JPS6279419A - Method for connecting wiring of optical shutter array electrode - Google Patents

Method for connecting wiring of optical shutter array electrode

Info

Publication number
JPS6279419A
JPS6279419A JP22105885A JP22105885A JPS6279419A JP S6279419 A JPS6279419 A JP S6279419A JP 22105885 A JP22105885 A JP 22105885A JP 22105885 A JP22105885 A JP 22105885A JP S6279419 A JPS6279419 A JP S6279419A
Authority
JP
Japan
Prior art keywords
electrodes
optical shutter
electrode
electro
shutter array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22105885A
Other languages
Japanese (ja)
Inventor
Nobuharu Nozaki
野崎 信春
Toshio Iijima
飯島 俊雄
Hiroshi Sunakawa
寛 砂川
Kazuhiro Kawajiri
和廣 川尻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP22105885A priority Critical patent/JPS6279419A/en
Priority to US06/914,972 priority patent/US4755415A/en
Publication of JPS6279419A publication Critical patent/JPS6279419A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Abstract

PURPOSE:To lessen the labor of wiring by mounting an optical shutter array provided with electrodes on respective surfaces onto a base, providing flexible printed wiring connectors via anisotropically conductive connectors on the array and connecting the connectors by means of a pushing bar in the stage of connecting the wirings to the electrodes. CONSTITUTION:A transparent substrate 3 made of an electrooptic material consisting of transparent ceramics or the like which generates an optical modulation effect when impressed with a voltage is mounted on the base 2 consisting of ceramics or glass and while the electrodes 4 provided thereon are included, the substrate 3 is divided to form the optical shutter arrays 1 respectively having driving parts 30. The wirings are connected to these electrodes 4. The anisotropically conductive connectors 5 are preliminarily provided on the substrate 3 in this stage and the flexible printed wiring connectors 6 having conductors 9 and lead-out electrodes 10 are superposed thereon and are pushed by the pushing bar to couple the conductors 9 and the electrodes 4. The need for wire bonding is eliminated in the above-mentioned manner, by which the time for connecting the wirings is shortened.

Description

【発明の詳細な説明】 く技術分野〉 本発明は、配線が容易で、歩留りの良い、電気光学効果
を利用した光シャッタアレイ電極の配線接続方法に関す
る。
DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a wiring connection method for optical shutter array electrodes that utilizes electro-optic effects, which facilitates wiring and has a high yield.

〈従来技術〉 近年、PLZT等の電気光学効果を発揮する電気光学材
料が開発されている。ここで電気光学効果とは、印加さ
れた直流または低周波(光周波に比べて)の電界によっ
て媒質の屈折率が変化する現象をいう。
<Prior Art> In recent years, electro-optic materials such as PLZT that exhibit electro-optic effects have been developed. Here, the electro-optic effect refers to a phenomenon in which the refractive index of a medium changes due to an applied direct current or low frequency (compared to optical frequency) electric field.

このような電気光学材料の代表例としては、9/65/
35の比率からなるPLZT (La9原子%PbZr
O3/ PbTiO3= 65 / 35 (モル比)
〕の透明セラミックスが周知である。
A typical example of such electro-optic materials is 9/65/
PLZT (La9 atomic% PbZr
O3/PbTiO3= 65/35 (molar ratio)
] Transparent ceramics are well known.

このPLZTを利用したものとして光シャッタがある。There is an optical shutter that utilizes this PLZT.

光シャッタは板状のPLZT素子の片面に一定間隔を隔
てた一対の下面電極を形成したものを、偏光方向が互い
に直行する偏光子と検光子の間に設置した構造となって
おり、電極への印加電圧の0N−OFFによって偏光子
と検光子との間で光の透過、遮断を制御することができ
るものである。このような一画素からなる光シャッタを
複数集合した光シャッタアレイはプリンタ等に用いるこ
とができる。
The optical shutter has a structure in which a pair of bottom electrodes are formed on one side of a plate-shaped PLZT element at a constant interval, and is installed between a polarizer and an analyzer whose polarization directions are perpendicular to each other. Transmission and blocking of light can be controlled between the polarizer and the analyzer by turning the applied voltage ON and OFF. An optical shutter array in which a plurality of such optical shutters each consisting of one pixel are assembled can be used in a printer or the like.

従来の光シャッタアレイ電極の配線接続部の構造を第1
0図および第11図に示す。この光シャッタアレイlは
、各電極4と対応する取出型Vj10をワイヤ8で接続
して配線を行っていた。
The structure of the wiring connection part of the conventional optical shutter array electrode is
0 and 11. This optical shutter array l was wired by connecting each electrode 4 and the corresponding lead-out type Vj10 with wires 8.

しかしワイヤ8を電極4および10にボンディングする
作業は、配線数が多く手間がかかり、さらにワイヤボン
ディングの密着性が悪い場合には断線する。ことがあり
、歩留り低下の原因となっていた。特に電極4が溝型電
極(電気光学材料製透明基板3に比較的深い溝を形成し
、該溝に電極となる導電性材料を埋設したもの)の場合
には、ワイヤボンディングを行う電極の面積が少ないた
めワイヤボンディングが困難であり、上記欠点が顕著で
あった。
However, the work of bonding the wire 8 to the electrodes 4 and 10 requires a large number of wires and is time-consuming, and furthermore, if the adhesion of the wire bonding is poor, the wire will break. This caused a decrease in yield. In particular, when the electrode 4 is a groove-type electrode (a relatively deep groove is formed in the transparent substrate 3 made of electro-optic material and a conductive material that becomes the electrode is buried in the groove), the area of the electrode to be wire bonded is Wire bonding was difficult due to the small amount of wire bonding, and the above-mentioned drawbacks were conspicuous.

また、電極4の長手方向と入射光の方向が同一方向とな
るような構成となっている第11図に示す光シャッタア
レイでは、電極4と取出型J410の位置関係から、こ
れらを接続するワイヤ11が光路を横切るためワイヤか
光の入射を妨げたり、あるいは入射光を散乱させ、迷光
となる等、光シャッタアレイの性能の低下をもたらす原
因となるおそれが大きい。
In addition, in the optical shutter array shown in FIG. 11, which is configured such that the longitudinal direction of the electrode 4 and the direction of the incident light are the same, the wire connecting them is Since the wires 11 cross the optical path, there is a strong possibility that the wires may obstruct the incidence of light or scatter the incident light, resulting in stray light, resulting in a decrease in the performance of the optical shutter array.

〈発明の目的〉 本発明の目的は、配線の手間を軽減し、製造時間を短縮
することができ、歩留りの向上が図れる光シャッタアレ
イ電極の配線接続方法を提供することにある。
<Objective of the Invention> An object of the present invention is to provide a wiring connection method for optical shutter array electrodes that can reduce wiring effort, shorten manufacturing time, and improve yield.

〈発明の構成〉 本発明は、電気光学材料製透明基板に複数の光シャッタ
用電極を有する光シャッタアレイの各電極に配線接続を
するに際し、前記電気光学材料製透明基板上に異方導電
性コネクタを設置し、その上に可撓性プリント配線コネ
クタ(以下F、P。
<Structure of the Invention> The present invention provides an anisotropic conductive material on the transparent substrate made of an electro-optic material when wiring is connected to each electrode of an optical shutter array having a plurality of optical shutter electrodes on a transparent substrate made of an electro-optic material. Install the connector and place a flexible printed wiring connector (hereinafter referred to as F, P) on top of it.

Cと称す)の一端を重ねて設置し、前記F、P。(referred to as F and P) are placed so that one end of the F and P are overlapped.

Cと面記異方導電性コネクタを押圧手段によって11t
「記電気光学材料製透明基板に抑圧支持することにより
前記電気光学材料製透明基板の外電極とこれらに対応す
るF、P、Cの各導線とを電気的に接続することを特徴
とする光シャッタアレイ電極の配線接続方法である。
C and the anisotropic conductive connector are pressed by pressing means to 11t.
``The light is characterized by electrically connecting the outer electrodes of the transparent substrate made of the electro-optic material and the corresponding conductive wires F, P, and C by being compressed and supported by the transparent substrate made of the electro-optic material. This is a wiring connection method for shutter array electrodes.

また電極は電気光学材料製透明基板に形成された溝に導
電物質を埋設してなるものがよい。
Further, the electrode is preferably formed by embedding a conductive substance in a groove formed in a transparent substrate made of an electro-optical material.

以下、本発明の光シャッタアレイの配線接続方法を添付
図面に示す好適実施例について詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the optical shutter array wiring connection method of the present invention will be described in detail with reference to the accompanying drawings.

本発明の光シャッタアレイの配線接続方法は、大別して
第1工程から第5工程によって行うものである。
The wiring connection method for an optical shutter array according to the present invention is roughly divided into first to fifth steps.

第1工程は、第5図に示すように、予め適当な方法で光
シャッタ用電極4に対応する取出電極10を形成しであ
る支持体2の上面に電気光学材料製透明基板3を接着剤
を用いて接着する。
In the first step, as shown in FIG. 5, an extraction electrode 10 corresponding to the optical shutter electrode 4 is formed in advance by an appropriate method, and a transparent substrate 3 made of an electro-optic material is attached to the upper surface of the support 2 using an adhesive. Glue using.

第1図に示す構成の光シャッタアレイの場合では、入射
光が支持体2を透過するため、支持体2は実質的に透明
な板とし、光学用接着剤を用いて基板3を接着するのか
好ましい。
In the case of the optical shutter array having the configuration shown in FIG. 1, since the incident light passes through the support 2, the support 2 should be a substantially transparent plate, and the substrate 3 should be adhered using an optical adhesive. preferable.

第2図に示す構成の光シャッタアレイの場合では、支持
体2は凸部20を有しており、この凸部20の先端に基
板3が接着さitている。この場合入射光は支持体2を
透過しないため、支持体2は透明、不透明を問わず、ま
た用いる接着剤も光学用に特に制限されることはなく、
一般的なものでよい。
In the case of the optical shutter array having the configuration shown in FIG. 2, the support body 2 has a convex portion 20, and the substrate 3 is adhered to the tip of the convex portion 20. In this case, since the incident light does not pass through the support 2, the support 2 may be transparent or opaque, and the adhesive used is not particularly limited to optical use.
It can be something general.

このような支持体2に用いる材料としてはセラミック板
等を挙げることができ、支持体2を透明板とする場合に
は、ガラス、サファイア等を用いることが好ましい。
Examples of the material used for such a support 2 include a ceramic plate, and when the support 2 is a transparent plate, it is preferable to use glass, sapphire, or the like.

以下、電気光学材料製透明基板3について説明する。こ
の電気光学材料製透明基板3は、電圧を印加すると、尤
変凋効果を生ずる性質を打しており、好ましくは、97
65/35の比率からなるPLZT (La9原f%、
Pb7.r(13/PbTiO3=65/35(モル比
))の透明セラミックスを用い°る。
The transparent substrate 3 made of electro-optic material will be explained below. This transparent substrate 3 made of an electro-optical material has a property of producing a gradient effect when a voltage is applied, and is preferably 97
PLZT (La9 original f%,
Pb7. A transparent ceramic of r (13/PbTiO3=65/35 (molar ratio)) is used.

この他にも、7/65/35.8/65/35、8/4
0/60、1 2/40/60.10/65/35の比
率からなるPLZT、60/2.70/8の比率からな
るPBLN、10/65/35の比率からなるPLHT
、4/60/40.8/60/40の比率からなるPB
LNや、SBN、LiTaO3、LiNb30、KH2
PO4、ADP、  KD2  PO4、BNN、KT
N等も用いることが可能である。
In addition, 7/65/35.8/65/35, 8/4
PLZT with a ratio of 0/60, 12/40/60.10/65/35, PBLN with a ratio of 60/2.70/8, PLHT with a ratio of 10/65/35.
, PB consisting of the ratio of 4/60/40.8/60/40
LN, SBN, LiTaO3, LiNb30, KH2
PO4, ADP, KD2 PO4, BNN, KT
N etc. can also be used.

このような電気光学材料は誘起される屈折率変化鼠が、
電界の1乗に比例する一時電気光学効果(ポッケルス効
果)と、電界の2乗に比例する二次電気光学効果(カー
効果)を発揮するものがあり、いずれを利用することも
可能であるが、二次電気光学効果を発揮するものが好ま
しい。
In such electro-optic materials, the induced refractive index change is
There are some that exhibit a temporary electro-optic effect (Pockels effect) that is proportional to the first power of the electric field, and a second-order electro-optic effect (Kerr effect) that is proportional to the square of the electric field, and it is possible to use either of them. , those exhibiting a secondary electro-optic effect are preferred.

この電気光学材料製透明基板3には電J44が平行かつ
等間隔に形成されている。電極4は、基板3の表面に、
蒸着、スパッタ、塗布、メッキ等の方法により金属薄膜
を形成し、エツチングによって、短111状の平面電極
とすることも可能であるが、有効光路長を長く取り駆動
電圧を低減させるために、基板3に溝を形成し、該溝に
導電物質を埋設した電極(以下溝型電極と称す)とする
ことが好ましい。
Electrical conductors 44 are formed in parallel and at regular intervals on this transparent substrate 3 made of electro-optical material. The electrode 4 is on the surface of the substrate 3,
It is also possible to form a thin metal film using methods such as vapor deposition, sputtering, coating, or plating, and then form a short 111-shaped planar electrode by etching, but in order to increase the effective optical path length and reduce the driving voltage, it is necessary to It is preferable to form an electrode (hereinafter referred to as a groove-type electrode) in which a groove is formed in the groove and a conductive material is buried in the groove.

溝型電極は、基板3に機械研削加工やエツチング等によ
って巾および深さの等しい溝を平行かつ等間隔に形成し
、この溝に導電性樹脂を充填するか、あるいは蒸着やス
パッタによって金属膜を形成することにより形成される
The groove-type electrode is made by forming grooves of equal width and depth in parallel and at equal intervals on the substrate 3 by mechanical grinding or etching, and then filling these grooves with a conductive resin or depositing a metal film by vapor deposition or sputtering. Formed by forming.

溝の深さは必要に応じて適宜決定されるが、溝の深さが
50μm以上の場合には、該溝に導電性樹脂を充填して
溝型電極を形成することが好ましい。
The depth of the groove is appropriately determined as necessary, but when the depth of the groove is 50 μm or more, it is preferable to fill the groove with a conductive resin to form a groove-shaped electrode.

このような導電性樹脂には、Ag、Au、Cu等をフィ
ラーとするポリイミド樹脂、エポキシ樹脂等を用いるこ
とができる。
As such a conductive resin, a polyimide resin, an epoxy resin, or the like containing Ag, Au, Cu, or the like as a filler can be used.

このように形成した電極4の間は、駆動部30が形成さ
れ、電極4に電圧を印加すると、駆動部30は電気光学
効果を生じる。
A driving section 30 is formed between the electrodes 4 thus formed, and when a voltage is applied to the electrodes 4, the driving section 30 produces an electro-optic effect.

第2工程は、第6図に示すように、電気光学材料製透明
基板3の上に、異方導電性コネクタ5を後述するように
電744と電気的に接続されるように設置する。また、
このコネクタの設置に際しては後述するコネクタの性質
により、正確な位置合せを必要としない。
In the second step, as shown in FIG. 6, an anisotropically conductive connector 5 is installed on a transparent substrate 3 made of electro-optic material so as to be electrically connected to a conductor 744 as described later. Also,
When installing this connector, accurate alignment is not required due to the characteristics of the connector, which will be described later.

この異方導電性コネクタ5は、第4図に示すように、シ
リコンゴム等の弾性絶縁体50の内部にAu等の金属細
線51が一定の方向性をもって整然と植設された構造と
なっており、金属細線51の両端は、弾性絶縁体50の
表面から10〜20μm程度の長さだけ突出している。
As shown in FIG. 4, this anisotropic conductive connector 5 has a structure in which fine metal wires 51 such as Au are implanted in an orderly manner with a certain directionality inside an elastic insulator 50 such as silicone rubber. Both ends of the thin metal wire 51 protrude from the surface of the elastic insulator 50 by a length of about 10 to 20 μm.

そしてこの一方の突出部が電極4と、他方の突出部が後
述するF、P、C6の導線9と接触して電気的に接続さ
れるようになっている。
One of the protrusions is in contact with the electrode 4, and the other protrusion is in contact with conducting wires 9 of F, P, and C6, which will be described later, to be electrically connected.

この金属線!151は密に導線されているため、異方導
電性コネクタ5を基板3上に設置するに際して正確な位
置合せをしなくても単に基板3上にのせるだけで電気的
に接続され、配線の労力を軽減することができる。
This metal wire! 151 is a dense conductor, so when installing the anisotropic conductive connector 5 on the board 3, it can be electrically connected simply by placing it on the board 3, and the wiring can be easily connected. Labor can be reduced.

第3−[程は、第7図に示すように、異方導電性コネク
タ5の上に可撓性プリント配線コネクタ(F、P、C)
6の一端を重ねて設置する。
In the third step, as shown in FIG.
Place one end of 6 on top of each other.

このF、P、C6は、導線9が電極4の間隔と等しい間
隔で、平行に形成されており、第3図に示すように電極
4とこれに対応する導線9が異方導電性コネクタ5の金
属細線51を介して電気的に接続されるように設置する
In these F, P, and C6, the conducting wires 9 are formed parallel to each other at intervals equal to the spacing between the electrodes 4, and as shown in FIG. They are installed so that they are electrically connected via thin metal wires 51.

このようなF、P、Cは、可撓性を有するカプトンのよ
うな軟質樹脂で構成されており、導16A9を形成する
ため、絶縁性を有するものがよい。
These F, P, and C are made of a flexible soft resin such as Kapton, and are preferably insulating since they form the conductor 16A9.

導線9はCu、Au等の金属を用いて、スパッタ、蒸着
等の方法により形成される。
The conductive wire 9 is formed using a metal such as Cu or Au by a method such as sputtering or vapor deposition.

第4工程は、第8図に示すように、押圧棒7を用いた押
圧手段により異方導電性コネクタ5とF、P、C6を基
板3に押圧支持する。この工程により、従来のワイヤポ
ンディングによる接続に比べ電極4と導線9の電気的接
続が確実で強固なものとなる。
In the fourth step, as shown in FIG. 8, the anisotropically conductive connector 5 and F, P, and C6 are pressed and supported on the substrate 3 by a pressing means using a pressing rod 7. This process makes the electrical connection between the electrode 4 and the conductive wire 9 more reliable and strong than the conventional connection by wire bonding.

押圧棒7を用いた押圧支持方法の具体例として、絶縁性
を有する材料で形成された角柱や円柱状の押圧棒7を取
付金具等を用いて基板3または支持体2に固定する方法
が挙げられる。
As a specific example of a press support method using the press rod 7, there is a method in which a prismatic or cylindrical press rod 7 made of an insulating material is fixed to the substrate 3 or the support 2 using a mounting bracket or the like. It will be done.

なお、異方導電性コネクタ5とF、P、C6との押圧棒
7による押圧支持、その結果としての電気的接続は容易
かつ確実に行うことかでき、さらに配線接続の工程がt
B純化されるので光シャッタアレイの製造に費やす労力
が軽減される。
Note that the anisotropically conductive connector 5 and F, P, and C6 can be pressed and supported by the pressing rod 7, and the resulting electrical connection can be easily and reliably performed, and the process of wiring connection can be done in a timely manner.
Since B is purified, the labor required for manufacturing the optical shutter array is reduced.

押圧棒7を用いない抑圧方法の具体例としては、ガラス
板と支持体2とを対向させてF、P。
As a specific example of a suppression method that does not use the press rod 7, the glass plate and the support body 2 are faced to each other, and F and P are used.

C,6、異方導電性コネクター5および基板3をサンド
イッチする方法が挙げられる。
C.6, a method of sandwiching the anisotropically conductive connector 5 and the substrate 3 is mentioned.

第5工程は、第9図に示すように、F、P、C6の押圧
支持されていない側の端部の各導線9を支持体2):に
形成された対応する取出電極lOに接続する。
In the fifth step, as shown in FIG. 9, the respective conductive wires 9 at the ends of F, P, and C6 on the side not supported by pressure are connected to the corresponding extraction electrodes 10 formed on the support 2). .

電極10への接続方法は抑圧支持、ヒートシール等の方
法が可能である。
Possible methods for connecting to the electrode 10 include compression support, heat sealing, and the like.

第1図に示す構成の光シャッタアレイ1では、F、P、
C6が入射光の光路を妨げない位置に設置されている。
In the optical shutter array 1 having the configuration shown in FIG.
C6 is installed at a position where it does not obstruct the optical path of the incident light.

これに対して、第2図に示す構成の光シャッタアレイ1
では、支持体2に取出電極を形成−し、これにF、P、
C6の一端を接続すると、F、P、C6が入射光の光路
を妨げることとなるので、このような構成配置をとるこ
とはてきない。したがって他の任意の位置に設けられた
取出電極にF、P、C6の一端を接続することが必要と
なる。この場合でもF、P、C6は可撓性を有するので
、取出電極の設置位置に左右されることなく、容易に配
線接続をすることができる。
On the other hand, the optical shutter array 1 having the configuration shown in FIG.
Now, an extraction electrode is formed on the support 2, and F, P,
If one end of C6 is connected, F, P, and C6 will obstruct the optical path of the incident light, so such a configuration is not possible. Therefore, it is necessary to connect one end of F, P, and C6 to a lead-out electrode provided at any other position. Even in this case, since F, P, and C6 have flexibility, wiring connections can be easily made regardless of the installation position of the extraction electrode.

〈発明の効果〉 本発明の光シャッタアレイ電極の配線接続方法によれば
、異方導電性コネクタとF、P、Cを基板上にのせて押
圧支持するだけでよく、従来のように光シャッタアレイ
の各電極毎にワイヤボンディングをする必要がなく、配
線接続の手間を軽減し、配線接続時間を短縮することが
できる。
<Effects of the Invention> According to the wiring connection method of the optical shutter array electrode of the present invention, it is only necessary to place the anisotropic conductive connector and F, P, and C on the substrate and press and support them, and the optical shutter There is no need to perform wire bonding for each electrode in the array, which reduces the effort required to connect the wires and shortens the time required to connect the wires.

また、配線数が多いワイヤポンディングにおいて生じて
いた断線による歩留りの低下を防止し、良好な光シャッ
タアレイを製造することができる。
Further, it is possible to prevent a decrease in yield due to wire breakage that occurs in wire bonding with a large number of wires, and to manufacture a good optical shutter array.

さらに、異方導電性コネクタの構造上の特徴から、平面
電極や、溝型電極等、どのような種類の電極にも容易に
配線接続をすることができる。
Furthermore, due to the structural features of the anisotropically conductive connector, wiring connections can be easily made to any type of electrode, such as a flat electrode or a groove-shaped electrode.

加えて、従来電極の位置関係からワイヤボンティングが
困難または不可能であった構造の光シャッタアレイにも
、可撓性を有するF、P、Cを用いることで配線接続が
可能となり、光シャッタアレイの構造のバリエーション
を増すことかできる。
In addition, by using flexible F, P, and C wires, it is now possible to connect wires to optical shutter arrays where wire bonding was difficult or impossible due to the positional relationship of the electrodes. It is possible to increase variations in the structure of the array.

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図は、本発明の光シャッタアレイの配
線構造を示す斜視図である。 第3図は、第1図の■−■線での断面図である。 第4図は本発明で用いる異方導電性コネクタの縦断面図
である。 第5図ないし第9図は本発明の光シャッタアレイ電極の
配線接続方法の工程を示す斜視図である。 第10図および第11図は、従来の光シャッタアレイの
配線構造を示す斜視図である。 符号の説明 l・・・光シャッタアレイ、2・・・支持体、3・・・
電気光学材料製透明基板、30−・・駆動部、4・・・
電極、5・・・異方導電性コネクタ、50−・弾性絶縁
体、51−・・金属細線、6−F、P、C17・・・押
圧棒、8・・・ワイヤ、9・・・導線、10・・・取出
電極特許出願人  富上写真フィルム株式会社■ FIG、2 F I G、 3 FIG・45 と FIG、6 FIG、9
1 and 2 are perspective views showing the wiring structure of the optical shutter array of the present invention. FIG. 3 is a sectional view taken along the line ■-■ in FIG. 1. FIG. 4 is a longitudinal sectional view of the anisotropically conductive connector used in the present invention. FIGS. 5 to 9 are perspective views showing the steps of the wiring connection method for optical shutter array electrodes of the present invention. FIGS. 10 and 11 are perspective views showing the wiring structure of a conventional optical shutter array. Explanation of symbols 1... Optical shutter array, 2... Support body, 3...
Transparent substrate made of electro-optical material, 30--driving section, 4--
Electrode, 5--Anisotropic conductive connector, 50--Elastic insulator, 51--Thin metal wire, 6-F, P, C17--Press rod, 8--Wire, 9--Conducting wire , 10... Takeout electrode patent applicant Tomigami Photo Film Co., Ltd.■ FIG, 2 FIG, 3 FIG・45 and FIG, 6 FIG, 9

Claims (2)

【特許請求の範囲】[Claims] (1)電気光学材料製透明基板に複数の光シャッタ用電
極を有する光シャッタアレイの各電極に配線接続をする
に際し、前記電気光学材料製透明基板上に異方導電性コ
ネクタを設置し、その上に可撓性プリント配線コネクタ
の一端を重ねて設置し、前記可撓性プリント配線コネク
タと前記異方導電性コネクタを押圧手段によって前記電
気光学材料製透明基板に押圧支持することにより前記電
気光学材料製透明基板の各電極とこれらに対応する可撓
性プリント配線コネクタの各導線とを電気的に接続する
ことを特徴とする光シャッタアレイ電極の配線接続方法
(1) When wiring is connected to each electrode of an optical shutter array having a plurality of optical shutter electrodes on a transparent substrate made of an electro-optic material, an anisotropically conductive connector is installed on the transparent substrate made of the electro-optic material, and One end of a flexible printed wiring connector is placed on top of the electro-optical substrate, and the flexible printed wiring connector and the anisotropically conductive connector are pressed and supported by a pressing means against the transparent substrate made of electro-optic material. 1. A wiring connection method for optical shutter array electrodes, which comprises electrically connecting each electrode of a transparent substrate made of a material and each conductive wire of a flexible printed wiring connector corresponding thereto.
(2)前記電極が電気光学材料製透明基板に形成された
溝に導電物質を埋設してなるものである特許請求の範囲
第1項に記載の光シャッタアレイ電極の配線接続方法。
(2) The wiring connection method of an optical shutter array electrode according to claim 1, wherein the electrode is formed by embedding a conductive material in a groove formed in a transparent substrate made of an electro-optic material.
JP22105885A 1985-10-03 1985-10-03 Method for connecting wiring of optical shutter array electrode Pending JPS6279419A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP22105885A JPS6279419A (en) 1985-10-03 1985-10-03 Method for connecting wiring of optical shutter array electrode
US06/914,972 US4755415A (en) 1985-10-03 1986-10-03 Optical shutter array and method for making

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22105885A JPS6279419A (en) 1985-10-03 1985-10-03 Method for connecting wiring of optical shutter array electrode

Publications (1)

Publication Number Publication Date
JPS6279419A true JPS6279419A (en) 1987-04-11

Family

ID=16760832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22105885A Pending JPS6279419A (en) 1985-10-03 1985-10-03 Method for connecting wiring of optical shutter array electrode

Country Status (1)

Country Link
JP (1) JPS6279419A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5663702A (en) * 1995-06-07 1997-09-02 Littelfuse, Inc. PTC electrical device having fuse link in series and metallized ceramic electrodes
US5955936A (en) * 1995-05-10 1999-09-21 Littlefuse, Inc. PTC circuit protection device and manufacturing process for same
US7507018B2 (en) 2006-12-28 2009-03-24 Seiko Instruments Inc. Wristwatch and band for wristwatch
KR20170102260A (en) * 2014-12-30 2017-09-08 다우 아그로사이언시즈 엘엘씨 Picolinamide compounds with fungicidal activity

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5955936A (en) * 1995-05-10 1999-09-21 Littlefuse, Inc. PTC circuit protection device and manufacturing process for same
US5663702A (en) * 1995-06-07 1997-09-02 Littelfuse, Inc. PTC electrical device having fuse link in series and metallized ceramic electrodes
US7507018B2 (en) 2006-12-28 2009-03-24 Seiko Instruments Inc. Wristwatch and band for wristwatch
KR20170102260A (en) * 2014-12-30 2017-09-08 다우 아그로사이언시즈 엘엘씨 Picolinamide compounds with fungicidal activity

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