JPH0312430U - - Google Patents
Info
- Publication number
- JPH0312430U JPH0312430U JP7380989U JP7380989U JPH0312430U JP H0312430 U JPH0312430 U JP H0312430U JP 7380989 U JP7380989 U JP 7380989U JP 7380989 U JP7380989 U JP 7380989U JP H0312430 U JPH0312430 U JP H0312430U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- semiconductor
- semiconductor device
- mounting
- sucking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7380989U JPH0312430U (xx) | 1989-06-23 | 1989-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7380989U JPH0312430U (xx) | 1989-06-23 | 1989-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0312430U true JPH0312430U (xx) | 1991-02-07 |
Family
ID=31612945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7380989U Pending JPH0312430U (xx) | 1989-06-23 | 1989-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0312430U (xx) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5727039A (en) * | 1980-07-24 | 1982-02-13 | Nec Home Electronics Ltd | Mounting method for semiconductor pellet |
| JPS59119737A (ja) * | 1982-12-27 | 1984-07-11 | Fujitsu Ltd | 半導体装置の製造方法 |
-
1989
- 1989-06-23 JP JP7380989U patent/JPH0312430U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5727039A (en) * | 1980-07-24 | 1982-02-13 | Nec Home Electronics Ltd | Mounting method for semiconductor pellet |
| JPS59119737A (ja) * | 1982-12-27 | 1984-07-11 | Fujitsu Ltd | 半導体装置の製造方法 |
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