JPH0311893Y2 - - Google Patents
Info
- Publication number
- JPH0311893Y2 JPH0311893Y2 JP15752784U JP15752784U JPH0311893Y2 JP H0311893 Y2 JPH0311893 Y2 JP H0311893Y2 JP 15752784 U JP15752784 U JP 15752784U JP 15752784 U JP15752784 U JP 15752784U JP H0311893 Y2 JPH0311893 Y2 JP H0311893Y2
- Authority
- JP
- Japan
- Prior art keywords
- main body
- lid
- sealed
- refrigerant
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 12
- 239000003507 refrigerant Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 description 6
- 238000012856 packing Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 238000009835 boiling Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- IWBUYGUPYWKAMK-UHFFFAOYSA-N [AlH3].[N] Chemical compound [AlH3].[N] IWBUYGUPYWKAMK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15752784U JPH0311893Y2 (cg-RX-API-DMAC10.html) | 1984-10-18 | 1984-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15752784U JPH0311893Y2 (cg-RX-API-DMAC10.html) | 1984-10-18 | 1984-10-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6172860U JPS6172860U (cg-RX-API-DMAC10.html) | 1986-05-17 |
| JPH0311893Y2 true JPH0311893Y2 (cg-RX-API-DMAC10.html) | 1991-03-20 |
Family
ID=30715519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15752784U Expired JPH0311893Y2 (cg-RX-API-DMAC10.html) | 1984-10-18 | 1984-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311893Y2 (cg-RX-API-DMAC10.html) |
-
1984
- 1984-10-18 JP JP15752784U patent/JPH0311893Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6172860U (cg-RX-API-DMAC10.html) | 1986-05-17 |
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