JPH03126060U - - Google Patents
Info
- Publication number
- JPH03126060U JPH03126060U JP1990035864U JP3586490U JPH03126060U JP H03126060 U JPH03126060 U JP H03126060U JP 1990035864 U JP1990035864 U JP 1990035864U JP 3586490 U JP3586490 U JP 3586490U JP H03126060 U JPH03126060 U JP H03126060U
- Authority
- JP
- Japan
- Prior art keywords
- conductor film
- internal
- semiconductor device
- output
- output terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims 3
- 230000003321 amplification Effects 0.000 claims 1
- 238000003199 nucleic acid amplification method Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例による高周波半導
体装置の内部斜視図、第２図は従来の高周波半導
体装置の内部斜視図である。 図において、６……内部出力端子、７……内部
入力端子、８……外部出力端子、９……外部入力
端子、１０……半導体素子、１２……ワイヤを示
す。なお、図中、同一符号は同一、または相当部
分を示す。
体装置の内部斜視図、第２図は従来の高周波半導
体装置の内部斜視図である。 図において、６……内部出力端子、７……内部
入力端子、８……外部出力端子、９……外部入力
端子、１０……半導体素子、１２……ワイヤを示
す。なお、図中、同一符号は同一、または相当部
分を示す。
Claims (1)
- トランジスタパツケージの内部に入出力端子と
出力用導体膜及び接地用導体膜と、前記出力用導
体膜上に載置される多セルの高周波電力増幅用半
導体素子を有する高周波半導体装置に於いて、内
部入力端子及び内部出力端子を凹状に形成したこ
とを特徴とする高周波半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990035864U JPH03126060U (ja) | 1990-04-02 | 1990-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990035864U JPH03126060U (ja) | 1990-04-02 | 1990-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03126060U true JPH03126060U (ja) | 1991-12-19 |
Family
ID=31541590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990035864U Pending JPH03126060U (ja) | 1990-04-02 | 1990-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03126060U (ja) |
-
1990
- 1990-04-02 JP JP1990035864U patent/JPH03126060U/ja active Pending