユニットとしての入出力端子
となる貫通型コンデンサ４を底板に接合する必要がある
為、１〜３は錫、ニッケル等の半田付が可能な表面処理
が施される。５は高周波回路を構成するプリント配線基
板で印刷回路（図示せず）並びに電気部品（図示せず）
が実装、半田付され、シールドが貫通する溝が設けられ
て、フレーム内部に挿着し底板にビス６で取付、固定が
行なわれている。７はカバーで高周波回路ユニットの全
体及び内部の各機能ブロック間を電気的シールドを行な
う為に、ビス８でフレーム及びシールドに形成されたビ
ス止メ孔９に取付固定される。FIG. 3 shows an assembly sketch of the configuration of the high frequency circuit unit. In the figure, 1 is a frame that forms the body of the high-frequency circuit unit, 2 is a shield that forms partitions inside the frame and performs electrical shielding, and 3 has a bottom part as the body and a mounting part for attaching it to equipment. Due to the importance of electrical shielding at the joints, these bottom plates 1 to 3 are integrally formed using aluminum or zinc casting, and are through-type bottom plates that serve as input and output terminals as a high-frequency circuit unit. Since it is necessary to bond the capacitor 4 to the bottom plate, the surfaces 1 to 3 are subjected to a surface treatment such as tin or nickel that allows soldering. 5 is a printed wiring board constituting a high frequency circuit, which includes a printed circuit (not shown) and electrical components (not shown).
is mounted and soldered, a groove is provided for the shield to pass through, and the shield is inserted into the frame and attached and fixed to the bottom plate with screws 6. Reference numeral 7 denotes a cover which is fixed by screws 8 into screw holes 9 formed in the frame and the shield in order to provide electrical shielding between the entire high frequency circuit unit and each internal functional block.
以上の組立構成における組立断面図を第４図に示す。図
において貫通型コンデンサは底板に対して半田付１０に
より接合され端子はプリント配線基板の印刷回路に半田
付１１により接合されているＯ
発明が解決しようとする課題
このような従来方式（法）ではフレーム・シールド底板
を一体で形成する為、アルミ又は亜鉛材料を用いたダイ
キャスト金型の製作費用が高くなる為、特に少量生産の
場合製品に対するコストアップにもなる、又入出力端子
を半田付する為に錫、ニッケル等のメツキも必要となる
為、併せてコス１−ＵＰの要因にもなっている、という
欠点があった。FIG. 4 shows an assembled sectional view of the above assembled configuration. In the figure, the feedthrough capacitor is connected to the bottom plate by soldering 10, and the terminal is connected to the printed circuit of the printed wiring board by soldering 11. Since the frame and shield bottom plate are integrally formed, the production cost of die-casting molds using aluminum or zinc materials is high, which increases the cost of the product especially in small quantity production, and the input/output terminals are soldered. In order to do this, plating with tin, nickel, etc. is also required, which is also a factor in increasing the cost.
本発明は上記問題点を解決するものでフレーム・シール
ド底板の形成においてグイキャスト方法を用いずに金型
の製作費を低減し、筐体の錫、ニッケル等のメツキをも
伴せて廃止してコストを削減すると共にフレーム・シー
ルド底板の各接合部における電気的シールドを、従来と
同様のレベルで行なうことを目的としている。The present invention solves the above-mentioned problems, and reduces the manufacturing cost of molds without using the Gui-casting method in forming the frame/shield bottom plate, and also eliminates the need for plating of tin, nickel, etc. on the casing. The purpose is to reduce costs and to provide electrical shielding at the joints of the frame and shield bottom plate at the same level as in the past.
課題を解決するだめの手段
この問題点を解決する為に本発明は、外枠を形成するフ
レームと内部に区画を形成するシールド部とを、アルｉ
材料を用いた熱間押出材により一体で形成し一方の開放
面に銅、黄銅板又は表面にプリコートがなされた鉄板等
の半田付可能な材料を用いた底板を、上記アルミ材のフ
レーム・シールド間の接合部を半田材料の溶融温度以上
でアルミの溶融温度以下のろう材を用いて接合したもの
である。Means for Solving the Problem In order to solve this problem, the present invention provides a frame that forms an outer frame and a shield part that forms a partition inside.
A bottom plate made of a solderable material such as a copper plate, a brass plate, or a pre-coated iron plate on one open side is formed integrally from hot extruded material using a hot extrusion material, and the frame shield of the above aluminum material is attached. The joint between the two is made using a brazing filler metal whose temperature is higher than the melting temperature of the solder material and lower than the melting temperature of aluminum.
作用
本発明は上記した構成によりフレーム及び、シールドの
熱間押出法による製造工法を用いる事により本形状を形
成する場合、従来のダイキャスト金型と比較して押出ダ
イスの製作コストは一般的に約Ａ〜外となシ又、底板は
平板である為、切断し丸孔を設けるだけである為、プレ
ス金型が無くとも造ることは可能である。又フレームと
シールドは押出しにより形成される為接合部は一体とな
っており、底板との接合はろう材を用いた接合により全
ての接合が従来と同じように電気的シールドが完全にな
された構成にする事が出来る。又底板に半田付可能な材
料を用いる事により、入出力端子を半田が溶融する温度
雰囲気のオーブン炉に通すことにより底板との半田接合
が行なえる、こノ時フレーム・シールドと底板間は、半
田溶融温度以上のろう材を用いた接合となっている為、
入出力端子の：妾合温度では、溶けることはない。した
がってフレーム・シールド底板へのメツキ処理も廃止す
ることも併せて可能となる。Function: When the present invention uses the above-described configuration to form the frame and shield using the hot extrusion method, the manufacturing cost of the extrusion die is generally lower than that of a conventional die-casting mold. Also, since the bottom plate is a flat plate, all that is required is cutting it and making round holes, so it is possible to make it without a press mold. In addition, the frame and shield are formed by extrusion, so the joints are integrated, and the bottom plate is joined using brazing material, so all joints are completely electrically shielded as in the past. It can be done. In addition, by using a solderable material for the bottom plate, the input/output terminals can be soldered to the bottom plate by passing them through an oven at a temperature where the solder melts.At this time, the space between the frame shield and the bottom plate is Since the joint uses a brazing material with a temperature higher than the solder melting temperature,
Input/output terminals: Will not melt at mating temperature. Therefore, it is also possible to eliminate plating on the frame/shield bottom plate.
実施例
以下、本発明の一実施例を添付図面に基づいて説明する
。EXAMPLE Hereinafter, an example of the present invention will be described based on the accompanying drawings.
第１図にフレーム１とシールド２がアルミを用いた押出
材により一体で形成され国体として所望の高さに切断し
カバーをビスにより取付する為のビス孔９が加工されて
いる。３は半田付が可能な例えば銅、黄銅又はプリコー
トがなされた鉄板等を用いた底板で貫通型コンデンサ４
を取付る為に複数の孔１２が形成されている。なお、図
中、６はプリント配線基板、８はビス、７はカバー、８
はビス、９は孔、１０．１１は半田付、１３はろう材で
ある。In FIG. 1, a frame 1 and a shield 2 are integrally formed from an extruded aluminum material, cut to a desired height for the national polity, and screw holes 9 are machined for attaching the cover with screws. 3 is a bottom plate made of copper, brass, or pre-coated iron plate that can be soldered, and is a through-type capacitor 4.
A plurality of holes 12 are formed for mounting. In addition, in the figure, 6 is a printed wiring board, 8 is a screw, 7 is a cover, 8
1 is a screw, 9 is a hole, 10.11 is soldering, and 13 is a brazing material.
第２図にフレーム・シールド及び底板がろう材により接
合された断面図を示す。FIG. 2 shows a cross-sectional view of the frame shield and bottom plate joined by brazing material.
ろう材を用いた場合の製造方法は、底板の上に治具等を
用いてフレーム・シールドを所定の位置に配置し、接合
するフレーム・シールドと底板のコーナーに数ケ所ろう
材を配置し、半田の溶融温度以上、アルミの溶融温度以
下の温度内から選ばれたろう材の、溶融温度に上げられ
た還元炉に通すことにより、全ての接合部にろう材１３
が流れ図の如く接合される事になる。The manufacturing method when using brazing metal is to place the frame/shield in a predetermined position on the bottom plate using a jig, etc., then place the brazing metal in several places at the corners of the frame/shield and the bottom plate to be joined. The brazing material 13 is applied to all joints by passing it through a reduction furnace heated to the melting temperature of a brazing material selected from a temperature range above the melting temperature of solder and below the melting temperature of aluminum.
will be joined as shown in the flowchart.
以上の結果、従来例の如くフレーム・シールド底板の各
々の接合が電気的シールドを有して国体として形成する
事が出来ると共に、メツキの表面処理を無くすという効
果が得られる。As a result of the above, the respective joints of the frame and shield bottom plate can have electrical shields and can be formed as a national body as in the conventional example, and the effect of eliminating plating surface treatment can be obtained.
発明の効果
以上のように本発明によれば、高周波回路ユニットとし
ての厘体を、アルεもしくは亜鉛のダイキャストによる
形成から、アルミ材料からなる押出材を用いてフレーム
・シールドを形成する事により押出材のダイス金型費用
が従来のダイキャスト金型費用と比較して、−船釣に、
Ａ〜衿で造る事が出来る為、特に少量生産数の場合には
製品全体のコストを低減する事が出来ると共に、併せて
、入出力端子である貫通型コンデンサを半田付する為に
従来行っていた錫、ニッケル等のメツキ処理も本発明で
は、底板を分離することによってアルミ、亜鉛以外の材
料選択が可能となり、従って半田付可能な材料である銅
、黄銅又はそれ等の材料をプリコートした鉄板を用いる
事により、国体全体としてのメツキ処理が不要となる為
、メツキのコスト削減という効果も有している。Effects of the Invention As described above, according to the present invention, the frame as a high-frequency circuit unit can be formed by die-casting aluminum or zinc, and the frame and shield can be formed by using an extruded material made of aluminum material. The cost of die molds for extruded materials compared to the cost of conventional die-casting molds - for boat fishing,
Since it can be made with A~ collar, it is possible to reduce the overall cost of the product, especially in the case of small quantity production, and at the same time, it is possible to solder the feedthrough capacitor which is the input/output terminal. In the present invention, by separating the bottom plate, it is possible to select materials other than aluminum and zinc, and therefore, it is possible to select materials other than aluminum and zinc, which are solderable materials such as copper, brass, or an iron plate pre-coated with such materials. By using this, there is no need for plating for the entire national polity, which also has the effect of reducing plating costs.
瀉１図は本発明のフレーム・シールド体を構成する厘体
の分解斜視図、第２図はろう付された同国体の断面図、
第３図は従来例の厘体を用いた分解斜視図、第４図は第
３図でのＸ
断面図である。
１・・・・笛体、２・・・・・シールド、・・・・・ろ
う材。Figure 1 is an exploded perspective view of the frame that constitutes the frame/shield body of the present invention, and Figure 2 is a cross-sectional view of the same body that has been brazed.
FIG. 3 is an exploded perspective view using a conventional reel, and FIG. 4 is an X sectional view in FIG. 3. 1...Flute body, 2...Shield,...Brazing material.
Claims (1)
ルドとを、アルミ材料を用いた熱間押出材により、一体
で形成し、一方の開放面に銅・黄銅板もしくは、表面に
プリコートがなされた鉄板等の半田付が可能な材料を用
いた底板を、上記アルミ材のフレーム・シールド間との
接合部を半田材料の溶融温度以上のろう材を用いて接合
したことを特徴とするフレーム・シールド体。The frame forming the outer frame and the shield forming the internal divisions are integrally formed by hot extrusion using aluminum material, and one open side is made of copper or brass plate, or the surface is pre-coated. The frame is characterized in that the bottom plate is made of a material that can be soldered, such as a steel plate, and the joint between the aluminum frame and the shield is joined using a brazing material having a temperature higher than the melting temperature of the soldering material. shield body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29351589A JPH03154398A (en) | 1989-11-10 | 1989-11-10 | Framed shield member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29351589A JPH03154398A (en) | 1989-11-10 | 1989-11-10 | Framed shield member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03154398A true JPH03154398A (en) | 1991-07-02 |
Family
ID=17795737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29351589A Pending JPH03154398A (en) | 1989-11-10 | 1989-11-10 | Framed shield member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03154398A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998014965A1 (en) * | 1996-10-02 | 1998-04-09 | Asea Brown Boveri Jumet S.A. | A power capacitor |
| US7084356B2 (en) * | 2003-12-08 | 2006-08-01 | Laird Technologies, Inc. | Replacement cover for electromagnetic shielding system |
-
1989
- 1989-11-10 JP JP29351589A patent/JPH03154398A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6256188B1 (en) | 1996-02-10 | 2001-07-03 | Asea Brown Boveri Jumet S.A. (Abb) | Power capacitor |
| WO1998014965A1 (en) * | 1996-10-02 | 1998-04-09 | Asea Brown Boveri Jumet S.A. | A power capacitor |
| BE1010663A5 (en) * | 1996-10-02 | 1998-11-03 | Asea Brown Boveri Jumet S A En | Capacitor. |
| US7084356B2 (en) * | 2003-12-08 | 2006-08-01 | Laird Technologies, Inc. | Replacement cover for electromagnetic shielding system |
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