JPH0313749U - - Google Patents
Info
- Publication number
- JPH0313749U JPH0313749U JP1989075880U JP7588089U JPH0313749U JP H0313749 U JPH0313749 U JP H0313749U JP 1989075880 U JP1989075880 U JP 1989075880U JP 7588089 U JP7588089 U JP 7588089U JP H0313749 U JPH0313749 U JP H0313749U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- solder
- heat transfer
- heat
- solder sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989075880U JPH0313749U (https=) | 1989-06-27 | 1989-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989075880U JPH0313749U (https=) | 1989-06-27 | 1989-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313749U true JPH0313749U (https=) | 1991-02-12 |
Family
ID=31616851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989075880U Pending JPH0313749U (https=) | 1989-06-27 | 1989-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313749U (https=) |
-
1989
- 1989-06-27 JP JP1989075880U patent/JPH0313749U/ja active Pending
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