JPH03146343A - Polyamide resin laminated film - Google Patents
Polyamide resin laminated filmInfo
- Publication number
- JPH03146343A JPH03146343A JP28529489A JP28529489A JPH03146343A JP H03146343 A JPH03146343 A JP H03146343A JP 28529489 A JP28529489 A JP 28529489A JP 28529489 A JP28529489 A JP 28529489A JP H03146343 A JPH03146343 A JP H03146343A
- Authority
- JP
- Japan
- Prior art keywords
- aliphatic
- polyamide resin
- layer
- polyamide
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 32
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000004953 Aliphatic polyamide Substances 0.000 claims abstract description 15
- -1 aliphatic diamine Chemical class 0.000 claims abstract description 15
- 229920003231 aliphatic polyamide Polymers 0.000 claims abstract description 15
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims abstract description 15
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 8
- 150000003951 lactams Chemical class 0.000 claims abstract description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000004760 aramid Substances 0.000 claims abstract description 5
- 229920003235 aromatic polyamide Polymers 0.000 claims abstract description 5
- 230000015572 biosynthetic process Effects 0.000 claims abstract 5
- 238000000034 method Methods 0.000 claims description 12
- 239000005001 laminate film Substances 0.000 claims description 8
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical group O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 claims description 4
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 235000013305 food Nutrition 0.000 abstract description 10
- 125000003118 aryl group Chemical group 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 27
- 239000004952 Polyamide Substances 0.000 description 11
- 229920002647 polyamide Polymers 0.000 description 11
- 229920002292 Nylon 6 Polymers 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920006280 packaging film Polymers 0.000 description 3
- 239000012785 packaging film Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 150000002531 isophthalic acids Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- BTLSLHNLDQCWKS-UHFFFAOYSA-N oxocan-2-one Chemical group O=C1CCCCCCO1 BTLSLHNLDQCWKS-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Polyamides (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は新規なポリアミド樹脂積層フィルムに関するも
のである。さらに詳しくいえば、本発明は耐熱性、耐寒
性、耐衝撃性に優れるとともに、さらに透明性、ガスバ
リヤ−性及び食品衛生上の安全性にも優れ、例えば食品
包装分野などにおいて好適に用いられるポリアミド樹脂
積層フィルムに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a novel polyamide resin laminate film. More specifically, the present invention has excellent heat resistance, cold resistance, and impact resistance, as well as excellent transparency, gas barrier properties, and food hygiene safety, and is suitable for use in, for example, the food packaging field. This invention relates to a resin laminated film.
[従来の技術]
従来、ポリアミド樹脂フィルムは、耐熱性、耐油性、耐
寒性及び耐衝撃性などに優れた強靭な高性能フィルムと
して、食品包装などの分野において広く用いられている
。[Prior Art] Conventionally, polyamide resin films have been widely used in fields such as food packaging as tough, high-performance films with excellent heat resistance, oil resistance, cold resistance, impact resistance, and the like.
しかしながら、ナイロン−6などの市販ポリアミド樹脂
を用いてフィルムを作成した場合、常に透明性に優れた
フィルムが得られるとはかぎらず、特に比較的簡単な設
備で生産でき、製造コストの安価な空冷式インクレージ
ョン法ではヘイズ値の高い不透明なフィルムしか得られ
ないという問題が生じ、さらに、脂肪族ポリアミド樹脂
から成るフィルムは、大気中の水分の吸収により、本来
の剛性を保持することができないし、またナイロン−6
から成るフィルムは、その原料上ツマ−であるε〜カグ
ロラクタムがフィルム表面ヘブリードするために、食品
衛生上の安全性の面から、食品包装用フィルムなどとし
ては使用しにくいなどの欠点を有している。However, when films are made using commercially available polyamide resins such as nylon-6, it is not always possible to obtain films with excellent transparency. The problem with the formula inkling method is that only opaque films with high haze values can be obtained, and films made of aliphatic polyamide resins cannot maintain their original rigidity due to the absorption of moisture in the atmosphere. Also, nylon-6
Due to its raw materials, the film ε~caglolactam bleeds onto the film surface, making it difficult to use as a food packaging film from the standpoint of food hygiene safety. There is.
[発明が解決しようとする課題]
本発明は、このような従来のポリアミド樹脂フィルムが
有する欠点を克服し、ポリアミド樹脂フィルム本来の耐
熱性、耐油性、耐寒性、耐衝撃性などの優れた特性を保
持するとともに、透明性、ガスバリヤ−性及び食品衛生
上の安全性にも優れたポリアミド樹脂フィルムを提供す
ることを目的として成されたものである。[Problems to be Solved by the Invention] The present invention overcomes the drawbacks of conventional polyamide resin films, and improves the excellent properties of polyamide resin films such as heat resistance, oil resistance, cold resistance, and impact resistance. The purpose of this invention is to provide a polyamide resin film that has excellent transparency, gas barrier properties, and food hygiene safety.
[課題を解決するための手段]
本発明者らは、前記の好ましい性質を有するポリアミド
樹脂フィルムを開発すべく鋭意研究を重ねた結果、特定
のポリアミド樹脂層から成る多層構造を有する積層フィ
ルムにより、その目的を達成しうろことを見い出し、こ
の知見に基づいて本発明を完成するに至った。[Means for Solving the Problems] As a result of intensive research to develop a polyamide resin film having the above-mentioned preferable properties, the present inventors found that a laminated film having a multilayer structure composed of specific polyamide resin layers, We have found a way to achieve this objective, and based on this knowledge, we have completed the present invention.
すなわち、本発明は、少なくとも3層の樹脂層から成る
外N/中間層/内層の構造を有する多層フィルムであっ
て、該外層及び内層が、(A)(a)脂肪酸ジアミンと
イソフタル酸及び/又はテレフタル酸とから成る芳香族
ポリアミド形成単位置O−100重量%と、(b)ラク
タム又は脂肪族ジアミンと脂肪族ジカルボン酸とから成
る脂肪族ポリアミド形成単位90〜0重量%とから成る
ポリアミド樹脂から構成され、かつ中間層が(B)脂肪
族ポリアミド樹脂から構成されることを特徴とするポリ
アミド樹脂積層フィルムを提供するものである。That is, the present invention provides a multilayer film having an outer N/middle layer/inner layer structure consisting of at least three resin layers, the outer layer and the inner layer comprising (A) (a) fatty acid diamine, isophthalic acid, and/or or terephthalic acid, and (b) a polyamide resin consisting of 90 to 0% by weight of aliphatic polyamide-forming units consisting of a lactam or aliphatic diamine and an aliphatic dicarboxylic acid. The object of the present invention is to provide a polyamide resin laminate film characterized in that the intermediate layer is composed of (B) an aliphatic polyamide resin.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明の積層フィルムは、少なくとも3層の樹脂層から
戊る外層/中間層/内層の多層構造を有することが必要
である。該積層フィルムの外層及び内層を構成する(A
)ポリアミド樹脂は、(a)脂肪族ジアミンとイソフタ
ル酸及び/又はテレフタル酸とから成る芳香族ポリアミ
ド形成単位から成る重合体であってもよいし、この芳香
族ポリアミド形成単位と、(b)ラクタム又は脂肪族ジ
アミンと脂肪族ジカルボン酸とから成る脂肪族ポリアミ
ド形成単位とから成るコポリアミドであってもよいが、
コポリアミドの場合、前記(a)の芳香族ポリアミド形
成単位は、(a)と(b)との合計量に対し、10重量
%以上含有されることが必要である。この量が10重量
%未満ではフィルムの透明性が失われるおそれがある。The laminated film of the present invention needs to have a multilayer structure consisting of an outer layer/intermediate layer/inner layer consisting of at least three resin layers. Constituting the outer layer and inner layer of the laminated film (A
) The polyamide resin may be a polymer consisting of an aromatic polyamide-forming unit consisting of (a) an aliphatic diamine and isophthalic acid and/or terephthalic acid, or may be a polymer consisting of an aromatic polyamide-forming unit and (b) a lactam. Alternatively, it may be a copolyamide consisting of an aliphatic polyamide forming unit consisting of an aliphatic diamine and an aliphatic dicarboxylic acid,
In the case of a copolyamide, the aromatic polyamide forming unit (a) needs to be contained in an amount of 10% by weight or more based on the total amount of (a) and (b). If this amount is less than 10% by weight, the transparency of the film may be lost.
なお、ガスバリヤ−性の高いフィルムを必要とする場合
には、該(a)は85重量%以上含有されることが望ま
しい。In addition, when a film with high gas barrier properties is required, it is desirable that the content of (a) is 85% by weight or more.
前記(A)ポリアミド樹脂の単量体として用いられる脂
肪族ジアミンとしては、例えばエチレンジアミン、テト
ラメチレンジアミン、ヘキサメチレンジアミン、オクタ
メチレンジアミン、デカメチレンジアミンなどの直鎖脂
肪族ジアミン及びそのメチル化物、エチル化物、ハロゲ
ン化物などが挙げられる。また、ラクタムとしては、例
えばカプロラクタム、ラウリルラクタムなどが挙げられ
、脂肪族ジカルボン酸としては、倒えばコハク酸、グル
タル酸、アジピン酸、ピメリン酸、スペリン酸、アゼラ
イン酸、セバシン酸など及びこれらのメチル化物、エチ
ル化物、ハロゲン化物などの誘導体が挙げられる。Examples of the aliphatic diamine used as the monomer of the polyamide resin (A) include linear aliphatic diamines such as ethylene diamine, tetramethylene diamine, hexamethylene diamine, octamethylene diamine, and decamethylene diamine, and their methylated products, and ethyl diamines. Examples include compounds, halides, and the like. Examples of lactams include caprolactam and lauryllactam, and examples of aliphatic dicarboxylic acids include succinic acid, glutaric acid, adipic acid, pimelic acid, superric acid, azelaic acid, and sebacic acid, as well as methyl of these acids. Examples include derivatives such as compounds, ethylated compounds, and halides.
前記(A)ポリアミド樹脂の製造方法については特に制
限はなく、従来、ポリアミド樹脂の製造において慣用さ
れている方法、例えば通常ジアミンとジカルボン酸とか
ら成るナイロン塩又はその水溶液に必要に応じてラクタ
ムを加え、いわゆる溶融重合法によって製造されるが、
イソフタル酸とテレフタル酸との組成によっては溶液重
合法又は界面重合法によっても製造することができる。There are no particular restrictions on the method for producing the polyamide resin (A), and a method conventionally used in the production of polyamide resins can be used, for example, adding a lactam to a nylon salt or an aqueous solution thereof usually consisting of a diamine and a dicarboxylic acid. In addition, it is manufactured by the so-called melt polymerization method,
Depending on the composition of isophthalic acid and terephthalic acid, it can also be produced by a solution polymerization method or an interfacial polymerization method.
このイソフタル酸とテレフタル酸の組成については特に
制限はなく、任意の割合がとられるが、特に(A)ポリ
アミド樹脂に占める(b)の脂肪族ポリアミド形成単位
の割合が小さい場合、テレフタル酸の割合が大きいと得
られるポリアミド樹脂の融点が300℃以上となり、(
B)脂肪族ポリアミド樹脂との積層が困難となるので、
テレフタル酸を50重量%以下とするのが望ましい。通
常はイソフタル酸とテレフタル酸とは、重量比20 :
80ないし80 : 20の割合で用いられる。There are no particular restrictions on the composition of this isophthalic acid and terephthalic acid, and any ratio can be taken, but especially when the ratio of the aliphatic polyamide forming units of (b) in the polyamide resin (A) is small, the ratio of terephthalic acid If the temperature is large, the melting point of the resulting polyamide resin will be 300°C or higher, and (
B) Lamination with aliphatic polyamide resin becomes difficult, so
It is desirable that the content of terephthalic acid be 50% by weight or less. Usually, the weight ratio of isophthalic acid and terephthalic acid is 20:
It is used in a ratio of 80 to 80:20.
この(A)ポリアミド樹脂は1種用いてもよいし、2種
以上を組み合わせて用いてもよい。One type of polyamide resin (A) may be used, or two or more types may be used in combination.
本発明の積層フィルムにおいては、中間層として、(B
)脂肪族ポリアミド樹脂が用いられる。In the laminated film of the present invention, (B
) Aliphatic polyamide resin is used.
この脂肪族ポリアミド樹脂としては、ε−カプロラクタ
ム単位を含むポリアミド、例えばナイロン−6、ナイロ
ン−6/6.6共重合体、ナイロン−6/6.10共重
合体など、又は脂肪族ジアミンと脂肪族ジカルボン酸と
から成るポリアミド、例えばナイロン−6,6、ナイロ
ン−6,10などを挙げることができる。このうち、成
形性などの点からみて、C−カプロラクタム単位を含む
ポリアミド、すなわちナイロン−6又はその共重合体が
特に好ましい。これらの(B)脂肪族ポリアミド樹脂は
1種用いてもよいし、2種以上を組み合わせて用いても
よい。Examples of the aliphatic polyamide resin include polyamides containing ε-caprolactam units, such as nylon-6, nylon-6/6.6 copolymer, nylon-6/6.10 copolymer, etc., or aliphatic diamine and aliphatic Examples include polyamides comprising dicarboxylic acids of the group A, such as nylon-6,6 and nylon-6,10. Among these, polyamides containing C-caprolactam units, ie, nylon-6 or copolymers thereof, are particularly preferred from the viewpoint of moldability. These (B) aliphatic polyamide resins may be used alone or in combination of two or more.
本発明の積層フィルムの製造方法については特に制限は
なく、例えば前記樹脂を用いて熱接着法、押出又はドラ
イラミネーシぎン法、共押出法などの積層法によって製
造することができるが、特に共押出法が好適である。There are no particular restrictions on the method for producing the laminated film of the present invention, and for example, it can be produced using the above-mentioned resin by a lamination method such as a thermal bonding method, an extrusion or dry lamination method, or a coextrusion method. Coextrusion methods are preferred.
この共押出成形は、通常の空冷インフレーション法によ
って行われる。例えば、円筒状の大型ダイを用い、溶融
したポリマーを2種3層の共押出法により、チューブ状
にすると同時に、内部に空気を送り込んで、徐々に所定
の幅まで膨張させたのち、自然冷却又は空気を吹きつけ
て冷却し、引取機のニップロールにはさんで引取ること
により、該積層フィルムを製造することができる。This coextrusion molding is performed by a conventional air-cooled inflation method. For example, using a large cylindrical die, molten polymer is formed into a tube by co-extrusion of two types and three layers. At the same time, air is pumped inside to gradually expand it to a predetermined width, and then it is naturally cooled. Alternatively, the laminated film can be produced by blowing air to cool the film, and then taking it between nip rolls of a taking machine.
本発明の積層フィルムにおいては、該中間層は1層であ
ってもよいし、2層以上の多層であってもよい。また本
発明の積層フィルムの厚みは、通常2〜100.#m、
好ましくは55−50pの範囲で選ばれ、外層及び内層
の厚みは、それぞれ通常0.5〜40pmの範囲で選ば
れる。また、中間層の厚みは1〜50μmの範囲である
のが望ましい。In the laminated film of the present invention, the intermediate layer may be one layer or may be a multilayer of two or more layers. Further, the thickness of the laminated film of the present invention is usually 2 to 100. #m,
The thickness of the outer layer and the inner layer are preferably selected within the range of 0.5 to 40 pm. Further, it is desirable that the thickness of the intermediate layer is in the range of 1 to 50 μm.
このようにして得られた本発明の積層フィルムは、ポリ
アミド樹脂フィルムが本来有する耐熱性、耐油性、耐寒
性、耐衝撃性などの優れた性質を保持するとともに、透
明性、ガスバリヤ−性及び食品衛生上の安全性にも優れ
るなどの特徴を有し、例えば食品などの包装用フィルム
として好適に用いられる。The thus obtained laminated film of the present invention retains the excellent properties originally possessed by polyamide resin films such as heat resistance, oil resistance, cold resistance, and impact resistance, while also maintaining transparency, gas barrier properties, and food-friendly properties. It has characteristics such as excellent hygiene safety, and is suitable for use as a packaging film for foods, for example.
[実施例]
次に、実施例により本発明をさらに詳細に説明するが、
本発明はこれらの例によってなんら限定されるものでは
ない。[Example] Next, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited in any way by these examples.
なお、フィルムの物性は次のようにして求めた。The physical properties of the film were determined as follows.
(1)ヘイズ値
JISK−6714に準拠し、ヘイズメーターにより測
定しI;。(1) Haze value I; measured using a haze meter in accordance with JISK-6714.
(2)酸素透過量
JIS Z−1707に準拠し、23℃、100%R
Hの条件で測定した。(2) Oxygen permeation amount Based on JIS Z-1707, 23℃, 100%R
Measured under H conditions.
実施例及び比較例で用いたポリアミド(A)及びポリア
ミド(B)は以下の通りである。The polyamides (A) and polyamides (B) used in Examples and Comparative Examples are as follows.
ポリアミド(A):三菱化成(株)製、商品名ニッパミ
ツドX21SO7
(ヘキサメチレンジアミンとイン7タル酸/テレフタル
酸−2/lのコポリアミド)ポリアミド(B)二三菱化
成(株)製、商品名ニッパミツド1030
(ナイロン−6)
実施例1
円筒状大型ダイ共押出多層インフレーション装置を用い
て、第1表に示す樹脂を2台の押出機より成形温度25
0°Cで同時押出し、ブロー比2,0、引取速度22m
/分の条件で成膜して、外層[ポリアミド(A)] /
中間層[ポリアミド(B)]/内層[ポリアミド(A)
1から成る多層フィルム(フィルム厚み8μm/9μm
/8μm)を製造した。このようにして得られたポリア
ミド樹脂積層フィルムのヘイズ値及び酸素透過量を求め
た。その結果を第2表に示す。Polyamide (A): Manufactured by Mitsubishi Kasei Co., Ltd., product name: Nippa Mid X21SO7 (Copolyamide of hexamethylene diamine and in7-thalic acid/terephthalic acid -2/l) Polyamide (B) 2, manufactured by Mitsubishi Kasei Co., Ltd., product Nipper Mid 1030 (Nylon-6) Example 1 Using a large cylindrical die coextrusion multilayer inflation device, the resins shown in Table 1 were molded with two extruders at a temperature of 25
Simultaneous extrusion at 0°C, blow ratio 2.0, take-up speed 22m
The outer layer [polyamide (A)] /
Intermediate layer [polyamide (B)]/inner layer [polyamide (A)]
A multilayer film consisting of 1 (film thickness 8 μm/9 μm
/8 μm) was manufactured. The haze value and oxygen permeation amount of the polyamide resin laminate film thus obtained were determined. The results are shown in Table 2.
実施例2
実施例1において、多層フィルムの各層の厚みを5μm
/15μm15μmに変えたこと以外は、実施例1と同
様にしてポリアミド樹脂積層フィルムを製造した。その
結果を第2表に示す。Example 2 In Example 1, the thickness of each layer of the multilayer film was 5 μm.
/15 μm A polyamide resin laminate film was produced in the same manner as in Example 1 except that the thickness was changed to 15 μm. The results are shown in Table 2.
比較例1
実施例1において、ポリアミド(B)のみを用いた以外
は、実施例1と同様にして厚さ25μmのポリアミド樹
脂単層フィルムを製造した。その結果を第2表に示す。Comparative Example 1 A polyamide resin single layer film having a thickness of 25 μm was produced in the same manner as in Example 1 except that only polyamide (B) was used. The results are shown in Table 2.
(以下余白)
第
表
第
表
[発明の効果]
本発明によると、特定のポリアミド樹脂を用い、少なく
とも3111から成る外層/中間層/内層の多層構造と
することにより、ポリアミド樹脂フィルムが本来有する
耐熱性、耐油性、耐寒性、耐衝撃性などの優れl;特性
を損なうことなく、透明性、ガスバリヤ−性及び食品衛
生上の安全性にも優れたポリアミド樹脂積層フィルムが
容易に得られる。(Margins below) Table 1 [Effects of the Invention] According to the present invention, by using a specific polyamide resin and forming a multilayer structure of an outer layer/intermediate layer/inner layer consisting of at least 3111, the polyamide resin film has inherent heat resistance. It is possible to easily obtain a polyamide resin laminate film having excellent properties such as hardness, oil resistance, cold resistance, and impact resistance; and having excellent transparency, gas barrier property, and food hygiene safety without impairing the properties.
本発明のポリアミド樹脂積層フィルムは、前記のような
優れた特徴を有することから、例えば食品などの包装用
フィルムとして好適に用いられる。Since the polyamide resin laminate film of the present invention has the above-mentioned excellent characteristics, it can be suitably used as a packaging film for foods, for example.
Claims (1)
層の構造を有する多層フィルムであって、該外層及び内
層が、(A)(a)脂肪酸ジアミンとイソフタル酸及び
/又はテレフタル酸とから成る芳香族ポリアミド形成単
位置0〜100重量%と、(b)ラクタム又は脂肪族ジ
アミンと脂肪族ジカルボン酸とから成る脂肪族ポリアミ
ド形成単位90〜0重量%とから成るポリアミド樹脂か
ら構成され、かつ中間層が(B)脂肪族ポリアミド樹脂
から構成されることを特徴とするポリアミド樹脂積層フ
ィルム。 2 多層インフレーション法により得られた、少なくと
も3層の樹脂層から成る外層/中間層/内層の構造を有
する多層フィルムであって、該外層及び内層が、(A)
(a)脂肪酸ジアミンとイソフタル酸及び/又はテレフ
タル酸とから成る芳香族ポリアミド形成単位置0〜10
0重量%と、(b)ラクタム又は脂肪族ジアミンと脂肪
族ジカルボン酸とから成る脂肪族ポリアミド形成単位9
0〜0重量%とから成るポリアミド樹脂から構成され、
かつ中間層が(B)ε−カプロラクタム単位を含む脂肪
族ポリアミド樹脂から構成されることを特徴とするポリ
アミド樹脂積層フィルム。[Scope of Claims] 1 A multilayer film having an outer layer/middle layer/inner layer structure consisting of at least three resin layers, the outer layer and the inner layer comprising (A) (a) fatty acid diamine, isophthalic acid, and/or or terephthalic acid, and (b) a polyamide resin consisting of 90 to 0% by weight of aliphatic polyamide-forming units consisting of a lactam or aliphatic diamine and an aliphatic dicarboxylic acid. 1. A polyamide resin laminate film comprising: and an intermediate layer comprising (B) an aliphatic polyamide resin. 2 A multilayer film obtained by a multilayer inflation method and having an outer layer/middle layer/inner layer structure consisting of at least three resin layers, the outer layer and the inner layer comprising (A)
(a) Aromatic polyamide formation consisting of fatty acid diamine and isophthalic acid and/or terephthalic acid with single positions 0 to 10
0% by weight, and (b) an aliphatic polyamide forming unit 9 consisting of a lactam or an aliphatic diamine and an aliphatic dicarboxylic acid.
It is composed of a polyamide resin consisting of 0 to 0% by weight,
A polyamide resin laminate film characterized in that the intermediate layer is composed of (B) an aliphatic polyamide resin containing ε-caprolactam units.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28529489A JP2903161B2 (en) | 1989-11-01 | 1989-11-01 | Polyamide resin laminated film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28529489A JP2903161B2 (en) | 1989-11-01 | 1989-11-01 | Polyamide resin laminated film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03146343A true JPH03146343A (en) | 1991-06-21 |
JP2903161B2 JP2903161B2 (en) | 1999-06-07 |
Family
ID=17689662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28529489A Expired - Fee Related JP2903161B2 (en) | 1989-11-01 | 1989-11-01 | Polyamide resin laminated film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2903161B2 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0527237A1 (en) * | 1991-02-28 | 1993-02-17 | Mitsubishi Chemical Corporation | Biaxially oriented polyamide laminate film |
WO1995007180A1 (en) * | 1993-09-07 | 1995-03-16 | Alliedsignal Inc. | Retortable polymeric films |
EP0960903A2 (en) * | 1998-05-26 | 1999-12-01 | Toyo Boseki Kabushiki Kaisha | Polyamide film and polyamide laminate film |
JPH11334007A (en) * | 1998-05-27 | 1999-12-07 | Toyobo Co Ltd | Laminate polyamide film |
JP2000202967A (en) * | 1999-01-14 | 2000-07-25 | Toyobo Co Ltd | Laminated polyamide film |
JP2000238219A (en) * | 1999-02-24 | 2000-09-05 | Toyobo Co Ltd | Laminated polyamide resin film |
ES2149053A1 (en) * | 1995-09-13 | 2000-10-16 | Mitsubischi Chemical Corp | Random copolymerized polyamide resin and process for preparing the same |
JP2002307626A (en) * | 2001-04-18 | 2002-10-23 | Kureha Chem Ind Co Ltd | Nylon 6 type multilayered casing film |
EP1314550A4 (en) * | 2000-08-22 | 2004-11-03 | Toyo Boseki | Laminated biaxially-oriented polyamide film and process for producing the same |
JP2007502728A (en) * | 2003-08-19 | 2007-02-15 | ソルヴェイ アドバンスド ポリマーズ リミテッド ライアビリティ カンパニー | Polyamide film with improved impact resistance |
CN105985634A (en) * | 2015-03-17 | 2016-10-05 | 赢创德固赛有限公司 | Multilayer composite comprising an EVOH layer |
KR20190127379A (en) * | 2018-05-04 | 2019-11-13 | 주식회사 엘지화학 | Polyamide film laminate |
-
1989
- 1989-11-01 JP JP28529489A patent/JP2903161B2/en not_active Expired - Fee Related
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0527237A1 (en) * | 1991-02-28 | 1993-02-17 | Mitsubishi Chemical Corporation | Biaxially oriented polyamide laminate film |
WO1995007180A1 (en) * | 1993-09-07 | 1995-03-16 | Alliedsignal Inc. | Retortable polymeric films |
ES2149053A1 (en) * | 1995-09-13 | 2000-10-16 | Mitsubischi Chemical Corp | Random copolymerized polyamide resin and process for preparing the same |
US6376093B1 (en) | 1998-05-26 | 2002-04-23 | Toyo Boseki Kabushiki Kaisha | Polyamide film and polyamide laminate film |
EP0960903A2 (en) * | 1998-05-26 | 1999-12-01 | Toyo Boseki Kabushiki Kaisha | Polyamide film and polyamide laminate film |
EP1439202A1 (en) * | 1998-05-26 | 2004-07-21 | Toyo Boseki Kabushiki Kaisha | Polyamide film and polyamide laminate film |
EP0960903A3 (en) * | 1998-05-26 | 2000-12-06 | Toyo Boseki Kabushiki Kaisha | Polyamide film and polyamide laminate film |
JPH11334007A (en) * | 1998-05-27 | 1999-12-07 | Toyobo Co Ltd | Laminate polyamide film |
JP2000202967A (en) * | 1999-01-14 | 2000-07-25 | Toyobo Co Ltd | Laminated polyamide film |
JP4654470B2 (en) * | 1999-01-14 | 2011-03-23 | 東洋紡績株式会社 | Laminated polyamide film |
JP2000238219A (en) * | 1999-02-24 | 2000-09-05 | Toyobo Co Ltd | Laminated polyamide resin film |
JP4660867B2 (en) * | 1999-02-24 | 2011-03-30 | 東洋紡績株式会社 | Laminated polyamide resin film |
EP1314550A4 (en) * | 2000-08-22 | 2004-11-03 | Toyo Boseki | Laminated biaxially-oriented polyamide film and process for producing the same |
US7189347B2 (en) | 2000-08-22 | 2007-03-13 | Toyo Boseki Kabushiki Kaisha | Laminated biaxially-oriented polyamide film and process for producing the same |
JP2002307626A (en) * | 2001-04-18 | 2002-10-23 | Kureha Chem Ind Co Ltd | Nylon 6 type multilayered casing film |
JP2007502728A (en) * | 2003-08-19 | 2007-02-15 | ソルヴェイ アドバンスド ポリマーズ リミテッド ライアビリティ カンパニー | Polyamide film with improved impact resistance |
CN105985634A (en) * | 2015-03-17 | 2016-10-05 | 赢创德固赛有限公司 | Multilayer composite comprising an EVOH layer |
CN105985634B (en) * | 2015-03-17 | 2019-11-26 | 赢创德固赛有限公司 | MULTILAYER COMPOSITE part comprising evoh layer |
KR20190127379A (en) * | 2018-05-04 | 2019-11-13 | 주식회사 엘지화학 | Polyamide film laminate |
Also Published As
Publication number | Publication date |
---|---|
JP2903161B2 (en) | 1999-06-07 |
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