JPH03123038A - Sucking jig for semiconductor element - Google Patents
Sucking jig for semiconductor elementInfo
- Publication number
- JPH03123038A JPH03123038A JP26047489A JP26047489A JPH03123038A JP H03123038 A JPH03123038 A JP H03123038A JP 26047489 A JP26047489 A JP 26047489A JP 26047489 A JP26047489 A JP 26047489A JP H03123038 A JPH03123038 A JP H03123038A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- curved surface
- collet
- present
- holding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 206010008631 Cholera Diseases 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83194—Lateral distribution of the layer connectors
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体素子の吸着治具（以下コレットと称す）
に関し、特に半導体素子のダイボンディングに使用する
コレットに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor device suction jig (hereinafter referred to as collet).
In particular, the present invention relates to collets used for die bonding of semiconductor devices.
従来、この種のコレ・ソトは、第４図の斜視図のように
、半導体素子（１？Ｊ下素子と略す）の上端辺を保持す
る素子保持１１１１ｉが１面となっていた。Conventionally, in this type of device, as shown in the perspective view of FIG. 4, an element holder 1111i that holds the upper end side of a semiconductor element (abbreviated as 1?J lower element) was on one side.
上述した従来のコレラｌ〜は、素子の上端辺を保持する
面が平面となっているので、第５図（ａ）（ｂ）の動作
説明図に示すように、クー１〜フレーム６上に素子４を
接着剤５により接着しようとした場合、図（ａ）のよう
に素子４か＝ルッ１−３の正しい位置に吸着されていな
い時には、図（１））のように、そのずれた位置のまま
傾いて接着してしまうという欠点がある。In the conventional cholera l~ described above, the surface that holds the upper edge of the element is flat, so as shown in the operation explanatory diagrams of FIGS. When trying to bond element 4 with adhesive 5, if element 4 is not adsorbed to the correct position of 1-3 as shown in Figure (a), the misaligned It has the disadvantage that it tends to stick in the same position at an angle.
上述した従来のコレラ１〜に対し、本発明は素子を保持
する面が曲面となっているという相違点を有する。The present invention differs from the above-mentioned conventional cholera 1 in that the surface holding the element is a curved surface.
本発明のコレラ１〜は、素子を吸着保持する面に曲面が
形成されている。In cholera 1 to 1 of the present invention, a curved surface is formed on the surface that attracts and holds the element.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の実施例１の斜視図である。FIG. 1 is a perspective view of Embodiment 1 of the present invention.
素子保持面１は曲面となっており、ここで素子の上端辺
を吸着保持する。素子吸着用真空穴２は真空で素子を吸
着するだめのものである。The element holding surface 1 is a curved surface, and the upper edge of the element is held there by suction. The device suction vacuum hole 2 is for sucking the device under vacuum.
第３図（ａ）、（ｂ）は本実施例の動作説明図で、図（
ａ）のように素子４がコレット３にずれて吸着されても
、図（ｂ）のようにダイボンディング時には、正しい位
置に移動し位置決めがなされる。FIGS. 3(a) and 3(b) are explanatory diagrams of the operation of this embodiment.
Even if the element 4 is misaligned and attracted to the collet 3 as shown in (a), it will be moved to the correct position and positioned during die bonding as shown in Figure (b).
第２図は本発明の実施例２の斜視図である。FIG. 2 is a perspective view of a second embodiment of the present invention.
素子保持面２が４方向にあり、この実施例では４方向に
対する素子の補正及び位置決めを行うことができる。The element holding surface 2 is provided in four directions, and in this embodiment, the element can be corrected and positioned in the four directions.
以」二説明したように本発明は、コレットの素子上端辺
保持面を曲面とすることにより、素子をリードフレーム
上に接着する時にその位置を補正することができる効果
がある。As described above, the present invention has the advantage that by forming the element upper edge holding surface of the collet into a curved surface, the position of the element can be corrected when bonding the element onto the lead frame.
コレットの斜視図、第５図（ａ＞、（ｂ）はそれぞれ従
来のコレラＩ〜の動作説明図である。The perspective view of the collet and FIGS. 5(a) and 5(b) are explanatory diagrams of the operation of the conventional cholera I.
１・・・素子保持面、２・・素子吸着用真空穴、３・・
コレット、４・−・半導体素子、５・・・接着剤、６・
・・リードフレーム。1...Element holding surface, 2...Vacuum hole for element adsorption, 3...
collet, 4...semiconductor element, 5...adhesive, 6...
··Lead frame.
Claims (1)
子の吸着治具において、半導体素子の上端辺を保持する
面が曲面となっていることを特徴とする半導体素子の吸
着治具。A semiconductor element suction jig for sucking a semiconductor element and performing die bonding, the semiconductor element suction jig being characterized in that a surface for holding the upper end side of the semiconductor element is a curved surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26047489A JPH03123038A (en) | 1989-10-04 | 1989-10-04 | Sucking jig for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26047489A JPH03123038A (en) | 1989-10-04 | 1989-10-04 | Sucking jig for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03123038A true JPH03123038A (en) | 1991-05-24 |
Family
ID=17348452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26047489A Pending JPH03123038A (en) | 1989-10-04 | 1989-10-04 | Sucking jig for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03123038A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2644372A1 (en) * | 2010-11-22 | 2013-10-02 | Denki Kagaku Kogyo Kabushiki Kaisha | Flat-plate bonding jig and method of manufacturing flat-plate stacked body |
-
1989
- 1989-10-04 JP JP26047489A patent/JPH03123038A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2644372A1 (en) * | 2010-11-22 | 2013-10-02 | Denki Kagaku Kogyo Kabushiki Kaisha | Flat-plate bonding jig and method of manufacturing flat-plate stacked body |
| EP2644372A4 (en) * | 2010-11-22 | 2014-07-30 | Denki Kagaku Kogyo Kk | Flat-plate bonding jig and method of manufacturing flat-plate stacked body |
| US9844858B2 (en) | 2010-11-22 | 2017-12-19 | Denka Company Limited | Flat-plate bonding jig and method of manufacturing flat-plate laminated body |
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