JPH0313703B2 - - Google Patents

Info

Publication number
JPH0313703B2
JPH0313703B2 JP59161545A JP16154584A JPH0313703B2 JP H0313703 B2 JPH0313703 B2 JP H0313703B2 JP 59161545 A JP59161545 A JP 59161545A JP 16154584 A JP16154584 A JP 16154584A JP H0313703 B2 JPH0313703 B2 JP H0313703B2
Authority
JP
Japan
Prior art keywords
substrate
substrate holder
thin wire
heat
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59161545A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6142843A (ja
Inventor
Muneharu Komya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP59161545A priority Critical patent/JPS6142843A/ja
Publication of JPS6142843A publication Critical patent/JPS6142843A/ja
Publication of JPH0313703B2 publication Critical patent/JPH0313703B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
JP59161545A 1984-08-02 1984-08-02 基板の冷却装置 Granted JPS6142843A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59161545A JPS6142843A (ja) 1984-08-02 1984-08-02 基板の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59161545A JPS6142843A (ja) 1984-08-02 1984-08-02 基板の冷却装置

Publications (2)

Publication Number Publication Date
JPS6142843A JPS6142843A (ja) 1986-03-01
JPH0313703B2 true JPH0313703B2 (enExample) 1991-02-25

Family

ID=15737138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59161545A Granted JPS6142843A (ja) 1984-08-02 1984-08-02 基板の冷却装置

Country Status (1)

Country Link
JP (1) JPS6142843A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244820A (en) * 1990-03-09 1993-09-14 Tadashi Kamata Semiconductor integrated circuit device, method for producing the same, and ion implanter for use in the method
DE10344492B4 (de) 2003-09-24 2006-09-07 Carl Zeiss Nts Gmbh Teilchenstrahlgerät
US8945749B2 (en) * 2011-12-15 2015-02-03 GM Global Technology Operations LLC Carbon fiber thermal interface for cooling module assembly

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60236223A (ja) * 1984-05-10 1985-11-25 Ulvac Corp 基板の冷却装置

Also Published As

Publication number Publication date
JPS6142843A (ja) 1986-03-01

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