JPH03120052U - - Google Patents
Info
- Publication number
- JPH03120052U JPH03120052U JP2903390U JP2903390U JPH03120052U JP H03120052 U JPH03120052 U JP H03120052U JP 2903390 U JP2903390 U JP 2903390U JP 2903390 U JP2903390 U JP 2903390U JP H03120052 U JPH03120052 U JP H03120052U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- pad
- terminal
- circuit pattern
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2903390U JPH03120052U (it) | 1990-03-23 | 1990-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2903390U JPH03120052U (it) | 1990-03-23 | 1990-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120052U true JPH03120052U (it) | 1991-12-10 |
Family
ID=31531814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2903390U Pending JPH03120052U (it) | 1990-03-23 | 1990-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120052U (it) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033981A (ja) * | 2004-12-13 | 2013-02-14 | Agere Systems Inc | 基板導通を利用した積重ねダイ式の構成をもつ集積回路 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737867A (en) * | 1980-08-18 | 1982-03-02 | Mitsubishi Electric Corp | Semiconductor device |
| JPS58137407A (ja) * | 1981-09-30 | 1983-08-15 | インペリアル・ケミカル・インダストリ−ズ・ピ−エルシ− | 所望しない発泡を抑制する組成物及び方法 |
| JPS61216391A (ja) * | 1985-03-22 | 1986-09-26 | 古河電気工業株式会社 | 多層回路基板の製造方法 |
| JPH0254119A (ja) * | 1988-08-18 | 1990-02-23 | Kyowa Electron Instr Co Ltd | 地すべり自動観測装置 |
-
1990
- 1990-03-23 JP JP2903390U patent/JPH03120052U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737867A (en) * | 1980-08-18 | 1982-03-02 | Mitsubishi Electric Corp | Semiconductor device |
| JPS58137407A (ja) * | 1981-09-30 | 1983-08-15 | インペリアル・ケミカル・インダストリ−ズ・ピ−エルシ− | 所望しない発泡を抑制する組成物及び方法 |
| JPS61216391A (ja) * | 1985-03-22 | 1986-09-26 | 古河電気工業株式会社 | 多層回路基板の製造方法 |
| JPH0254119A (ja) * | 1988-08-18 | 1990-02-23 | Kyowa Electron Instr Co Ltd | 地すべり自動観測装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033981A (ja) * | 2004-12-13 | 2013-02-14 | Agere Systems Inc | 基板導通を利用した積重ねダイ式の構成をもつ集積回路 |