JPH031540U - - Google Patents

Info

Publication number
JPH031540U
JPH031540U JP6031989U JP6031989U JPH031540U JP H031540 U JPH031540 U JP H031540U JP 6031989 U JP6031989 U JP 6031989U JP 6031989 U JP6031989 U JP 6031989U JP H031540 U JPH031540 U JP H031540U
Authority
JP
Japan
Prior art keywords
semiconductor element
circuit board
metal wiring
wire
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6031989U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6031989U priority Critical patent/JPH031540U/ja
Publication of JPH031540U publication Critical patent/JPH031540U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP6031989U 1989-05-26 1989-05-26 Pending JPH031540U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6031989U JPH031540U (zh) 1989-05-26 1989-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6031989U JPH031540U (zh) 1989-05-26 1989-05-26

Publications (1)

Publication Number Publication Date
JPH031540U true JPH031540U (zh) 1991-01-09

Family

ID=31587580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6031989U Pending JPH031540U (zh) 1989-05-26 1989-05-26

Country Status (1)

Country Link
JP (1) JPH031540U (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230450A (ja) * 2000-02-21 2001-08-24 Hiroshi Ninomiya 面発光体の製造方法
JP2005033194A (ja) * 2003-06-20 2005-02-03 Nichia Chem Ind Ltd パッケージ成型体およびそれを用いた半導体装置
WO2009028738A1 (ja) * 2007-08-31 2009-03-05 Sanyo Electric Co., Ltd. 発光モジュールおよびその製造方法
JP2009161186A (ja) * 2007-12-28 2009-07-23 Lion Corp ブリスター包装容器およびブリスター包装容器の包装方法
JP2015018934A (ja) * 2013-07-11 2015-01-29 株式会社伸光製作所 プリント基板およびその製造方法
JP2016213422A (ja) * 2015-05-13 2016-12-15 株式会社伸光製作所 プリント配線板及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230450A (ja) * 2000-02-21 2001-08-24 Hiroshi Ninomiya 面発光体の製造方法
JP2005033194A (ja) * 2003-06-20 2005-02-03 Nichia Chem Ind Ltd パッケージ成型体およびそれを用いた半導体装置
JP4645071B2 (ja) * 2003-06-20 2011-03-09 日亜化学工業株式会社 パッケージ成型体およびそれを用いた半導体装置
WO2009028738A1 (ja) * 2007-08-31 2009-03-05 Sanyo Electric Co., Ltd. 発光モジュールおよびその製造方法
JP2009161186A (ja) * 2007-12-28 2009-07-23 Lion Corp ブリスター包装容器およびブリスター包装容器の包装方法
JP2015018934A (ja) * 2013-07-11 2015-01-29 株式会社伸光製作所 プリント基板およびその製造方法
JP2016213422A (ja) * 2015-05-13 2016-12-15 株式会社伸光製作所 プリント配線板及びその製造方法

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