JPH03120073U - - Google Patents
Info
- Publication number
- JPH03120073U JPH03120073U JP3018490U JP3018490U JPH03120073U JP H03120073 U JPH03120073 U JP H03120073U JP 3018490 U JP3018490 U JP 3018490U JP 3018490 U JP3018490 U JP 3018490U JP H03120073 U JPH03120073 U JP H03120073U
- Authority
- JP
- Japan
- Prior art keywords
- lsi element
- circuit board
- printed circuit
- groove
- separable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図、第２図は本考案実施例を示す。第１図
は、取付要領を示す側面略図、第２図は、取付状
態の平面図、第３図、第４図は従来例を示す。第
３図は、取付要領を示す側面略図、第４図は、取
付状態の平面図である。
１……プリント基板、１′……分離部、２……
溝、２′……連設部、３……ＬＳＩ、４……接着
剤。
1 and 2 show an embodiment of the present invention. FIG. 1 is a schematic side view showing the installation procedure, FIG. 2 is a plan view of the installed state, and FIGS. 3 and 4 show a conventional example. FIG. 3 is a schematic side view showing the installation procedure, and FIG. 4 is a plan view of the installed state. 1...Printed circuit board, 1'...separation section, 2...
Groove, 2'...Continuous portion, 3...LSI, 4...Adhesive.
Claims (1)
離可能な溝を形成すると共に、該ＬＳＩ素子の取
付面と前記プリント基板上の分離可能な溝に囲ま
れた部分との間で接着剤にて仮設するようにした
ことを特徴とするＬＳＩ素子の取付構造。 A separable groove is formed in advance at the location where the LSI element is to be mounted on the printed circuit board, and temporary adhesive is used between the mounting surface of the LSI element and the portion surrounded by the separable groove on the printed circuit board. An LSI element mounting structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3018490U JPH03120073U (en) | 1990-03-22 | 1990-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3018490U JPH03120073U (en) | 1990-03-22 | 1990-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120073U true JPH03120073U (en) | 1991-12-10 |
Family
ID=31532913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3018490U Pending JPH03120073U (en) | 1990-03-22 | 1990-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120073U (en) |
-
1990
- 1990-03-22 JP JP3018490U patent/JPH03120073U/ja active Pending