JPH031431U - - Google Patents
Info
- Publication number
- JPH031431U JPH031431U JP5881489U JP5881489U JPH031431U JP H031431 U JPH031431 U JP H031431U JP 5881489 U JP5881489 U JP 5881489U JP 5881489 U JP5881489 U JP 5881489U JP H031431 U JPH031431 U JP H031431U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- view
- utility
- semiconductor chip
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5881489U JPH031431U (de) | 1989-05-22 | 1989-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5881489U JPH031431U (de) | 1989-05-22 | 1989-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031431U true JPH031431U (de) | 1991-01-09 |
Family
ID=31584766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5881489U Pending JPH031431U (de) | 1989-05-22 | 1989-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031431U (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005296484A (ja) * | 2004-04-15 | 2005-10-27 | Takahane Akihiko | 足指を甲被から個別に突き出すことを可能とした履物 |
| JP2014022576A (ja) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | 半導体素子実装部材及び半導体装置 |
| JP2016184756A (ja) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |
-
1989
- 1989-05-22 JP JP5881489U patent/JPH031431U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005296484A (ja) * | 2004-04-15 | 2005-10-27 | Takahane Akihiko | 足指を甲被から個別に突き出すことを可能とした履物 |
| JP4504725B2 (ja) * | 2004-04-15 | 2010-07-14 | 高羽 昭彦 | 足指を甲被から個別に突き出すことを可能とした履物 |
| JP2014022576A (ja) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | 半導体素子実装部材及び半導体装置 |
| JP2016184756A (ja) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |