JPH0311884Y2 - - Google Patents
Info
- Publication number
- JPH0311884Y2 JPH0311884Y2 JP1984094294U JP9429484U JPH0311884Y2 JP H0311884 Y2 JPH0311884 Y2 JP H0311884Y2 JP 1984094294 U JP1984094294 U JP 1984094294U JP 9429484 U JP9429484 U JP 9429484U JP H0311884 Y2 JPH0311884 Y2 JP H0311884Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- exterior body
- lead
- opening
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 230000000717 retained effect Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 2
- XXUXXCZCUGIGPP-ACAGNQJTSA-N 2-Hydroxy-3,5-dinitro-N-[(1Z)-(5-nitrofuran-2-yl)methylidene]benzene-1-carbohydrazonic acid Chemical compound C1=C([N+]([O-])=O)C=C([N+]([O-])=O)C(O)=C1C(=O)N\N=C/C1=CC=C([N+]([O-])=O)O1 XXUXXCZCUGIGPP-ACAGNQJTSA-N 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- -1 polyphenylene Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9429484U JPS619832U (ja) | 1984-06-23 | 1984-06-23 | チツプ形電解コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9429484U JPS619832U (ja) | 1984-06-23 | 1984-06-23 | チツプ形電解コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS619832U JPS619832U (ja) | 1986-01-21 |
| JPH0311884Y2 true JPH0311884Y2 (de) | 1991-03-20 |
Family
ID=30652724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9429484U Granted JPS619832U (ja) | 1984-06-23 | 1984-06-23 | チツプ形電解コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619832U (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2720390B2 (ja) * | 1988-04-15 | 1998-03-04 | 日本ケミコン株式会社 | チップ形コンデンサ |
| US5420748A (en) * | 1993-03-31 | 1995-05-30 | Samsung Electro-Mechanics Co., Ltd. | Surface mounting type chip capacitor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030530B2 (ja) * | 1978-09-28 | 1985-07-17 | ザ グツドイア− タイヤ アンド ラバ− コンパニ− | フイラ−ネツクホ−ス用マンドレル組立体 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030530U (ja) * | 1983-08-03 | 1985-03-01 | 信英通信工業株式会社 | コンデンサ |
| JPS60183431U (ja) * | 1984-05-14 | 1985-12-05 | マルコン電子株式会社 | チツプ形アルミニウム電解コンデンサ |
-
1984
- 1984-06-23 JP JP9429484U patent/JPS619832U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030530B2 (ja) * | 1978-09-28 | 1985-07-17 | ザ グツドイア− タイヤ アンド ラバ− コンパニ− | フイラ−ネツクホ−ス用マンドレル組立体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS619832U (ja) | 1986-01-21 |
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