JPH0311640A - Package for electronic component - Google Patents
Package for electronic componentInfo
- Publication number
- JPH0311640A JPH0311640A JP14578589A JP14578589A JPH0311640A JP H0311640 A JPH0311640 A JP H0311640A JP 14578589 A JP14578589 A JP 14578589A JP 14578589 A JP14578589 A JP 14578589A JP H0311640 A JPH0311640 A JP H0311640A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- base
- brazing
- package
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 abstract description 11
- 230000005499 meniscus Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 2
- 230000005484 gravity Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000000945 filler Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3205—Shape
- H01L2224/32057—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、高周波半導体素子とその付属品などの複数の
電子部品をまとめて収容する電子部品用パッケージ（以
下、４１にパッケージという）に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an electronic component package (hereinafter referred to as 41 package) that collectively accommodates a plurality of electronic components such as a high frequency semiconductor element and its accessories.
［従来の技術］
上記パッケージとして、従来より、コバール（Ｆｅ−Ｎ
ｉ−Ｃｏ合金）、銅などからなるパッケージのベース上
に、高周波半導体素子等のＩＣチップと該チップ用の整
合回路を備えたサブキャリアとを、近接させた状態で、
実装するようにして用いるパッケージがある。[Prior Art] Kovar (Fe-N) has conventionally been used as the above package.
An IC chip such as a high-frequency semiconductor element and a subcarrier equipped with a matching circuit for the chip are placed close to each other on the base of a package made of copper, etc. (i-Co alloy), copper, etc.
There is a package that can be used to implement it.
このパッケージにおいては、ＩＣチップの熱放散性を高
めたり、ＩＣチップとサブキャリアとの高さやその熱膨
張係数を一致させたりなどするために、ベース上に、Ｃ
ｕ−Ｗ合金などの金属製のステージをろう付けして、そ
のステージ」二に上記ＩＣチップを搭載している。In this package, in order to improve the heat dissipation of the IC chip and to match the height and thermal expansion coefficient of the IC chip and subcarrier, a carbon
A metal stage made of u-w alloy or the like is brazed, and the above-mentioned IC chip is mounted on the stage.
［発明が解決しようとする課題］
ところで、上記ステージをベース」二にろう付けした場
合は、ろう材がステージの周囲側面とベース表面とに亙
りメニスカス形状を描いて付着した状態となった。そし
て、ステージ近くのベース」二にサブキャリアを実装し
た場合に、上記メニスカス形状を描いて付着したステー
ジの周囲側面のろう材が邪魔をして、サブキャリアをス
テージに近接させてベース上に実装できなかった。[Problems to be Solved by the Invention] By the way, when the stage was brazed to the base, the brazing material was adhered in a meniscus shape over the peripheral side surface of the stage and the surface of the base. When the subcarrier is mounted on the base 2 near the stage, the brazing metal on the side surface around the stage, which is attached in the meniscus shape described above, gets in the way, and the subcarrier is mounted close to the stage on the base. could not.
そのため、上記パッケージでは、そのベース上にＩＣチ
ップとサブキャリアとを近接させた状態で高密度に実装
できなかったとともに、ＩＣチップとサブキャリアとを
接続するワイヤが長くなって、ＩＣチップとサブキャリ
アとの接続箇所における高周波信号の特性インピーダン
スのマツチングを良好に行えなかった。Therefore, in the above package, the IC chip and the subcarrier could not be mounted on the base with high density in close proximity, and the wires connecting the IC chip and the subcarrier became long. It was not possible to satisfactorily match the characteristic impedance of the high frequency signal at the connection point with the carrier.
なお、上記難点を解消する目的で、従来より、ステージ
の周囲下端縁を面取りしたり、ステージの周囲側面にろ
う付は用のニッケルめっきなどのめっきを施さないよう
にしたりして、ステージの周囲側面にろう材が這い上が
るのを防ぐようにすることが行われている。In order to solve the above-mentioned problems, conventional methods have been used, such as chamfering the lower edge of the stage periphery and not applying plating such as nickel plating for brazing on the side surfaces of the stage. Efforts are being made to prevent the filler metal from creeping up the sides.
しかしながら、そのようにしても、ろう材がステージの
周囲側面とベース表面との間にメニスカス形状を描いて
付着するのを完全に防止できなかった。However, even with this method, it was not possible to completely prevent the brazing filler metal from adhering in a meniscus shape between the peripheral side surface of the stage and the base surface.
本発明は、かかる課題に鑑みてなされたもので、その目
的は、ろう材をステージの周囲側面とベース表面との間
にメニスカス形状を描いて付着させずに、ステージをベ
ース」二にろう付けすることを可能とするパッケージを
提供することにある。The present invention has been made in view of such problems, and its purpose is to braze the stage to the base without causing the brazing metal to form a meniscus shape between the peripheral side surface of the stage and the base surface. Our goal is to provide a package that allows you to do this.
［課題を解決するための手段］
上記目的のために、本発明の第１のパッケージは、ベー
ス表面にステージの下部を嵌入可能な凹部を形成すると
ともに、その凹部の開口部周縁をえくってその開口部周
縁にろう材溜り部を形成して、その凹部に前記ステージ
の下部を嵌入した状態で、前記ステージを前記ベース」
二にろう付けしてなることを特徴としている。[Means for Solving the Problems] For the above purpose, the first package of the present invention has a recess formed in the base surface into which the lower part of the stage can be inserted, and the periphery of the opening of the recess is hollowed out. A brazing material reservoir is formed around the opening, and with the lower part of the stage fitted into the recess, the stage is attached to the base.
It is characterized by being made by brazing the two parts.
またそれとともに、上記構成の第１のパッケージにおい
ては、凹部を、ステージの下部をベース上に動かぬよう
に嵌入可能な大きさに形成することを好適としている。Additionally, in the first package having the above configuration, it is preferable that the recess is formed in a size that allows the lower part of the stage to be fitted onto the base without moving.
また、本発明の第２のパッケージは、ベース表面にリン
グ状をしたろう材溜り部用の溝を形成して、ステージを
、その周囲を前記溝上方に突出させた状態で、前記ベー
ス−ににろう付けしてなることを特徴としている。Further, in the second package of the present invention, a ring-shaped groove for a brazing material reservoir is formed on the base surface, and the stage is attached to the base with the periphery thereof protruding above the groove. It is characterized by being made by brazing.
「作用１
上記構成の第１、第２のパッケージにおいては、ステー
ジをベース上にろう付けする際に、ステージの周囲側面
に這い上がろうとするろう材が、そのろう材が受ける重
力作用やベース表面の凹部の開口部周縁のろう材溜り部
内またはベース表面のリング状をしたろう材溜り部用の
溝内に溜ったろう材から受ける表面張力作用により、そ
の開口部周縁のろう材溜り部、またはリング状をしたろ
う材溜り部用の溝に落下して、ステージの周囲側面とベ
ース表面との間にろう材がメニスカス形状を描いて付着
することがない。Effect 1 In the first and second packages with the above configuration, when the stage is brazed onto the base, the brazing material that tries to climb up the side surfaces around the stage is affected by the gravitational action on the brazing material and the base. Due to the surface tension effect from the brazing material accumulated in the brazing material reservoir around the opening of the recess on the surface or in the ring-shaped brazing material reservoir groove on the base surface, the brazing material reservoir around the opening, or The brazing material does not fall into the ring-shaped groove for the brazing material reservoir and adhere in a meniscus shape between the peripheral side surface of the stage and the base surface.
また、凹部を、ステージの下部をベース上に動かぬよう
に嵌入可能な大きさに形成した第１のパッケージにあっ
ては、その凹部にステージの下部を嵌入することにより
、ステージをベース上の所定位置に位置決めてきる。In addition, in the first package in which the recess is formed to a size that allows the lower part of the stage to be inserted onto the base without moving, the lower part of the stage can be inserted into the recess to allow the stage to be placed on the base. It will be positioned at the specified position.
［実施例］ 次に、本発明の実施例を図面に従い説明する。[Example] Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の第１のパッケージの好適な実施例を示
し、詳しくは、その一部拡大正面断面図を示す。以下、
この図中の実施例を説明する。FIG. 1 shows a preferred embodiment of the first package of the present invention, and specifically shows a partially enlarged front sectional view thereof. below,
The embodiment shown in this figure will be explained.
図において、１０は、パッケージの底部を形成しぞいる
コバール、銅などからなるベースである。In the figure, 10 is a base made of Kovar, copper, etc. that forms the bottom of the package.
１６は、Ｃｕ−Ｗ合金などからなる方形状をしたＩＣチ
ップ２２搭載用のステージである。Reference numeral 16 denotes a rectangular stage made of Cu-W alloy or the like for mounting the IC chip 22.
上記ベース１０表面には、上記ステージＩ６の下部を嵌
入可能な方形盲穴状をした凹部１２を形成している。A rectangular blind hole-shaped recess 12 into which the lower part of the stage I6 can be inserted is formed on the surface of the base 10.
またそれとともに、上記凹部１２の上端開口部周縁を、
第１図に示したように凹部１２内側に向けて斜め下方に
断面直線状にえぐって、その上端開口部周縁にろう材溜
り部１４を形成している。At the same time, the periphery of the upper end opening of the recess 12 is
As shown in FIG. 1, the recess 12 is hollowed out diagonally downward in a linear cross-section to form a brazing material reservoir 14 at the periphery of the upper opening.
なお、ろう材溜り部１４は、」１記凹部１２の−Ｌ端開
口部周縁を、第２図に示したように断面段差状にえぐっ
たり、第３図に示したように断面弧状にえくったりして
、形成しても良い。The brazing material reservoir 14 is formed by hollowing out the periphery of the -L end opening of the recess 12 so that it has a stepped cross section as shown in FIG. 2, or an arcuate cross section as shown in FIG. You can also knead it and form it.
また、図のパッケージでは、ベース１０表面の凹部１２
を、ステージ１６の下部をベース１０上にその前後、左
右等に動かぬように嵌入可能な大きさに形成している。In addition, in the illustrated package, the recess 12 on the surface of the base 10
is formed in a size that allows the lower part of the stage 16 to be fitted onto the base 10 without moving forward, backward, left or right, etc.
具体的には、」１記凹部１２を、ステージ１６の下部周
囲の全体を隙間なく嵌入可能な大きさに形成していて、
上記凹部１２にステージ１６の下部を嵌入することによ
り、ステージ１６をベース１０上の所定位置に動かぬよ
うに位置決めてきるようにしている。Specifically, the recess 12 is formed to a size that allows the entire lower part of the stage 16 to be inserted thereinto without any gaps;
By fitting the lower part of the stage 16 into the recess 12, the stage 16 can be fixedly positioned at a predetermined position on the base 10.
なお、上記凹部１２は、ステージ１６の下部周囲の四方
の一部を隙間なく嵌入可能な大きさに形成して、その凹
部１２にステージ１６の下部を嵌入することにより、ス
テージＩ６をベース１０上の所定位置に動かぬように位
置決めできるようにしても良い。Note that the recess 12 is formed to a size that allows the stage 16 to fit into the four sides around the lower part without any gaps, and by fitting the lower part of the stage 16 into the recess 12, the stage I6 can be placed on the base 10. It may also be possible to position it in a predetermined position so as not to move.
そして、ステージ１６の下部をベース１０表面の凹部１
２に隙間なく嵌入して、ステージ１６をベース１０１に
位置決めした状態で、−に記ろう材部り部１４内からス
テージ１６の下部周囲と凹部１２内周面との間にろう材
１８を充填することにより、ステージ１６をベース１０
上にろう付けしている。Then, the lower part of the stage 16 is inserted into the recess 1 on the surface of the base 10.
2 without any gaps, and with the stage 16 positioned on the base 101, fill the space between the lower part of the stage 16 and the inner peripheral surface of the recess 12 from within the filler metal portion 14 indicated by -. By doing this, stage 16 becomes base 10
It is brazed on top.
第１図に示した第１のパンケージは以」−のように構成
していて、ステージ１６をベース１０」二にろう付けし
た際に、ろう材１８がステージ１６の周囲側面にメニス
カス形状を描いて這い上がることがない。The first pancage shown in FIG. 1 is constructed as follows, and when the stage 16 is brazed to the base 10, the brazing filler metal 18 forms a meniscus shape on the side surface around the stage 16. I never crawl up.
第４図は上述実施例に類似する本発明の第１のパッケー
ジの好適な実施例を示し、詳しくは、その一部拡大正面
断面図を示す。以下、この図中の実施例を説明する。FIG. 4 shows a preferred embodiment of the first package of the present invention similar to the embodiments described above, and in particular shows a partially enlarged front sectional view thereof. The embodiment shown in this figure will be described below.
図のパッケージでは、ベース１０表面に形成した四部Ｉ
２の開口部周縁を、第４図に示したように、四部１２内
底面に達する深さまで、凹部１２内側に向けて斜め下方
に断面直線状に大きくえぐって、その開口部周縁にろう
材部り部１４を形成している。In the package shown in the figure, the four parts I formed on the surface of the base 10 are
As shown in FIG. 4, the periphery of the opening of No. 2 is hollowed out in a straight cross-section diagonally downward toward the inside of the recess 12 to a depth that reaches the inner bottom surface of the fourth part 12, and a brazing material portion is placed around the periphery of the opening. A curved portion 14 is formed.
なお、上記ろう材部り部１４は、凹部１２の開口部周縁
を、垂直下方に向けて断面直線状にえぐ７〜
ったり、凹部１２内側に向けて断面弧状にえぐったりし
て、形成しても良い。The brazing material portion 14 is formed by hollowing out the periphery of the opening of the recess 12 vertically downward to have a linear cross section, or by hollowing out an arcuate cross section toward the inside of the recess 12. It's okay.
そして、ベース１０表面の凹部１２を、その凹部にステ
ージ１６の下部を嵌入した状態て、ステージ１６の下部
周囲側面と凹部１２内側面との間に隙間かあくように形
成していて、ベース１０表面の凹部１２を、ステージ位
置決め用の孔に兼用させずに、専らステージ１６の周囲
側面にろう材１８が這い」二がるのを防くろう材部り部
１４用に形成している。The recess 12 on the surface of the base 10 is formed so that when the lower part of the stage 16 is fitted into the recess, there is a gap between the lower peripheral side surface of the stage 16 and the inner surface of the recess 12. The recessed part 12 on the surface is not used also as a hole for positioning the stage, but is formed exclusively as a brazing filler metal part 14 to prevent the brazing filler metal 18 from creeping on the peripheral side surface of the stage 16.
その他の構成およびその作用は、既述実施例の第１のパ
ッケージと同様であり、その説明を省略する。The other configurations and their functions are the same as those of the first package of the previously described embodiments, and their explanations will be omitted.
第５図は、本発明の第２のパッケージの好適な実施例を
示し、詳しくは、その一部拡大正面断面図を示す。以下
、この図中の実施例を説明する。FIG. 5 shows a preferred embodiment of the second package of the present invention, and specifically shows a partially enlarged front sectional view thereof. The embodiment shown in this figure will be described below.
図のパッケージでは、方形状をしたステージ１６周囲の
大きさに合わせて、ベース１０表面に方形リング状をし
たろう材部り部用の溝２０を形成している。In the illustrated package, a rectangular ring-shaped groove 20 for the brazing material portion is formed on the surface of the base 10 in accordance with the size of the periphery of the rectangular stage 16.
ここで、図では、上記溝２０の断面形状を弧状に形成し
ているが、その断面形状をコの字状やＶ字状などに形成
しても良い。Here, in the figure, the cross-sectional shape of the groove 20 is formed into an arc shape, but the cross-sectional shape may be formed into a U-shape, a V-shape, or the like.
そして、ステージ１６の周囲を」−記ベース表面の溝２
０上方に突出させた状態で、」１記方形リング状をした
溝２０内から該溝に囲まれたベース１０表面とステージ
１６下面との間にろう材１８を充填することにより、ス
テージ１６を上記方形リング状をした溝２０て囲まれた
ベース１０」二にろう付けしている。Then, around the stage 16, the groove 2 on the base surface is
The stage 16 is made by filling the space between the surface of the base 10 surrounded by the groove 20 and the lower surface of the stage 16 from within the rectangular ring-shaped groove 20 with the brazing material 18 protruding upward. The base 10, which is surrounded by the rectangular ring-shaped groove 20, is brazed to the second base.
第５図に示したパッケージは以上のように構成していて
、その作用は、既述実施例の第１のパッケージと同様で
あり、その説明を省略する。The package shown in FIG. 5 is constructed as described above, and its operation is the same as that of the first package of the previously described embodiment, so a description thereof will be omitted.
Ｕ発明の効果１
以上説明したように、本発明の第１、第２のパッケージ
によれば、ろう材をステージの周囲側面とベース表面と
の間にメニスカス形状を描いて付着させずに、ステージ
をベース上にろう付けできる。U Effect of the Invention 1 As explained above, according to the first and second packages of the present invention, the brazing filler metal is not attached to the stage in a meniscus shape between the peripheral side surface of the stage and the base surface. can be brazed onto the base.
そして、ＩＣチップ等の電子部品を搭載したステージ近
くのベース」二に、整合回路を備えたサブキャリア等の
電子部品を、近接させた状態で、高密度に実装できると
ともに、その近接させた状態で実装した電子部品間を短
いワイヤで接続して、その両型子部品間の接続箇所にお
ける高周波信号の特性インピーダンスのマツチングを良
好に行える。Second, electronic components such as subcarriers equipped with matching circuits can be mounted in close proximity to the base near the stage on which electronic components such as IC chips are mounted. By connecting the electronic components mounted with a short wire using a short wire, the characteristic impedance of the high frequency signal at the connection point between both mold components can be well matched.
また、凹部を、ステージの下部をベース上に動かぬよう
に嵌入可能な大きさに形成した第１のパッケージにあっ
ては、その四部にステージの下部を嵌入するだけで、ス
テージをベース上の所定位置に位置決めでき、ステージ
をベース上にろう付けする際のステージの位置決め作業
の容易化が図れる。In addition, in the first package, where the recess is formed to a size that allows the lower part of the stage to be inserted onto the base without moving, the stage can be placed on the base by simply inserting the lower part of the stage into the four parts. The stage can be positioned at a predetermined position, and the work of positioning the stage when brazing the stage onto the base can be facilitated.
第１図は本発明の第１の電子部品用パッケージの一部拡
大正面断面図、第２図と第３図はそれぞれ本発明の第１
の電子部品用パッケージのベースの凹部周辺の拡大正面
断面図、第４図は本発明の他の第１の電子部品用パッケ
ージの一部拡大正面断面図、第５図は本発明の第２の電
子部品用パッケージの一部拡大正面断面図である。
１０・・ベース、 １２・・・四部、１４・・・ろう
材部り部、 １６・・・ステージ、１８・・・ろう材
、 ２０・・・溝。FIG. 1 is a partially enlarged front sectional view of the first electronic component package of the present invention, and FIGS. 2 and 3 are respectively the first package of the present invention.
FIG. 4 is a partially enlarged front sectional view of another first electronic component package of the present invention, and FIG. FIG. 2 is a partially enlarged front sectional view of the electronic component package. DESCRIPTION OF SYMBOLS 10... Base, 12... Four parts, 14... Brazing metal part, 16... Stage, 18... Brazing metal, 20... Groove.
Claims (1)
成するとともに、その凹部の開口部周縁をえぐってその
開口部周縁にろう材溜り部を形成して、その凹部に前記
ステージの下部を嵌入した状態で、前記ステージを前記
ベース上にろう付けしてなる電子部品用パッケージ。 ２、凹部を、ステージの下部をベース上に動かぬように
嵌入可能な大きさに形成した請求項１記載の電子部品用
パッケージ。 ３、ベース表面にリング状をしたろう材溜り部用の溝を
形成して、ステージを、その周囲を前記溝上方に突出さ
せた状態で、前記ベース上にろう付けしてなる電子部品
用パッケージ。[Claims] 1. A recess into which the lower part of the stage can be inserted is formed on the base surface, and the periphery of the opening of the recess is scooped out to form a brazing material reservoir at the periphery of the opening. An electronic component package, in which the stage is brazed onto the base with the lower part of the stage fitted. 2. The electronic component package according to claim 1, wherein the recess is formed in a size that allows the lower part of the stage to be fitted onto the base without moving. 3. An electronic component package in which a ring-shaped groove for a brazing material reservoir is formed on the base surface, and the stage is brazed onto the base with its periphery protruding above the groove. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14578589A JPH0311640A (en) | 1989-06-08 | 1989-06-08 | Package for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14578589A JPH0311640A (en) | 1989-06-08 | 1989-06-08 | Package for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0311640A true JPH0311640A (en) | 1991-01-18 |
Family
ID=15393105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14578589A Pending JPH0311640A (en) | 1989-06-08 | 1989-06-08 | Package for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311640A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201893A (en) * | 1995-01-31 | 1995-08-04 | Sony Corp | Semiconductor device |
| CN105190855A (en) * | 2013-03-13 | 2015-12-23 | 丰田自动车株式会社 | Semiconductor device |
-
1989
- 1989-06-08 JP JP14578589A patent/JPH0311640A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201893A (en) * | 1995-01-31 | 1995-08-04 | Sony Corp | Semiconductor device |
| CN105190855A (en) * | 2013-03-13 | 2015-12-23 | 丰田自动车株式会社 | Semiconductor device |
| JPWO2014141399A1 (en) * | 2013-03-13 | 2017-02-16 | トヨタ自動車株式会社 | Semiconductor device |
| CN105190855B (en) * | 2013-03-13 | 2017-09-19 | 丰田自动车株式会社 | Semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4699353B2 (en) | Alternative FLMP package design and package manufacturing method | |
| US5673730A (en) | Form tooling and method of forming semiconductor package leads | |
| KR100336080B1 (en) | Semiconductor device and manufacturing method thereof | |
| GB2282484A (en) | A molded carrier ring leadframe having a corner resin injecting area | |
| US8524531B2 (en) | System and method for improving solder joint reliability in an integrated circuit package | |
| JP2004022862A (en) | Semiconductor device | |
| US6501160B1 (en) | Semiconductor device and a method of manufacturing the same and a mount structure | |
| JPH04229643A (en) | High-frequency power semiconductor device and its manufacture | |
| EP1187197A2 (en) | Package for a semiconductor chip with a thermally conductive base and resin walls | |
| US6498394B1 (en) | IC packages with diamond substrate thermal conductor | |
| KR100429319B1 (en) | Method for making an electronic component having an organic substrate | |
| JPH0621321A (en) | Integrated circuit device provided with support body for mounting of electronic component | |
| KR100431031B1 (en) | Semiconductor chip mounting method | |
| JPH0311640A (en) | Package for electronic component | |
| US5859477A (en) | Apparatus for encapsulating IC packages with diamond substrate thermal conductor | |
| US6958536B2 (en) | Microelectronic packages having rail along portion of lid periphery | |
| EP0845801B1 (en) | Process for manufacturing a plastic package for electronic devices having an heat dissipator | |
| JPH0473297B2 (en) | ||
| JP2001358442A (en) | Mount structure of semiconductor package | |
| TWI249834B (en) | Semiconductor device and its manufacturing method | |
| JPH0311607A (en) | Fitting structure of lead of electronic device | |
| US20240090130A1 (en) | Leadframe mounting with lead insertion for lead wall bonding | |
| JPS61214548A (en) | Tape carrier | |
| CN116666312A (en) | Ceramic semiconductor device package | |
| EP0620594A2 (en) | Semiconductor device having mounting terminals |