JPH03116743A - Bonding apparatus - Google Patents

Bonding apparatus

Info

Publication number
JPH03116743A
JPH03116743A JP25417889A JP25417889A JPH03116743A JP H03116743 A JPH03116743 A JP H03116743A JP 25417889 A JP25417889 A JP 25417889A JP 25417889 A JP25417889 A JP 25417889A JP H03116743 A JPH03116743 A JP H03116743A
Authority
JP
Japan
Prior art keywords
window
crossline
pad
size
aligned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25417889A
Other languages
Japanese (ja)
Inventor
Katsumi Eguchi
Original Assignee
Nec Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Kyushu Ltd filed Critical Nec Kyushu Ltd
Priority to JP25417889A priority Critical patent/JPH03116743A/en
Publication of JPH03116743A publication Critical patent/JPH03116743A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square

Abstract

PURPOSE: To eliminate an irregularity in an aligning point by providing a window for arbitrarily altering a size at the periphery of a crossline of a watching monitor.
CONSTITUTION: Since a square-shaped window 3a to be arbitrarily altered in size on a watching monitor and a crossline 4 indicating its central position are provided, the size of the window 3 is matched to a pad 2 on a pellet 1 to be aligned thereby to move the crossline 4 accurately to the central position of the pad 2. Or, the size of the window 3a is so varied that the four corners of the pad 2 are brought into contact with the circular window 3a to match the crossline 4 to the center of the pad 2 to be aligned, thereby further improving its accuracy.
COPYRIGHT: (C)1991,JPO&Japio
JP25417889A 1989-09-28 1989-09-28 Bonding apparatus Pending JPH03116743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25417889A JPH03116743A (en) 1989-09-28 1989-09-28 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25417889A JPH03116743A (en) 1989-09-28 1989-09-28 Bonding apparatus

Publications (1)

Publication Number Publication Date
JPH03116743A true JPH03116743A (en) 1991-05-17

Family

ID=17261317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25417889A Pending JPH03116743A (en) 1989-09-28 1989-09-28 Bonding apparatus

Country Status (1)

Country Link
JP (1) JPH03116743A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102653115A (en) * 2011-03-04 2012-09-05 三星钻石工业股份有限公司 Ruling device and ruling method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102653115A (en) * 2011-03-04 2012-09-05 三星钻石工业股份有限公司 Ruling device and ruling method

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