JPH03116743A - Bonding apparatus - Google Patents

Bonding apparatus

Info

Publication number
JPH03116743A
JPH03116743A JP25417889A JP25417889A JPH03116743A JP H03116743 A JPH03116743 A JP H03116743A JP 25417889 A JP25417889 A JP 25417889A JP 25417889 A JP25417889 A JP 25417889A JP H03116743 A JPH03116743 A JP H03116743A
Authority
JP
Japan
Prior art keywords
window
pad
size
crossline
cross line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25417889A
Other languages
Japanese (ja)
Inventor
Katsumi Eguchi
江口　克己
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP25417889A priority Critical patent/JPH03116743A/en
Publication of JPH03116743A publication Critical patent/JPH03116743A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Abstract

PURPOSE:To eliminate an irregularity in an aligning point by providing a window for arbitrarily altering a size at the periphery of a crossline of a watching monitor. CONSTITUTION:Since a square-shaped window 3a to be arbitrarily altered in size on a watching monitor and a crossline 4 indicating its central position are provided, the size of the window 3 is matched to a pad 2 on a pellet 1 to be aligned thereby to move the crossline 4 accurately to the central position of the pad 2. Or, the size of the window 3a is so varied that the four corners of the pad 2 are brought into contact with the circular window 3a to match the crossline 4 to the center of the pad 2 to be aligned, thereby further improving its accuracy.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はボンディング装置に関し、特にパッドのボンデ
ィング座標の目合せ機構に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bonding apparatus, and more particularly to a mechanism for aligning bonding coordinates of pads.

〔従来の技術〕[Conventional technology]

従来、この種のボンディング装置は、監視用モニターの
クロスラインのみをパッドのボンディング座標の目合せ
機構として有していた。Conventionally, this type of bonding apparatus has had only the cross line of the monitoring monitor as a mechanism for aligning the bonding coordinates of the pads.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のボンディング装置は監視モニターのクロ
スラインのみをパッドのボンディング座標の目合せ機構
として有しているので、クロスラインをパッドの中心に
正確に合せるのが困難であり、また人によりクロスライ
ンによるパッドの目合せ位置に差が生じるという欠点が
ある。The conventional bonding equipment described above has only the cross line on the monitoring monitor as a mechanism for aligning the bonding coordinates of the pad, so it is difficult to accurately align the cross line with the center of the pad, and it is difficult for people to align the cross line with the center of the pad. There is a disadvantage that there is a difference in the alignment position of the pads.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のボンディング装置は、監視モニターに任意に大
きさを変更できるウィンドウ及びウィンドウの中心を示
すクロスラインを有している。The bonding apparatus of the present invention has a window whose size can be arbitrarily changed on a monitoring monitor and a cross line indicating the center of the window.

〔実施例〕〔Example〕

次に本発明について図面を用いて説明する。 Next, the present invention will be explained using the drawings.

第１図は本発明の一実施例を示す平面図である。FIG. 1 is a plan view showing one embodiment of the present invention.

監視モニター上で大きさを任意に変更できる正方形のウ
ィンドウ３ａとその中心位置を示すクロスライン４を有
している。目合せをするペレット１上のパッド２にウィ
ンドウ３の大きさを合せること−により、クロスライン
４は正確にパッド２の中心位置にくる。It has a square window 3a whose size can be arbitrarily changed on the monitoring monitor and a cross line 4 indicating the center position of the square window 3a. By matching the size of the window 3 to the pad 2 on the pellet 1 to be aligned, the cross line 4 is accurately centered on the pad 2.

第２図は本発明の実施例２を示す平面図である。FIG. 2 is a plan view showing a second embodiment of the present invention.

この実施例は、円形のウィンドウ３ｂを有している。パ
ッド２の４隅がウィンドウ３ａに接するようにウィンド
ウ３ａの大きさを変化させて、クロスライン４をパッド
２の中心に合せることにより、目合せを行うことができ
、−層精度が向上する利点がある。This embodiment has a circular window 3b. By changing the size of the window 3a so that the four corners of the pad 2 are in contact with the window 3a and aligning the cross line 4 with the center of the pad 2, alignment can be performed, and - the advantage of improving layer accuracy. There is.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、パッドの大きさに合うよ
うに変更が可能なウィンドウを有しているので、クロス
ラインが正確にパッドの中心にくるため、目合せ点のバ
ラツキが無くなるという効果がある。As explained above, since the present invention has a window that can be changed to match the size of the pad, the cross line is accurately centered on the pad, which has the effect of eliminating variations in alignment points. There is.

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第２図はそれぞれ本発明のボンディング装置の
実施例１．実施例２を示す平面図であり、第３図は従来
のボンディング装置を示す平面である。 １・・・ペレット、２・・・パッド、３ａ、３ｂ・・・
ウィンドウ、 ４・・・クロスライン。Embodiment 1 of the bonding apparatus of the present invention is shown in FIGS. 1 and 2, respectively. FIG. 3 is a plan view showing a second embodiment, and FIG. 3 is a plan view showing a conventional bonding apparatus. 1... Pellet, 2... Pad, 3a, 3b...
Window, 4...Cross line.

Claims (1)

【特許請求の範囲】[Claims] 監視用モニターのクロスラインの周囲に任意に大きさを
変更することのできるウィンドウを有することを特徴と
するボンディング装置。A bonding device characterized by having a window whose size can be arbitrarily changed around a cross line of a monitoring monitor.
JP25417889A 1989-09-28 1989-09-28 Bonding apparatus Pending JPH03116743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25417889A JPH03116743A (en) 1989-09-28 1989-09-28 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25417889A JPH03116743A (en) 1989-09-28 1989-09-28 Bonding apparatus

Publications (1)

Publication Number Publication Date
JPH03116743A true JPH03116743A (en) 1991-05-17

Family

ID=17261317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25417889A Pending JPH03116743A (en) 1989-09-28 1989-09-28 Bonding apparatus

Country Status (1)

Country Link
JP (1) JPH03116743A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102653115A (en) * 2011-03-04 2012-09-05 三星钻石工业股份有限公司 Ruling device and ruling method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102653115A (en) * 2011-03-04 2012-09-05 三星钻石工业股份有限公司 Ruling device and ruling method

Similar Documents

Publication Publication Date Title
JPH03116743A (en) Bonding apparatus
JPS62149149A (en) Semiconductor device
JPS62285001A (en) Measuring method of lens shape
JPH05326Y2 (en)
JPS6093980U (en) Radiation contamination measuring device
JPS5558428A (en) Photoelastic device
JPH025365Y2 (en)
JPH01281745A (en) Sticking device for electronic element
JPS58182109U (en) Angle measuring device
JPS595472Y2 (en) Reference pin
JPS5815351U (en) Semiconductor inspection equipment
JPS5938440U (en) ComFormSlide original plate alignment device
JPH0263530U (en)
JPS63155006U (en)
JPH0193732U (en)
JPS5395586A (en) Manufacture for semiconductor element
JPS6322736U (en)
JPS5921709U (en) Turntable parallelism measuring device
JPH04100236A (en) Manufacture of semiconductor device
JPH05267365A (en) Ic package alignment device
JPH02133607U (en)
JPS5920142U (en) Electrode plate arrangement inspection device for ionization chamber radiation detector
JPH0269954A (en) Semiconductor device
JPS5835263U (en) Formed mask distortion detection device
JPS5314566A (en) Assembling method of cap sealed type semiconductor device