JPH03119312A - Optical shutter array and production thereof - Google Patents

Abstract

PURPOSE:To allow the formation of electrodes, which are formed embedded in a substrate having an electrooptic effect to a sufficiently large thickness so that the contact with terminal electrodes is easily and surely executed by constituting the electrodes of sheets. CONSTITUTION:The front and rear surfaces of respective bases 21, 21 exist on the planes common with the front and rear surfaces of the substrate and the respective sheets 22. The plural terminal electrodes 27 are provided on one surface of the respective bases 21, 21 so as to cover the one surface of the sheets 22 to form the electrodes. The respective terminal electrodes 27 are electrically connected individually to the respective sheets 22. The sheets 22 and terminal electrodes 27 on one base 21 side and the sheets 22 and terminal electrodes 27 on the other base 21 side are arranged to face each other on both sides of the substrate 23. The spacings between each one of the sheets 22 and terminal electrodes 27 facing each other constitute shutter parts A1 to An. The sections of the electrodes can be increased in this way and the registration of the terminal electrodes is facilitated at the time of formation of these electrodes. The contact between the electrodes and the terminal electrodes is thus surely executed.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an optical shutter array that utilizes electro-optic effects and a method for manufacturing the same.

(Prior Art) For example, PLZT transparent ceramics have a large electro-optic effect, and are therefore being put into practical use as optical shutters. This is because when a PLZT plate with electrodes is placed between a polarizer and an analyzer whose polarization directions are orthogonal to each other, the light is blocked by the analyzer when no voltage is applied between the electrodes.
The principle is that when a voltage is applied, light passes through the analyzer due to the birefringence of PLZT. Therefore, it has been considered to arrange a plurality of the shutters in a one-dimensional manner to form a shutter array, and to apply the shutter array to optical aperture adjusters, optical printers, optical scanners, and the like.

In order to make an optical shutter array using an electro-optic effect material such as PLZT, the conventional general method of forming electrodes on the electro-optic effect material is to form electrodes on the surface of the electro-optic effect material by aluminum vapor deposition and etching treatment. is a method,
Regarding the electrode formation form, ■ one attached to one side of the electro-optic effect material.

There are two types: ■ one in which the electro-optic effect material is attached to both sides, and one in which the electro-optic effect material is grooved and electrodes are embedded in the thickness direction of the electro-optic effect material.

However, when electrodes are formed on the surface of an electro-optic effect material, it is difficult to produce an electro-optic effect uniformly within the substance, and therefore there is a problem in that the driving voltage must be increased. Furthermore, even if part of the electrode is embedded in an electro-optic effect material, it is difficult to process minute grooves.
There is also the problem that the mechanical strength of the material deteriorates.

Therefore, the present applicant has previously proposed an optical shutter array and a manufacturing method thereof that can solve the above-mentioned conventional problems. This is the invention described in the specification and drawings of Japanese Patent Application No. 1-54942. Hereinafter, the invention described in the above specification and drawings will be briefly explained.

In FIG. 7, as shown in (a), an electrode material is fixed by vapor deposition or the like on one entire surface of a substrate 2 made of an electro-optic effect material such as PLZT, and a thin film 10 is formed.
As shown in b), striped individual electrodes 3 are formed from the thin film 10 by photolithography. Next, as shown in (,), an electrode material is fixed on the other surface of the substrate 2 by vapor deposition, etc., and the common electrode 4 is formed. Next, as shown in (d), thin films 8 and 9 of Sin are formed by sputtering or the like so as to cover the electrodes 3.4 on both sides of the substrate 2.
0th order, two sets of the above blocks 11 as shown in (e)
The common electrodes 4 are arranged to face each other, and a spacer (not shown) of a predetermined thickness is sandwiched between the two sets of blocks 11 to abut each other. At this time, the individual electrodes 3 of one block 11 are arranged in a staggered manner so as to be located between the individual electrodes 3 of the other block 11. Furthermore, each block 11°11
Block-shaped supports 5, 5 made of ceramics or the like are stacked on each individual electrode 3 side, respectively. In this state, the support 5,
5 and the insulating layers 9, 9 on the individual electrode side and the insulating layers 8, 8 on the common electrode side, a low melting point glass 12 is filled under a heated state, and the whole is made into one block 13. As shown in FIG. 8, the block 13 is sliced along the plane perpendicular to the stacking direction of each member to form a plurality of block chips 14, and the surface of each block chip 14 is polished. As shown in FIG. 9, an electrode material is formed into a thin film on one side of each block chip 14 by vapor deposition or the like, and a desired terminal electrode 6 is formed on the support 5 by photolithography.
Further, a terminal electrode 7 is formed on the common electrode 4. In this way, each terminal electrode 6 is connected to the corresponding individual electrode 3, and the terminal electrode 7 is connected to both common electrodes 4.

- Figures 9 and 10 show examples of optical shutter arrays obtained through the above steps, in which the individual electrodes 3 and the common electrodes 4 are parallel to each other.

In addition, since they are arranged to face each other in the thickness direction (light transmission direction) of the substrate 2, when a voltage is applied between the 1 individual electrode 3 and the common electrode 4, the electro-optic effect of the substrate 2 It is curved uniformly in the thickness direction, and can therefore be driven at low voltage.

(Problems to be Solved by the Invention) Although the above-mentioned optical shutter array and its manufacturing method have the above-mentioned effects, there is still room for improvement. In other words, when forming electrodes in the thickness direction of the electro-optic effect material, a thin film formation method such as vapor deposition is used, so it is not possible to increase the film thickness, and when forming a terminal electrode to connect to the electrode. 1) There are problems such as difficulty in alignment and failure to make contact with the electrodes.Also, when forming the electrodes, a long photolithography process must be used, and depending on the etching conditions. There is also the possibility of pattern breakage.

The present invention has been made to solve the problems of the prior art, and makes it possible to make the electrode sufficiently thick when forming the electrode in the thickness direction of the electro-optic effect material. To provide an optical shutter array and its manufacturing method, which can easily and reliably make contact with terminal electrodes, and which can simplify the process by eliminating the need for a photolithography process in forming the electrodes. With the goal.

(Means for Solving the Problems) An optical shutter array according to the present invention includes a substrate having an electro-optic effect, a thin plate provided on the substrate and serving as an electrode,
It is characterized by having a support body that holds the substrate and the thin plate, and terminal electrodes provided on the support body and individually connected to the thin plates serving as the electrodes.

The method for manufacturing an optical shutter array according to the present invention includes the steps of sandwiching thin plates processed to serve as electrodes on both sides of a substrate having an electro-optic effect, and further adhering supports to both sides of the thin plates to form a block. It is characterized by comprising the steps of slicing this block in a direction perpendicular to the stacking direction, and forming a terminal electrode corresponding to each cursed electrode in contact with each electrode on the sliced surface.

(Function) In the optical shutter array according to the present invention, the electrodes are formed of thin plates that can be considerably thicker than thin films, and terminal electrodes can be connected to these thick electrodes.

In the method for manufacturing an optical shutter array according to the present invention, a substrate having an electro-optical effect, a thin plate serving as an electrode, and a support are laminated, and after slicing this, terminal electrodes are formed. There is no need to use a photophosphorographic process for shaping.

(Example) Hereinafter, an example of an optical shutter array and a manufacturing method thereof according to the present invention will be described with reference to FIGS. 1 to 6.

First, an embodiment of the optical shutter array shown in FIGS. 1 and 2 will be described. In Figures 1 and 2, the reference numeral 23
The substrate shown by is made of a material having an electro-optic effect such as PLZT, and a plurality of thin plates 22 serving as electrodes are provided at regular intervals on both sides of the substrate 23 in the longitudinal direction. In FIG. 2 of each thin plate 22, the upper and lower end surfaces are on the same plane as the upper and lower end surfaces of the substrate 23. Supports 21 and 21 are also bonded to both sides of the substrate 23 in the longitudinal direction so as to sandwich each thin plate 22 between the substrate 23 and the substrate 23. Consequently, the substrate 23 and each thin plate 22 are supported by the support 21.21.
is supported.

Further, a groove 24 exists between each thin plate 22.

The upper and lower surfaces of each support 21.21 are connected to the substrate 23 and each thin plate 2.
It is on the same plane as the upper and lower surfaces of 2. Each support 21.21
A plurality of terminal electrodes 27 are provided on one side of the thin plate 22 serving as an electrode so as to cover one side of the thin plate 22, and each terminal electrode 27 is individually electrically connected to each thin plate 22. Each thin plate 22 and terminal electrode 27 on one support 21 side, and each thin plate 22 and terminal electrode 2 on the other support 21 side
7 are arranged facing each other with the substrate 23 in between.

The areas between each of the thin plates 22 and the terminal electrodes 27 that face each other form shutter portions A, , A, . . . An.

Note that ceramics, glass, or the like is used as the material of the support body 21. As the material of the thin plate 22, a conductor such as aluminum or stainless steel is used.

Now, the above-mentioned optical shutter array is placed between the polarizer and the analyzer 1 whose polarization directions are orthogonal to each other, and an arbitrary one is selected from the opposing terminal electrodes 27 and 27, and a voltage is applied between them. Then, an electric field is generated in the shutter section between the thin plates 22 and 22 of the substrate 23 that communicate with the opposing terminal electrodes 27 and 27, and the light that has passed through the polarizer changes its plane of polarization due to the birefringence of the shutter section. be changed. This polarization plane becomes the same as the polarization direction of the analyzer, and the light passes through the analyzer. When no voltage is applied between the opposing terminal electrodes 27 and 27, the plane of polarization of the light by the shutter portion and the polarization direction of the analyzer are not -e, and the light cannot pass through the analyzer.

According to the above embodiment, the thin plates 22, 22 serving as electrodes are parallel to each other and in the thickness direction of the substrate 23 (light transmission direction).
Since it will be placed opposite to the thin plate 22.22
When a voltage is applied between them, an electro-optic effect appears uniformly in the thickness direction of the substrate 23, and thus it is possible to drive with a low voltage. Also, the part that becomes the m pole is not a thin film but a thin plate 2.
2, the thickness of the part that becomes the electrode can be made sufficiently thick, so that contact with the terminal electrode 27 can be made easily and reliably. The process can be simplified by eliminating the need for a phosphorus process.

In the above embodiment, the pair of thin plates 22, 22 are arranged facing each other, but the electrodes may be arranged as in the example shown in FIG. may be arranged as individual electrodes in two rows in a staggered manner, and a common electrode made of a thin plate may be arranged between the rows of individual electrodes.

Next, an embodiment of the method for manufacturing the above optical shutter array will be described.

First, as shown in FIG. 3, a support 21, a thin plate 22 that will become an electrode, a substrate 23 made of an electro-optic effect material, a thin plate 22 that will become an electrode, and the support 21 are prepared, and these are attached as described above. They are laminated in this order and adhered to each other to form a block 25 as shown in FIG.

For adhesion, resin such as epoxy, glass, or the like can be used. Support 21. Thin plate 22. The material of the substrate 23 is appropriately selected from those mentioned above.

The two supports 21.21 may have the same shape. Further, the two thin plates 22,22 have the same shape, and a plurality of grooves 24 are formed in parallel stripes at predetermined intervals. The groove 24 can be formed by etching, punching, or the like. two thin plates 2
2.22 are positioned and stacked so that their grooves 24 are in the same direction and both grooves 24 are facing each other.

As shown in FIG. 5, the block 25 is sliced to a predetermined thickness in a direction perpendicular to the stacking direction of the members and perpendicular to the direction of the striped grooves 24 of the thin plate 22. Furthermore, wrap the sliced surface. FIG. 6 shows a block chip 26 obtained by slicing in this way, in which thin plates 22 are lined up at regular intervals with the substrate 23 sandwiched between them on the slicing surface, and supports 21 are fixed to the outside of the thin plates 22. is appearing. Also,
A groove 24 appears between each thin plate 22.

Next, FIG. 1 shows the range from each support 21° 21 of the block chip 26 to each thin plate 22.

As explained in FIG. 2, the terminal electrodes 27 are formed and the terminal electrodes 27 corresponding to the respective thin plates 22 appearing on the sliced surface are brought into contact with the respective thin plates 22.

By doing this, an optical shutter array as shown in FIGS. 1 and 2 is completed. The terminal electrode 27 can be formed by a method such as vapor deposition or sputtering.

According to the embodiment of the method for manufacturing an optical shutter array described above, since the electrodes embedded in the substrate 23 are made of the thin plate 22, the cross section of the electrodes can be thickened, and therefore, when forming the terminal electrodes 27, the positions This has the effect of making the alignment easier and ensuring reliable contact between the electrode and the terminal electrode.

Incidentally, when the electrode is formed of a thin film, the thickness is about 1 μm, but when it is a thin plate, the thickness can be 100 μm or more. As described above, by forming the embedded electrode using the thin plate 22, the photolithography process for creating the electrode can be omitted. Furthermore, if the buried electrode is formed of a thin film, there is a possibility that the wire will break due to a slight abnormality such as a pinhole, but if the electrode is formed of the thin plate 22 as in the above embodiment, there will be no breakage.

Note that the thin plate 22 having the striped grooves 24 and the grooves 24
If the thin plate 22 and the flat thin plate having no polarity are placed opposite each other with the substrate 23 interposed therebetween, the thin plate 22 can be used as an individual electrode, and the flat thin plate can be used as a common electrode. Further, when the common electrode is provided, the cross-sectional area of the entire common electrode becomes quite large, so there is no problem even if it is formed of a thin film.

In FIG. 2, a driving IC is mounted on a support 21,
The thin plate 22 forming the embedded electrode and the IC may be connected by wire bonding. The wire in this case constitutes a terminal electrode.

(Effects of the Invention) According to the present invention, since the electrode embedded in the substrate having an electro-optic effect is formed of a thin plate, the cross section of the electrode can be thickened, and therefore, when forming a terminal electrode, one position This has the effect of making alignment easier and ensuring reliable contact between the electrode and the terminal electrode. Also,
As described above, by forming the embedded electrode with a thin plate, the photolithography process for creating the electrode can be omitted, and the process can be simplified.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an embodiment of the optical shutter array according to the present invention, FIG. 2 is a sectional view taken along the line ■-■ in FIG.
FIG. 3 is an exploded perspective view showing one step of the embodiment of the method for manufacturing an optical shutter array according to the present invention, FIG. 4 is a perspective view showing the next step, and FIG. 5 is a perspective view showing the next step. , FIG. 6 is a plan view showing an example of a chip obtained by the process of FIG. 5. FIG. 7 is a front and plan view sequentially showing the steps up to the middle of the method for manufacturing the optical shutter array proposed earlier. FIG. 8 is a perspective view showing a step subsequent to the above step, FIG. 9 is a plan view showing the next step, and FIG. 10 is a longitudinal cross-sectional view of the central part of FIG. 21... Support body, 22... Thin plate, 23... Substrate, 25... Block, 27... Terminal electrode. Figure 1 ■ Figure 3 Figure 4 ■ Figure 2

Claims (1)

[Claims] 1. A substrate having an electro-optical effect, a thin plate provided on this substrate to serve as an electrode, a support for holding the substrate and the thin plate, and a support provided on this support to serve as the electrode. An optical shutter array comprising terminal electrodes individually connected to a thin plate. 2. A step of sandwiching a thin plate processed to become an electrode on both sides of a substrate having an electro-optic effect, and then adhesively laminating the substrate and a support for supporting the thin plate on both sides to form a block, and laminating the blocks. A method for manufacturing an optical shutter array, comprising: slicing in a direction perpendicular to the direction; and forming terminal electrodes corresponding to each of the electrodes appearing on the slice surface by contacting each of the electrodes. .