JPH0313282B2 - - Google Patents

Info

Publication number
JPH0313282B2
JPH0313282B2 JP260586A JP260586A JPH0313282B2 JP H0313282 B2 JPH0313282 B2 JP H0313282B2 JP 260586 A JP260586 A JP 260586A JP 260586 A JP260586 A JP 260586A JP H0313282 B2 JPH0313282 B2 JP H0313282B2
Authority
JP
Japan
Prior art keywords
wire
powder
diamond
metal
metal body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP260586A
Other languages
Japanese (ja)
Other versions
JPS62161901A (en
Inventor
Teruyuki Murai
Yoshihiro Hashimoto
Takao Kawakita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP260586A priority Critical patent/JPS62161901A/en
Publication of JPS62161901A publication Critical patent/JPS62161901A/en
Publication of JPH0313282B2 publication Critical patent/JPH0313282B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185Saw wires; Saw cables; Twisted saw strips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00Making tools for sawing machines or sawing devices for use in cutting any kind of material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

(産業上の利用分野) 本発明は硬質材料等の切断、或いは面取り加工
用の金属ワイヤ、更に詳しくは表面層に均一、か
つ強固にダイヤモンド粉末を配列保持するダイヤ
モンド粉末ワイヤの製造方法に関する。 (従来の技術) 近年、セラミツクや硬質材料、或いはシリコ
ン、ガリウム砒素等の半導体材料の切断、さらに
は金属加工材の微細通孔内の面取加工などに金属
ワイヤ(以下ワイヤという)を用いることが検討
実施されている。 そして、それに用いるワイヤとしては、従来よ
り非常に強度の高い高張力線材、所謂、ソーワイ
ヤが使用されているが、この場合、その切断等の
加工はワイヤと被加工材との間に遊離砥粒を介在
せしめ、研削作用は摩擦力によつてのみ行われる
ことから、加工効率が悪いという問題がある。ま
た、切断の場合、被切断材とワイヤとの間に高電
圧をかけ、その間での放電によつて切断する、所
謂、放電ワイヤカツトと称される方法があるが、
この方法では被切断部材が導電性を有する材料の
みに限定されるという問題がある。 そのために最近では線材表面にダイヤモンドの
粉末をメツキ法によりコーテイングしたダイヤモ
ンドワイヤが新たに開発され、該ワイヤを用いて
表面のダイヤモンド粉末の研削力により効率よく
加工する方法が検討され始めてきたが、この方法
においても、主としてCuメツキやNiメツキによ
りワイヤ表面に単に付着されているのみのダイヤ
モンド粉末は付着力が弱く、かつワイヤの表面全
周に亘つての均一な配列形成が困難であることか
ら、通常のダイヤモンド砥石製造技術を応用し
て、ダイヤモンドワイヤの製造に際し、Ni、Cu
等通常のボンド金属粉末にダイヤモンド粉末を混
入し該混合材をワイヤ表面全周に亘り焼結固定す
る方法も想起される所である。 (発明が解決しようとする問題点) しかしながら、上記ボンド金属粉末を用い、こ
れに混入したダイヤモンド粉末をワイヤの表面全
周に亘つて焼結固定せしめることが、確かに理想
的な方法ではあるとしても、現時点においては、
先ず、このような長尺、細物のワイヤを通常の焼
結方法で製造することはおよそ、不可能である。
いつぽう現在銅やアルミ被覆鋼線等のような二重
構造の線は一般的に用いられているが本発明が目
的とするような(ダイヤモンド+金属)−鋼線を
単なる二重構造鋼線であるとして従来の二重構造
線製造技術をそのまま適用し製線するとしても、
例えば伸線工程においてダイヤモンド粉末は伸線
用ダイスを甚しく攻撃、摩耗せしめることから、
実用的にみて従来技術による伸線加工は不可能で
ある。 本発明は、以上の点に鑑み、更にダイヤモンド
粉末の効果的な付着手段を見出すことにより、前
記従来の固定法に比し、表面層内に均一かつより
強固にダイヤモンド粉末が配列保持されたダイヤ
モンドワイヤを容易に製造することができる新規
な方法を提供することを目的とするものである。 (問題点を解決するための手段) 上記の目的を達成するための本発明の手段を、
実施例に対応する第1〜3図を用いて説明する
と、本発明は、ダイヤモンドワイヤの製造方法に
おいて、先ず、外周部1と中心部2との間に間隙
Sを設けた所要寸法の円筒状金属体Aの前記間隙
S内に金属粉末4とダイヤモンド粉末3との混合
粉末Dを充填してから上記金属体Aの両端を密閉
したものを予め製造する。 第1図は上記金属体Aの構造を示す模式図で、
aはその上面図、bは同側面図である。 次に、上記両端を密閉した金属体Aを既知の熱
間押出し又は熱間圧延より選ばれる熱間加工を施
した後、更に熱処理と冷間加工とを繰返して伸線
し、所要線径の線材とする。第3図bはその断面
の金属組織の一例を示す顕微鏡写真である。 更に、上記線材の最外層として残存している前
記金属体Aの外周部1金属を研摩又は酸洗等によ
り除去することにより第2図に示すような焼結さ
れた金属層4′内にダイヤモンド粉末3が均一に
保持されてなる混合層D′が線材最表面層として
顕出しているダイヤモンドワイヤを得るに至る。 第3図aは本発明の方法により製造されたダイ
ヤモンドワイヤの表面の金属組織の一例を示す顕
微鏡写真である。 (作用) そして、本発明は前記の手段により、本発明方
法に用いる第1図に示す如き円筒状金属体Aが容
易に製作できるものであり、かつ、別構成となる
外周部1と中心部2であるから、その材質、寸法
も各種使用条件に適合する各種成分の同種、異種
金属を用いて適合寸法に形成することができる。 また、各種使用条件に適合せしめた混合比で予
め均質に混合した各種成分の金属粉末4とダイヤ
モンド粉末3よりなる混合粉末Dは、金属体Aの
間隙S内に充填密閉されているので熱間、冷間加
工を通じて充填時の混合比、均質性がそのまま保
持された状態で製線されることになる。また、混
交粉末Dの全外周には終始、金属体Aの外周部1
金属が被覆した状態で存在していることから、伸
線加工時における伸線用ダイスは上記外周部1金
属にのみ接触して延伸することになり、ダイヤモ
ンド粉末3と接触することはない。 かくして得られた所要線径の線材は、その最外
層が上記の通り延伸により薄肉化された外周部1
金属のみであるから、該金属を通常の研摩、酸洗
等によつて除去すると、第2図に示すようにその
下層にあつたダイヤモンド粉末3混入の混合層
D′が線材の最表面に顕出することになる。 (実施例) 以下、さらに具体的な実施例について説明す
る。 第1図は本発明に用いる円筒状金属体Aの構造
を示す模式図で、aはその上面図、bは同側断面
図である。 ここで用いる上記金属体Aの外周部1及び中心
部2の素材としては一般に炭素鋼を用いるが、使
用する条件によつてはステンレス鋼や銅合金等を
用いてもよく、また外周部1と中心部2の金属材
料の材質は各々異つてもよい。 なお、外周部1の厚さや中心部2の径、或いは
両者間に設ける間隙Sの幅等は使用する最終線材
の線径や充填するダイヤモンド粉末3の平均粒
度、更には金属粉末4内へのダイヤモンド粉末3
の混合比率に応じて適合決定される。 また、ダイヤモンド粉末3を混合する金属粉末
4は一般にNi粉末やNi基合金粉末が用いられて
いるが、これ以外にもCu粉末やCu基合金粉末な
ど通常のダイヤモンド工具製造に用いられている
金属粉末であつてもよい。 そして、混合粉末Dを充填し終えた金属体Aの
間隙S部の両端には適宜蓋材等を用いて蓋止溶接
して密閉した後、通常の熱間押出し又は熱間圧延
を施し、更に熱処理と冷間伸線加工とを繰返し施
すことによつて所要の線径の線材とする。 この際、熱間加工中に、内部に充填した金属粉
末4が外周部1や中心部2に拡散するのが好まし
くない場合には外周部1内面や、中心部2外周に
予め銅メツキ等を施して拡散防止用の層を作つて
おき、このメツキ層により拡散現象を防止するこ
とも可能である。 以下、更に本発明方法によりダイヤモンドワイ
ヤを製造する実施例を掲げる。 実施例 1 第1図に示す円筒状金属体Aの素材としては外
周部1にJIS−SS41鋼材、中心部2にはJIS−
SK7鋼材を用いた。このときの円筒状金属体Aの
寸法としては最外径70mmφ、外周部1の厚さ5
mm、間隙Sの幅8mmである。そして該間隙S内に
対し純Ni粉末と0.5重量%の炭素を混合したもの
に平均粒度150μmのダイヤモンド微粒3を体積
比で13%混合した混合粉末Dを充填した後、金属
体Aの両端の間隙S部を溶接密閉した。 その後1000℃で2時間加熱し、押出比15で押出
しを行つた。更に熱処理及び冷間伸線加工を繰返
し1.0mmφの線材とした。この時の引張強度は182
Kg/mm2であつた。第3図bはその断面の一例を示
す拡大写真である。 これを濃度35%の塩酸溶液中に15分間浸漬して
線材の最外層として残存する金属体A外周部1の
炭素鋼(SS41)を溶解除去しアルカリ溶液で中
和し洗浄した。第3図aはこのようにして製造し
たダイヤモンドワイヤの表面金属組織の一例を示
す顕微鏡写真であり、本発明方法によつて製造し
たダイヤモンドワイヤの外周面にはダイヤモンド
微粒3が均一に付着、埋設されていることがわか
る。 実施例 2 第1図に示す円筒状金属体Aの素材としては最
外周部1にJIS−SS41鋼材、中心部2にJIS−
SK7を用いた。このときの円筒状金属体Aの寸法
としては、最大径70mmφ、外周部1の厚さ10mm、
間隙Sの幅4mmである。そして該間隙S内に純
Ni粉末と0.5重量%の炭素を混合したものに平均
粒度15μmのダイヤモンド微粒3を体積比で10%
混合した混合粉末Dを充填した後、金属体Aの両
端の間隙S部を蓋止し溶接密閉した。 その後1000℃で2時間加熱し押出比15で押出し
を行つた。更に熱処理及び冷間伸線加工を繰り返
し0.2mmφの線材とした。この時の引張強度は207
Kg/mm2であつた。これを濃度35%の塩酸溶液中に
20分間浸漬して線材の最外層として残存する金属
体A外周部1の炭素鋼(SS41)を溶解除去し、
アルカリ溶液で中和し洗浄した。このようにして
製造したダイヤモンドワイヤは従来のメツキ法に
なる同線径のダイヤモンドワイヤに比し、後記第
1表の結果より明らかなようにダイヤモンド微粒
3のワイヤ表面での密着力が強く、切断スピード
を増加させることができると共に、著しく寿命が
長いものであつた。
(Field of Industrial Application) The present invention relates to a metal wire for cutting or chamfering hard materials, and more particularly to a method for manufacturing a diamond powder wire that holds diamond powder in a uniform and firm arrangement on the surface layer. (Prior art) In recent years, metal wires (hereinafter referred to as wires) have been used for cutting ceramics, hard materials, semiconductor materials such as silicon and gallium arsenide, and for chamfering microscopic holes in metal workpieces. are being considered and implemented. The wire used for this purpose is a so-called saw wire, which is a high-tensile wire rod with extremely high strength. Since the grinding action is performed only by frictional force, there is a problem of poor processing efficiency. In addition, in the case of cutting, there is a method called discharge wire cutting, in which a high voltage is applied between the material to be cut and the wire, and the cutting is performed by electric discharge between the material and the wire.
This method has a problem in that the member to be cut is limited to only conductive materials. To this end, a new diamond wire has recently been developed whose surface is coated with diamond powder using the plating method, and studies have begun to consider methods for efficiently processing the wire using the grinding force of the diamond powder on the surface. In this method, diamond powder that is simply attached to the wire surface mainly by Cu plating or Ni plating has weak adhesion and it is difficult to form a uniform array over the entire circumference of the wire surface. Applying normal diamond grinding wheel manufacturing technology, when manufacturing diamond wire, we use Ni, Cu,
A method in which diamond powder is mixed with ordinary bond metal powder and the mixed material is sintered and fixed over the entire circumference of the wire surface is also conceivable. (Problem to be Solved by the Invention) However, it is certainly an ideal method to use the bond metal powder described above and sinter and fix the diamond powder mixed therein over the entire surface of the wire. However, at present,
First, it is almost impossible to manufacture such a long and thin wire using a normal sintering method.
Currently, double-structured wires such as copper or aluminum-coated steel wires are commonly used, but the (diamond + metal)-steel wire as the object of the present invention can be replaced with a simple double-structured steel wire. Even if the conventional double-structured wire manufacturing technology is applied as is to make the wire,
For example, in the wire drawing process, diamond powder severely attacks and wears out the wire drawing dies.
From a practical point of view, wire drawing using conventional techniques is impossible. In view of the above points, and by further finding an effective means for adhering diamond powder, the present invention provides diamond powder that is arranged and held more uniformly and more firmly in the surface layer than in the conventional fixing method. The object of the present invention is to provide a new method that allows wires to be manufactured easily. (Means for solving the problems) The means of the present invention for achieving the above object are as follows:
To explain using FIGS. 1 to 3, which correspond to embodiments, the present invention is a method for manufacturing a diamond wire. A mixed powder D of metal powder 4 and diamond powder 3 is filled into the gap S of the metal body A, and then both ends of the metal body A are sealed. FIG. 1 is a schematic diagram showing the structure of the metal body A,
A is a top view thereof, and b is a side view thereof. Next, the metal body A with both ends sealed is subjected to hot working selected from known hot extrusion or hot rolling, and then heat treatment and cold working are repeated to draw the wire to obtain the required wire diameter. Use it as a wire rod. FIG. 3b is a micrograph showing an example of the metal structure of the cross section. Furthermore, by removing the outer peripheral part 1 metal of the metal body A remaining as the outermost layer of the wire rod by polishing or pickling, diamonds are formed in the sintered metal layer 4' as shown in FIG. A diamond wire is obtained in which a mixed layer D' in which the powder 3 is uniformly held is exposed as the outermost layer of the wire. FIG. 3a is a micrograph showing an example of the metal structure of the surface of a diamond wire produced by the method of the present invention. (Function) The present invention allows the cylindrical metal body A as shown in FIG. 2, its material and dimensions can be formed to suit various usage conditions using the same or different metals with various components. In addition, the mixed powder D consisting of the metal powder 4 of various components and the diamond powder 3 homogeneously mixed in advance at a mixing ratio adapted to various usage conditions is filled and sealed in the gap S of the metal body A, so that it can be heated. Through cold working, the wire is manufactured while maintaining the mixing ratio and homogeneity during filling. Also, the entire outer circumference of the mixed powder D is covered with the outer circumference 1 of the metal body A.
Since the metal exists in a coated state, the wire drawing die during wire drawing comes into contact only with the outer peripheral part 1 metal and does not come into contact with the diamond powder 3. The wire rod having the required wire diameter thus obtained has an outer peripheral portion 1 whose outermost layer is thinned by drawing as described above.
Since it is only metal, when the metal is removed by ordinary polishing, pickling, etc., a mixed layer containing diamond powder 3, which is in the lower layer, is removed as shown in Figure 2.
D' appears on the outermost surface of the wire. (Example) More specific examples will be described below. FIG. 1 is a schematic diagram showing the structure of a cylindrical metal body A used in the present invention, in which a is a top view and b is a sectional view of the same side. Carbon steel is generally used as the material for the outer periphery 1 and the center 2 of the metal body A used here, but depending on the conditions of use, stainless steel, copper alloy, etc. may also be used. The metal material of the center portion 2 may be different from each other. Note that the thickness of the outer peripheral part 1, the diameter of the central part 2, the width of the gap S between the two, etc. are determined by the wire diameter of the final wire used, the average particle size of the diamond powder 3 to be filled, and the amount of powder into the metal powder 4. diamond powder 3
The suitability is determined according to the mixing ratio of The metal powder 4 with which the diamond powder 3 is mixed is generally Ni powder or Ni-based alloy powder, but other metals such as Cu powder or Cu-based alloy powder are also used, such as Cu powder or Cu-based alloy powder. It may be a powder. Then, after filling the mixed powder D, both ends of the gap S of the metal body A are sealed by welding the gap using an appropriate cover material, etc., and then subjected to normal hot extrusion or hot rolling, and then By repeatedly performing heat treatment and cold wire drawing, a wire rod having a desired wire diameter is obtained. At this time, if it is undesirable for the metal powder 4 filled inside to diffuse into the outer periphery 1 and the center 2 during hot working, copper plating or the like is applied to the inner surface of the outer periphery 1 and the outer periphery of the center 2 in advance. It is also possible to prepare a layer for preventing diffusion by applying a plating layer, and then use this plating layer to prevent the diffusion phenomenon. Below, further examples of manufacturing diamond wires by the method of the present invention will be presented. Example 1 The material of the cylindrical metal body A shown in FIG.
Made of SK7 steel. The dimensions of the cylindrical metal body A at this time are the outermost diameter of 70 mmφ and the thickness of the outer peripheral part 1 of 5.
mm, and the width of the gap S is 8 mm. Then, after filling the gap S with mixed powder D, which is a mixture of pure Ni powder and 0.5% by weight of carbon and 13% by volume of diamond particles 3 with an average particle size of 150 μm, both ends of the metal body A are filled. The gap S was sealed by welding. Thereafter, the mixture was heated at 1000°C for 2 hours and extruded at an extrusion ratio of 15. Furthermore, heat treatment and cold wire drawing were repeated to obtain a wire rod with a diameter of 1.0 mm. The tensile strength at this time is 182
It was Kg/ mm2 . FIG. 3b is an enlarged photograph showing an example of the cross section. This was immersed in a hydrochloric acid solution with a concentration of 35% for 15 minutes to dissolve and remove the carbon steel (SS41) of the outer peripheral part 1 of the metal body A remaining as the outermost layer of the wire, neutralized with an alkaline solution, and washed. FIG. 3a is a micrograph showing an example of the surface metallographic structure of the diamond wire manufactured in this manner. I can see that it has been done. Example 2 The material of the cylindrical metal body A shown in FIG.
SK7 was used. The dimensions of the cylindrical metal body A at this time are a maximum diameter of 70 mmφ, a thickness of the outer peripheral part 1 of 10 mm,
The width of the gap S is 4 mm. Then, there is a net in the gap S.
Diamond particles 3 with an average particle size of 15 μm are added to a mixture of Ni powder and 0.5% by weight of carbon at a volume ratio of 10%.
After filling the mixed powder D, the gap S at both ends of the metal body A was covered and hermetically sealed by welding. Thereafter, it was heated at 1000°C for 2 hours and extruded at an extrusion ratio of 15. Furthermore, heat treatment and cold wire drawing were repeated to obtain a wire rod with a diameter of 0.2 mm. The tensile strength at this time is 207
It was Kg/ mm2 . Add this to a 35% hydrochloric acid solution.
The carbon steel (SS41) of the outer peripheral part 1 of the metal body A remaining as the outermost layer of the wire was dissolved and removed by immersion for 20 minutes.
It was neutralized and washed with an alkaline solution. The diamond wire manufactured in this way has a stronger adhesion force to the wire surface of the diamond particles 3, as is clear from the results in Table 1 below, compared to the diamond wire of the same wire diameter made by the conventional plating method, and In addition to being able to increase speed, it also had a significantly longer lifespan.

【表】 (発明の効果) 本発明は以上説明した如く、所要寸法に応じて
容易に形成できる円筒状金属体の外周部と中心部
との間の間隙内に、所要の成分、混合比になる金
属粉末とダイヤモンド粉末との混合粉末を充填密
閉したもので、その外周部は金属のみであるか
ら、従来の二重構造線製造技術をそのまま適用し
て加工してもダイヤモンド粉末が伸線ダイスを直
接攻撃する等の懸念は全くなく、従来の二重構造
鋼線と同様に所要線径に至るまで容易に伸線加工
することが可能となつた。 そして、線材の最表面層としてダイヤモンド粉
末の混入した混合層を顕出せしめる最終工程にお
いても、研摩或いは酸洗処理などを適用すること
により線材の表面に残存している金属を容易に除
去し得る。 しかも、間隙内に混合粉末を充填密閉した金属
体を直接既知の熱間押出し又は熱間圧延を施し、
更に熱処理と冷間伸線加工を繰返して所要線径の
線材とするものであるから、混合粉末中の金属粉
末が焼結されてなる金属層中には充填時の混合比
そのままにダイヤモンド粉末を均一、かつ強固に
配設保持せしめることができ、従来のメツキ法に
よるワイヤ表面にのみダイヤモンド粉末が付着さ
れているのみのものに比し切断速度を速くとるこ
とができると共に、ワイヤの寿命が長く、極めて
優れた切断用或いは面取加工用のダイヤモンドワ
イヤを容易に製造することができる。 またメツキ法によるものに比しベンデングに対
するダイヤモンド粉末の把持力も著しく大であ
る。
[Table] (Effects of the Invention) As explained above, the present invention allows the required components and mixing ratio to be mixed into the gap between the outer periphery and the center of the cylindrical metal body, which can be easily formed according to the required dimensions. It is filled and sealed with a mixed powder of metal powder and diamond powder, and the outer periphery is only metal, so even if the conventional double structure wire manufacturing technology is applied and processed, the diamond powder will not flow into the wire drawing die. There is no concern that the wire will be directly attacked, and it is now possible to easily draw the wire to the required wire diameter in the same way as conventional double-walled steel wire. Also, in the final step of exposing the mixed layer containing diamond powder as the outermost layer of the wire, metal remaining on the surface of the wire can be easily removed by applying polishing or pickling treatment. . Moreover, the metal body whose gap is filled with mixed powder and sealed is directly subjected to known hot extrusion or hot rolling,
Furthermore, heat treatment and cold wire drawing are repeated to obtain a wire rod of the required diameter, so the metal layer formed by sintering the metal powder in the mixed powder contains diamond powder at the same mixing ratio as when filling. The wire can be placed and held evenly and firmly, allowing for faster cutting speeds and a longer wire life than the conventional plating method in which diamond powder is only attached to the wire surface. , it is possible to easily produce extremely excellent diamond wire for cutting or chamfering. Furthermore, the gripping force of the diamond powder against bending is significantly greater than that obtained by the Metsuki method.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に用いる円筒状金属体の構造を
示す模式図でaはその上面図、bは同側断面図で
ある。第2図は本発明方法により製造されたダイ
ヤモンドワイヤの概念図を示し、第3図aは該ワ
イヤ表面の金属組織の一例を示す顕微鏡(倍率80
倍)写真であり、第3図bは本発明方法による製
造途中での線材(研摩、酸洗処理以前の)の断面
の金属組織の一例を示す顕微鏡(倍率80倍)写真
である。 A……円筒状金属体、S……金属体内の間隙、
D……混合分末、D′……混合層、1……金属体
の外周部、2……金属体の中心部、3……ダイヤ
モンド粉末、4……金属粉末、4′……金属層。
FIG. 1 is a schematic diagram showing the structure of a cylindrical metal body used in the present invention, in which a is a top view and b is a sectional view of the same side. Figure 2 shows a conceptual diagram of a diamond wire manufactured by the method of the present invention, and Figure 3a shows an example of the metal structure on the surface of the wire using a microscope (magnification: 80
FIG. 3b is a microscopic (80x magnification) photograph showing an example of the metal structure of a cross section of a wire rod (before polishing and pickling treatment) in the middle of production by the method of the present invention. A... Cylindrical metal body, S... Gap in the metal body,
D...Mixed powder, D'...Mixed layer, 1...Outer periphery of metal body, 2...Center of metal body, 3...Diamond powder, 4...Metal powder, 4'...Metal layer .

Claims (1)

【特許請求の範囲】 1 外周部と中心部との間に間隙を設けた所要寸
法の円筒状金属体の前記間隙内に、金属粉末とダ
イヤモンド粉末との混合粉末を充填し、次いで前
記粉末充填金属体の両端を密閉した後、熱間押出
し又は熱間圧延を施し、更に熱処理と冷間加工と
を繰返し施して線材となすとともに、該線材の最
外層として残存する外周部金属を機械的、化学的
方法により除去して線材表面に前記金属粉末とダ
イヤモンド粉末との混合層を顕出せしめることを
特徴とするダイヤモンドワイヤの製造方法。 2 円筒状金属体の外周部と中心部とが同種又は
異種の金属成分よりなる特許請求の範囲第1項記
載のダイヤモンドワイヤの製造方法。 3 冷間加工により抗張力を上昇せしめた高炭素
鋼線を芯線として有する特許請求の範囲第1項及
び第2項記載のダイヤモンドワイヤの製造方法。
[Scope of Claims] 1 A mixed powder of metal powder and diamond powder is filled into the gap of a cylindrical metal body of a required size with a gap provided between the outer periphery and the center, and then the powder filling is performed. After sealing both ends of the metal body, it is subjected to hot extrusion or hot rolling, and then subjected to repeated heat treatment and cold working to form a wire rod, and the outer peripheral metal remaining as the outermost layer of the wire rod is mechanically processed. A method for manufacturing a diamond wire, which comprises removing the metal powder and diamond powder by a chemical method to expose a mixed layer of the metal powder and diamond powder on the surface of the wire. 2. The method of manufacturing a diamond wire according to claim 1, wherein the outer circumference and center of the cylindrical metal body are made of the same or different metal components. 3. The method for manufacturing a diamond wire according to claims 1 and 2, which has a core wire made of a high carbon steel wire whose tensile strength has been increased by cold working.
JP260586A 1986-01-09 1986-01-09 Production of diamond wire Granted JPS62161901A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP260586A JPS62161901A (en) 1986-01-09 1986-01-09 Production of diamond wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP260586A JPS62161901A (en) 1986-01-09 1986-01-09 Production of diamond wire

Publications (2)

Publication Number Publication Date
JPS62161901A JPS62161901A (en) 1987-07-17
JPH0313282B2 true JPH0313282B2 (en) 1991-02-22

Family

ID=11534023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP260586A Granted JPS62161901A (en) 1986-01-09 1986-01-09 Production of diamond wire

Country Status (1)

Country Link
JP (1) JPS62161901A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0243825B1 (en) * 1986-04-17 1994-01-05 Sumitomo Electric Industries Limited Wire incrusted with abrasive grain and method for producing the same

Also Published As

Publication number Publication date
JPS62161901A (en) 1987-07-17

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