JPS6186946U - - Google Patents
Info
- Publication number
- JPS6186946U JPS6186946U JP17213584U JP17213584U JPS6186946U JP S6186946 U JPS6186946 U JP S6186946U JP 17213584 U JP17213584 U JP 17213584U JP 17213584 U JP17213584 U JP 17213584U JP S6186946 U JPS6186946 U JP S6186946U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- electronic component
- spring material
- mounting device
- positioning portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17213584U JPS6186946U (da) | 1984-11-13 | 1984-11-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17213584U JPS6186946U (da) | 1984-11-13 | 1984-11-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6186946U true JPS6186946U (da) | 1986-06-07 |
Family
ID=30729810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17213584U Pending JPS6186946U (da) | 1984-11-13 | 1984-11-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6186946U (da) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007273860A (ja) * | 2006-03-31 | 2007-10-18 | Icom Inc | 半導体素子固定用クリップ |
-
1984
- 1984-11-13 JP JP17213584U patent/JPS6186946U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007273860A (ja) * | 2006-03-31 | 2007-10-18 | Icom Inc | 半導体素子固定用クリップ |