JPH03126073U - - Google Patents

Info

Publication number
JPH03126073U
JPH03126073U JP3547590U JP3547590U JPH03126073U JP H03126073 U JPH03126073 U JP H03126073U JP 3547590 U JP3547590 U JP 3547590U JP 3547590 U JP3547590 U JP 3547590U JP H03126073 U JPH03126073 U JP H03126073U
Authority
JP
Japan
Prior art keywords
double
sides
high current
sided high
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3547590U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3547590U priority Critical patent/JPH03126073U/ja
Publication of JPH03126073U publication Critical patent/JPH03126073U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
図−１ないし図−３はそれぞれ本考案に係る両
面大電流回路基板の実施例を示す断面図である。 １……絶縁基板、２ａ，２ｂ……厚肉回路導体
、３……穴、４……コ字形の導通金具、５……リ
ベツト形の導通金具。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板の両面に所定の回路パターンに形成さ
    れた大電流通電用の厚肉回路導体を有する両面大
    電流回路基板において、両面の厚肉回路導体を、
    絶縁基板に形成した穴を通して直接または他の導
    通金具を介して間接的に導通させたことを特徴と
    する両面大電流回路基板。
JP3547590U 1990-04-03 1990-04-03 Pending JPH03126073U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3547590U JPH03126073U (ja) 1990-04-03 1990-04-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3547590U JPH03126073U (ja) 1990-04-03 1990-04-03

Publications (1)

Publication Number Publication Date
JPH03126073U true JPH03126073U (ja) 1991-12-19

Family

ID=31540870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3547590U Pending JPH03126073U (ja) 1990-04-03 1990-04-03

Country Status (1)

Country Link
JP (1) JPH03126073U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005224053A (ja) * 2004-02-06 2005-08-18 Auto Network Gijutsu Kenkyusho:Kk 回路構成体
JP2007208083A (ja) * 2006-02-02 2007-08-16 Sumitomo Wiring Syst Ltd プリント基板
WO2011148638A1 (ja) * 2010-05-28 2011-12-01 タイコエレクトロニクスジャパン合同会社 電気コネクタ組立体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552282A (en) * 1978-10-13 1980-04-16 Kyoritsu Kogyo Circuit board and method of manufacturing same
JPS6386596A (ja) * 1986-09-30 1988-04-16 株式会社東芝 プリント配線基板
JPH01260885A (ja) * 1988-04-11 1989-10-18 Nitto Denko Corp 両面プリント基板の導体導通方法
JPH02122589A (ja) * 1988-10-31 1990-05-10 Toshiba Lighting & Technol Corp 回路基板
JPH0321095A (ja) * 1989-06-19 1991-01-29 Furukawa Electric Co Ltd:The 大電流回路基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552282A (en) * 1978-10-13 1980-04-16 Kyoritsu Kogyo Circuit board and method of manufacturing same
JPS6386596A (ja) * 1986-09-30 1988-04-16 株式会社東芝 プリント配線基板
JPH01260885A (ja) * 1988-04-11 1989-10-18 Nitto Denko Corp 両面プリント基板の導体導通方法
JPH02122589A (ja) * 1988-10-31 1990-05-10 Toshiba Lighting & Technol Corp 回路基板
JPH0321095A (ja) * 1989-06-19 1991-01-29 Furukawa Electric Co Ltd:The 大電流回路基板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005224053A (ja) * 2004-02-06 2005-08-18 Auto Network Gijutsu Kenkyusho:Kk 回路構成体
JP4584600B2 (ja) * 2004-02-06 2010-11-24 株式会社オートネットワーク技術研究所 回路構成体
JP2007208083A (ja) * 2006-02-02 2007-08-16 Sumitomo Wiring Syst Ltd プリント基板
WO2011148638A1 (ja) * 2010-05-28 2011-12-01 タイコエレクトロニクスジャパン合同会社 電気コネクタ組立体

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