JPS6255367U - - Google Patents

Info

Publication number
JPS6255367U
JPS6255367U JP14842385U JP14842385U JPS6255367U JP S6255367 U JPS6255367 U JP S6255367U JP 14842385 U JP14842385 U JP 14842385U JP 14842385 U JP14842385 U JP 14842385U JP S6255367 U JPS6255367 U JP S6255367U
Authority
JP
Japan
Prior art keywords
board
conductor
solder
copper foil
foils
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14842385U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14842385U priority Critical patent/JPS6255367U/ja
Publication of JPS6255367U publication Critical patent/JPS6255367U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の両面基板の一実施例を示す断
面図、第２図ａは第１図の両面基板の部品実装状
態を示す平面図、第２図ｂは同断面図、第３図は
従来のスルホール形両面基板の断面図、第４図は
従来のスルホール形両面基板の部品実装状態を示
す断面図、第５図は従来のスルホールを持たない
両面基板の断面図である。 １１……絶縁基板、１２ａ，１２ｂ……銅箔、
１３ａ，１３ｂ……貫通穴、１４……スズメツキ
線、１５ａ，１５ｂ……半田付け。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上に設けられた二つの貫通穴に渡つて、一
    定間隔で曲げられた導線を挿通し、導線の片端と
    基板の表側銅箔を半田付し、さらに導線の他の片
    端と基板の裏側銅箔を半田付して、前記表裏の銅
    箔間の電気的接続をするように構成したプリント
    基板。
JP14842385U 1985-09-27 1985-09-27 Pending JPS6255367U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14842385U JPS6255367U (ja) 1985-09-27 1985-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14842385U JPS6255367U (ja) 1985-09-27 1985-09-27

Publications (1)

Publication Number Publication Date
JPS6255367U true JPS6255367U (ja) 1987-04-06

Family

ID=31062677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14842385U Pending JPS6255367U (ja) 1985-09-27 1985-09-27

Country Status (1)

Country Link
JP (1) JPS6255367U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0479173A (ja) * 1990-07-23 1992-03-12 Matsushita Electric Ind Co Ltd 表裏箔接続部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552904A (en) * 1978-06-22 1980-01-10 Tokyo Shibaura Electric Co Reactor core element
JPS5511165U (ja) * 1978-07-10 1980-01-24
JPS5570087A (en) * 1978-11-20 1980-05-27 Matsushita Electric Ind Co Ltd Circuit board and method of manufacturing same
JPS5813369B2 (ja) * 1977-03-17 1983-03-14 住友ゴム工業株式会社 シ−ラント材料のタイヤ内面への圧着方法とその装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5813369B2 (ja) * 1977-03-17 1983-03-14 住友ゴム工業株式会社 シ−ラント材料のタイヤ内面への圧着方法とその装置
JPS552904A (en) * 1978-06-22 1980-01-10 Tokyo Shibaura Electric Co Reactor core element
JPS5511165U (ja) * 1978-07-10 1980-01-24
JPS5570087A (en) * 1978-11-20 1980-05-27 Matsushita Electric Ind Co Ltd Circuit board and method of manufacturing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0479173A (ja) * 1990-07-23 1992-03-12 Matsushita Electric Ind Co Ltd 表裏箔接続部品

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