JPH0311886Y2 - - Google Patents
Info
- Publication number
- JPH0311886Y2 JPH0311886Y2 JP1985011677U JP1167785U JPH0311886Y2 JP H0311886 Y2 JPH0311886 Y2 JP H0311886Y2 JP 1985011677 U JP1985011677 U JP 1985011677U JP 1167785 U JP1167785 U JP 1167785U JP H0311886 Y2 JPH0311886 Y2 JP H0311886Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- ring
- fixing jig
- insulator
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000012212 insulator Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000002161 passivation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 230000006698 induction Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Landscapes
- Thyristors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985011677U JPH0311886Y2 (US20090163788A1-20090625-C00002.png) | 1985-01-30 | 1985-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985011677U JPH0311886Y2 (US20090163788A1-20090625-C00002.png) | 1985-01-30 | 1985-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61127649U JPS61127649U (US20090163788A1-20090625-C00002.png) | 1986-08-11 |
| JPH0311886Y2 true JPH0311886Y2 (US20090163788A1-20090625-C00002.png) | 1991-03-20 |
Family
ID=30494018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985011677U Expired JPH0311886Y2 (US20090163788A1-20090625-C00002.png) | 1985-01-30 | 1985-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311886Y2 (US20090163788A1-20090625-C00002.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54144871A (en) * | 1978-05-04 | 1979-11-12 | Hitachi Ltd | Semiconducor device |
-
1985
- 1985-01-30 JP JP1985011677U patent/JPH0311886Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54144871A (en) * | 1978-05-04 | 1979-11-12 | Hitachi Ltd | Semiconducor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61127649U (US20090163788A1-20090625-C00002.png) | 1986-08-11 |
