JPH0313775U - - Google Patents
Info
- Publication number
- JPH0313775U JPH0313775U JP7586389U JP7586389U JPH0313775U JP H0313775 U JPH0313775 U JP H0313775U JP 7586389 U JP7586389 U JP 7586389U JP 7586389 U JP7586389 U JP 7586389U JP H0313775 U JPH0313775 U JP H0313775U
- Authority
- JP
- Japan
- Prior art keywords
- side wall
- plate
- protruding
- protruding plate
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000007796 conventional method Methods 0.000 description 2
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989075863U JPH0717175Y2 (ja) | 1989-06-27 | 1989-06-27 | 筐体固定装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989075863U JPH0717175Y2 (ja) | 1989-06-27 | 1989-06-27 | 筐体固定装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0313775U true JPH0313775U (da) | 1991-02-12 |
| JPH0717175Y2 JPH0717175Y2 (ja) | 1995-04-19 |
Family
ID=31616819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989075863U Expired - Lifetime JPH0717175Y2 (ja) | 1989-06-27 | 1989-06-27 | 筐体固定装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717175Y2 (da) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8872329B1 (en) | 2009-01-09 | 2014-10-28 | Amkor Technology, Inc. | Extended landing pad substrate package structure and method |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US8482134B1 (en) | 2010-11-01 | 2013-07-09 | Amkor Technology, Inc. | Stackable package and method |
| US8557629B1 (en) | 2010-12-03 | 2013-10-15 | Amkor Technology, Inc. | Semiconductor device having overlapped via apertures |
| US8633598B1 (en) | 2011-09-20 | 2014-01-21 | Amkor Technology, Inc. | Underfill contacting stacking balls package fabrication method and structure |
| US9029962B1 (en) | 2011-10-12 | 2015-05-12 | Amkor Technology, Inc. | Molded cavity substrate MEMS package fabrication method and structure |
| US9799592B2 (en) | 2013-11-19 | 2017-10-24 | Amkor Technology, Inc. | Semicondutor device with through-silicon via-less deep wells |
| KR101366461B1 (ko) | 2012-11-20 | 2014-02-26 | 앰코 테크놀로지 코리아 주식회사 | 반도체 디바이스 및 그 제조 방법 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61138280U (da) * | 1985-02-19 | 1986-08-27 | ||
| JPS6367284U (da) * | 1986-10-22 | 1988-05-06 |
-
1989
- 1989-06-27 JP JP1989075863U patent/JPH0717175Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61138280U (da) * | 1985-02-19 | 1986-08-27 | ||
| JPS6367284U (da) * | 1986-10-22 | 1988-05-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0717175Y2 (ja) | 1995-04-19 |